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Hamid J Ekhlassi

from Chandler, AZ
Age ~64
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Also known as:
Aamid Ekhlassi, Hadim Ekhlassi, Ekhlassi Hamid, Hamid I
Phone and address:
2312 Binner Dr, Chandler, AZ 85224
Related to:
Ahmad N Ekhlassi, 67Kinsey EkhlassiMohsen EkhlassiPadideh Ekhlassi, 55Ali A Ekhlassi, 91Natalie N Ekhlassi, 35Mallory Ekhlassi, 31Ethan A EkhlassiJordan J Ekhlassi, 37Timothy A Ekhlassi, 40Mohsen Ekhlassi, 62Batoul N Ekhlassi, 83
Connected to:
Chris L Ekhoff, 63Neely L Ekhoff, 50Solon Ekhoff, 95Steve L Ekhoff, 51Brittni M Ekholm, 29Christian T Ekholm, 34Eric D Ekholm, 53Julie K Ekholm, 65Kelly A Ekholm, 53Kimberly A Ekholm, 68

Hamid Ekhlassi Phones & Addresses

  • 2312 Binner Dr, Chandler, AZ 85224
  • 2421 W Flint St, Chandler, AZ 85224 (480) 899-1017
  • 1470 Villas Ct, Chandler, AZ 85248 (480) 899-9942
  • Austin, TX
  • 11080 Camino Propico, San Diego, CA 92126 (858) 880-3465
  • Buckeye, AZ
  • Pinedale, AZ
  • Travis, TX
  • Maricopa, AZ

Resumes

Resumes

Hamid Ekhlassi Photo 1

Think Tanks Professional

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Location:
Phoenix, Arizona Area
Industry:
Think Tanks
Work:
Intel Corporation - ARIZONA 1995 - 2012
LPIA SIP/SOC Design Integration, MGR, INTEL Corp
DORNIER GmbH - Phoenix, Arizona Area 1989 - 1995
Dornier Medical Division
ITT CANNON ELECTRIC - Phoenix, Arizona Area 1985 - 1989
Principle Process Engineer
Arvin Industries - Phoenix, Arizona Area 1983 - 1985
Process Engineer
Education:
ASU
B.S.M.E, Automation processes,, New Materials, process development,COST ROI, Calculus TA for 2 years
Hamid Ekhlassi Photo 2

Hamid Ekhlassi

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Publications

Us Patents

Ball Grid Array Copper Balancing

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US Patent:
7205649, Apr 17, 2007
Filed:
Jun 30, 2003
Appl. No.:
10/610317
Inventors:
Robert Nickerson - Chandler AZ, US
Hamid Ekhlassi - Chandler AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/053
H01L 23/12
H01L 23/06
H01L 23/48
H01L 23/52
US Classification:
257700, 257684, 257690, 257692, 257737, 257738, 257758, 257759, 257760, 257773, 257774, 257775, 257780, 257781
Abstract:
A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.

Ball Grid Array Copper Balancing

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US Patent:
20070184644, Aug 9, 2007
Filed:
Mar 26, 2007
Appl. No.:
11/691135
Inventors:
Robert Nickerson - Chandler AZ, US
Hamid Ekhlassi - Chandler AZ, US
International Classification:
H01L 21/44
US Classification:
438612000, 438614000
Abstract:
A ball grid array device includes a substrate having a first major surface and a second major surface. The first major surface includes leads for electrical connections. The second major surface is devoid of leads. The ball grid array device also includes a first land having a solder mask opening at the first major surface of the substrate, and a second, buried land near the first major surface of the substrate. A method for forming an electronic device includes forming an electronic circuit in a substrate, placing an input pad for an input to the electronic circuit on at least one major surface of the substrate, placing an output pad for an output from the electronic circuit on the at least one major surface of the substrate, and placing an electrically isolated pad near the at least one major surface of the substrate.

Integrated Circuit Cartridge And Method Of Fabricating The Same

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US Patent:
62561995, Jul 3, 2001
Filed:
Oct 1, 1999
Appl. No.:
9/410648
Inventors:
Imran Yusuf - Tempe AZ
Hong Xie - Phoenix AZ
Johnny M. Cook - Glendale AZ
Peter Brandenburger - Chandler AZ
Biju Chandran - Chandler AZ
Hamid Ekhlassi - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 720
US Classification:
361699
Abstract:
An integrated circuit cartridge and method has been described. The cartridge includes a heat pipe that comes in thermal contact with at least one integrated circuit die. A spring clip is utilized to provide a compressive force to maintain a substantially even bond line thickness in the presence of opposing forces, such as forces caused by thermal cycling, power cycling, shocks, and vibration. The spring clip can modulate the compressive force applied as a function of parameters on the spring clip. Parameters include load arm width, load arm thickness, load arm curvature, and the location of tabs relative to load arms. A cartridge cover supplies physical protection for pins that protrude from the cartridge. The cartridge cover also supplies key features that aid in alignment of the pins and a socket.

Apparatus For And Method Of Cooling Ultrasonic Medical Transducers By Conductive Heat Transfer

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US Patent:
52131033, May 25, 1993
Filed:
Jan 31, 1992
Appl. No.:
7/830224
Inventors:
Glenn Martin - Chandler AZ
Hamid Ekhlassi - Chandler AZ
Assignee:
Acoustic Imaging Technologies Corp. - Phoenix AZ
International Classification:
A61B 800
US Classification:
12866007
Abstract:
A method for transferring heat away from an ultrasonic medical transducer having a face wherein heat is generated. The method is accomplished by positioning a heat sink behind the transducer face, securing the heat sink to a braided power cable, applying a heat conductive epoxy to the heat sink, and assembling a plastic housing around the heat sink. The transducer face is cooled by conductive heat transfer by transferring the heat into the heat sink, then transferring the heat into the epoxy, then transferring the heat into the power cable and the plastic housing before finally dissipating into the surrounding air.

Surface Mount Connector With Pins In Vias

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US Patent:
62590391, Jul 10, 2001
Filed:
Dec 29, 1998
Appl. No.:
9/222604
Inventors:
Robert J. Chroneos - Tempe AZ
Hamid Ekhlassi - Chandler AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01R 909
US Classification:
174263
Abstract:
A surface mountable pin connector has a substrate or a circuit board carrier, which has a number of through holes or vias formed therein, and a number of connector pins, each of which is soldered into a respective one of the through holes with high melt temperature solder. A damming device or protrusion is located on each pin nearer to the shoulder than typical interference fit protrusions. The damming device is sized and shaped to completely block the through hole or via.
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Hamid J Ekhlassi from Chandler, AZ, age ~64 Get Report