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Gyanendra Dutt

from Whitehouse Station, NJ
Age ~48

Gyanendra Dutt Phones & Addresses

  • 10 Hay Barrick Rd, White Hse Sta, NJ 08889
  • Whitehouse Station, NJ
  • Jersey City, NJ
  • Monmouth Junction, NJ
  • Summit, NJ
  • Garden Grove, CA
  • Knoxville, TN
  • Hillsborough, NJ
  • Orange, CA
  • Piscataway, NJ

Publications

Us Patents

B-Stageable Underfill Encapsulant And Method For Its Application

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US Patent:
20030164555, Sep 4, 2003
Filed:
Mar 1, 2002
Appl. No.:
10/084873
Inventors:
Quinn Tong - Belle Mead NJ, US
Yue Xiao - Belle Mead NJ, US
Bodan Ma - Racine WI, US
Gyanendra Dutt - Edison NJ, US
International Classification:
H01L021/44
H01L021/56
US Classification:
257/787000, 257/788000, 257/793000, 438/127000, 438/113000, 438/114000
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole-anhydride curing agent, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

B-Stageable Underfill Encapsulant And Method For Its Application

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US Patent:
20060125119, Jun 15, 2006
Filed:
Nov 21, 2005
Appl. No.:
11/284219
Inventors:
Allison Xiao - Belle Mead NJ, US
Quinn Tong - Belle Mead NJ, US
Badan Ma - Racine WI, US
Gyanendra Dutt - Piscataway NJ, US
International Classification:
H01L 23/29
US Classification:
257793000
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin system comprising an epoxy resin, a phenol-containing compound such as phenol or phenolic resin, a solvent, an imidazole phosphate salt catalyst, inorganic fillers, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.

Underfill Encapsulant For Wafer Packaging And Method For Its Application

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US Patent:
20060194064, Aug 31, 2006
Filed:
Feb 10, 2006
Appl. No.:
11/351647
Inventors:
Allison Xiao - Belle Mead NJ, US
Gyanendra Dutt - Piscataway NJ, US
International Classification:
B32B 27/38
H01L 21/56
C08L 63/00
B32B 37/00
US Classification:
428414000, 438127000, 523400000
Abstract:
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable epoxy resin, a solvent, an imidazole phosphate salt catalyst, fluxing agents, and optionally, wetting agents. Various other additives, such as defoaming agents, adhesion promoters, flow additives and rheology modifiers may also be added as desired. The underfill encapsulant is B-stageable to provide a coating on the wafer that is smooth, non-tacky and will allow the wafer to be cleanly diced into individual chips. A method for producing an electronic package containing the B-stageable material may also utilize an unfilled liquid curable fluxing material on the substrate to which the chip is to be attached.
Gyanendra Dutt from Whitehouse Station, NJ, age ~48 Get Report