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Han Wang Phones & Addresses

  • Fremont, CA
  • Lincoln, NE
  • West Lafayette, IN

Professional Records

Lawyers & Attorneys

Han Wang Photo 1

Han Wang - Lawyer

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ISLN:
1001252390
Admitted:
2022

Business Records

Name / Title
Company / Classification
Phones & Addresses
Han Wang
Software Developer
Structural Wealth Management
Management Services
50 California St, San Francisco, CA 94111
Han Wang
President
GREAT SUCCESS ENTERPRISE, INC
1179 Park Ave #G, Alameda, CA 94501

Publications

Us Patents

Method For Fabricating Chamber Parts

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US Patent:
20230047031, Feb 16, 2023
Filed:
Oct 31, 2022
Appl. No.:
17/977019
Inventors:
- Santa Clara CA, US
David W. GROECHEL - Los Altos Hills CA, US
Han WANG - Palo Alto CA, US
International Classification:
C23C 16/56
H01J 37/34
C23C 16/40
H01J 37/32
Abstract:
One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Surface Profiling And Texturing Of Chamber Components

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US Patent:
20230023764, Jan 26, 2023
Filed:
Dec 15, 2020
Appl. No.:
17/786520
Inventors:
- Santa Clara CA, US
Michael R. RICE - Pleasanton CA, US
Gang Grant PENG - Santa Clara CA, US
Rui CHENG - San Jose CA, US
Zubin HUANG - Santa Clara CA, US
Han WANG - Redwood City CA, US
Karthik JANAKIRAMAN - San Jose CA, US
Diwakar KEDLAYA - Santa Clara CA, US
Paul L. BRILLHART - Pleasanton CA, US
Abdul Aziz KHAJA - San Jose CA, US
International Classification:
H01L 21/285
H01L 21/67
Abstract:
Methods and apparatus for surface profiling and texturing of chamber components for use in a process chamber, such surface-profiled or textured chamber components, and method of use of same are provided herein. In some embodiments, a method includes measuring a parameter of a reference substrate or a heated pedestal using one or more sensors and modifying a surface of a chamber component physically based on the measured parameter.

Methods Of Increasing The Deformability Of Ceramic Materials And Ceramic Materials Made Thereby

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US Patent:
20210276880, Sep 9, 2021
Filed:
Mar 6, 2020
Appl. No.:
16/811894
Inventors:
- West Lafayette IN, US
Haiyan Wang - West Lafayette IN, US
Jin Li - West Lafayette IN, US
Jaehun Cho - West Lafayette IN, US
Xin Li Phuah - West Lafayette IN, US
Han Wang - Richland WA, US
International Classification:
C01G 23/08
Abstract:
Methods of increasing the deformability of ceramic materials, as a nonlimiting example, titanium dioxide, particularly through the introduction of defects, and to ceramic materials produced by such methods. Such a method increases the deformability of a ceramic material by introducing high-density pre-existing defects and oxygen vacancies in the ceramic material during a flash sintering process and then forming nano scale stacking faults and nanotwins in the ceramic material. Such a ceramic material contains high-density pre-existing defects and oxygen vacancies and nano scale stacking faults and nanotwins, and may exhibit deformability in a temperature range of room temperature to 600 C.

Texturizing A Surface Without Bead Blasting

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US Patent:
20210046587, Feb 18, 2021
Filed:
Nov 4, 2020
Appl. No.:
17/089531
Inventors:
- Santa Clara CA, US
David W. GROECHEL - Los Altos Hills CA, US
Jenn C. CHOW - San Jose CA, US
Tuochuan HUANG - Saratoga CA, US
Han WANG - Palo Alto CA, US
International Classification:
B23K 26/352
H01J 37/32
B23K 26/12
Abstract:
A system to provide a texture to a surface of a component for use in a semiconductor processing chamber is provided. The system includes an enclosure comprising a processing region, a support disposed in the processing region, a photon light source to generate a stream of photons, an optical module operably coupled to the photon light source, and a lens. The optical module includes a beam modulator to create a beam of photons from the stream of photons generated from the photon light source, and a beam scanner to scan the beam of photons across the surface of the component. The lens is used to receive the beam of photons from the beam scanner and distribute the beam of photons at a wavelength in a range between about 345 nm and about 1100 nm across the surface of the component to form a plurality of features on the component.

Multiple-Input And Multiple-Output Antenna Structures

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US Patent:
20210044012, Feb 11, 2021
Filed:
Oct 23, 2020
Appl. No.:
17/079284
Inventors:
- Cupertino CA, US
Hongfei Hu - Cupertino CA, US
Mattia Pascolini - San Francisco CA, US
Matthew A. Mow - Los Altos CA, US
Erdinc Irci - Sunnyvale CA, US
Erica J. Tong - Pacifica CA, US
Han Wang - Campbell CA, US
International Classification:
H01Q 1/52
H04B 7/0404
H01Q 1/24
H01Q 1/44
H01Q 21/28
H01Q 1/42
H01Q 9/42
H01Q 21/06
Abstract:
An electronic device may include a housing and four antennas at respective corners of the housing. Cellular telephone transceiver circuitry may concurrently convey signals at one or more of the same frequencies over one or more of the four antennas using a multiple-input multiple-output (MIMO) scheme. In order to isolate adjacent antennas, dielectric-filled openings may be formed in conductive walls of the housing to divide the walls into segments that are used to form resonating element arms for the antennas. If desired, first and second antennas may include resonating element arms formed from a wall without any gaps. The first and second antennas may include adjacent return paths. A magnetic field associated with currents for the first antenna may cancel out with a magnetic field associated with currents for the second antenna at the adjacent return paths, thereby serving to electromagnetically isolate the first and second antennas.

Methods Of Enhancing The Deformability Of Ceramic Materials And Ceramic Materials Made Thereby

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US Patent:
20200283342, Sep 10, 2020
Filed:
Mar 6, 2020
Appl. No.:
16/811814
Inventors:
- West Lafayette IN, US
Haiyan Wang - West Lafayette IN, US
Jin Li - West Lafayette IN, US
Jaehun Cho - West Lafayette IN, US
Xin Li Phuah - West Lafayette IN, US
Han Wang - Richland WA, US
International Classification:
C04B 35/48
C04B 35/64
Abstract:
Methods of determining and controlling the deformability of ceramic materials, as a nonlimiting example, YSZ, particularly through the application of a flash sintering process, and to ceramic materials produced by such methods. Such a method includes providing a nanocrystalline powder of a ceramic material, making a compact of the powder, and subjecting the compact to flash sintering by applying an electric field and thermal energy to the compact.

Method For Fabricating Chamber Parts

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US Patent:
20200255946, Aug 13, 2020
Filed:
Jan 31, 2020
Appl. No.:
16/778642
Inventors:
- Santa Clara CA, US
David W. GROECHEL - Los Altos Hills CA, US
Han WANG - Palo Alto CA, US
International Classification:
C23C 16/56
H01J 37/32
C23C 16/40
H01J 37/34
Abstract:
One example of the disclosure provides a method of fabricating a chamber component with a coating comprising a yttrium containing material with desired film properties. In one example, the method of fabricating a coating material includes providing a base structure comprising an aluminum containing material. The method further includes forming a coating layer that includes a yttrium containing material on the base structure. The method also includes thermal treating the coating layer to form a treated coating layer.

Antenna Assembly

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US Patent:
20200083592, Mar 12, 2020
Filed:
Mar 8, 2019
Appl. No.:
16/297395
Inventors:
- Cupertino CA, US
Devon A. Monaco - San Jose CA, US
Donald J. Parr - Mountain View CA, US
Erica J. Tong - Pacifica CA, US
Han Wang - San Jose CA, US
International Classification:
H01Q 1/24
H05K 1/02
H05K 1/03
H05K 1/18
H01Q 1/22
Abstract:
A disclosed antenna assembly includes a first flexible circuit having a first signal line, at least one first shielding layer, and a first attachment region. The first attachment region includes a first signal pad and first shielding pads disposed around the first signal pad. The antenna assembly further includes a second flexible circuit having a second signal line, at least one second shielding layer, and a second attachment region. The second attachment region includes a second signal pad and second shielding pads disposed around the second signal pad. The first attachment region is attached to the second attachment region.
Han Wei Wang from Fremont, CA, age ~46 Get Report