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Goksen G Yaralioglu

from Los Altos, CA
Age ~54

Goksen Yaralioglu Phones & Addresses

  • 266 Hillview Ave, Los Altos, CA 94022
  • San Jose, CA
  • 1120 Bonita Ave, Mountain View, CA 94040
  • 250 Curtner Ave, Palo Alto, CA 94306
  • Stanford, CA
  • New Haven, CT
  • 5130 Alan Ave, San Jose, CA 95124

Business Records

Name / Title
Company / Classification
Phones & Addresses
Goksen Goksenin Yaralioglu
President, President
INTUSON
Mfg Semiconductors/Related Devices
1120 Bonita Ave 6, Mountain View, CA 94040
1120 Bonita Ave, Mountain View, CA 94040

Publications

Us Patents

Microfluidic Channels With Integrated Ultrasonic Transducers For Temperature Measurement And Method

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US Patent:
6789426, Sep 14, 2004
Filed:
Jul 17, 2002
Appl. No.:
10/198290
Inventors:
Goksen G. Yaralioglu - Palo Alto CA
Arif S. Ergun - Mountain View CA
Hemanth Jagannathan - Palo Alto CA
Butrus T. Khuri-Yakub - Palo Alto CA
Assignee:
Board of Trustees of the Leland Stanford Junior University - Stanford CA
International Classification:
G01H 500
US Classification:
73597, 374119
Abstract:
There is described a method and apparatus for measuring temperature of a fluid in a microchannel of the type having spaced walls. An ultrasonic transducer transmits ultrasonic waves transmitted from one wall to the opposite wall. A processor determines the time-of-flight of the ultrasonic waves from the one wall and reflected to the opposite wall to the one wall. The processor converts the time-of-flight to velocity by dividing the distance between walls by the time-of-flight. The processor converts velocity to temperature from the relationship of velocity to temperature in the fluid.

Capacitive Membrane Ultrasonic Transducers With Reduced Bulk Wave Generation And Method

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US Patent:
7321181, Jan 22, 2008
Filed:
Apr 4, 2005
Appl. No.:
11/098863
Inventors:
Butrus T. Khuri-Yakub - Palo Alto CA, US
Arif S. Ergun - Mountain View CA, US
Goksen Yaralioglu - Mountain View CA, US
Assignee:
The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA
International Classification:
H01L 41/08
US Classification:
310320, 310324, 310334
Abstract:
A capacitive membrane ultrasonic transducer which includes a membrane supported by a substrate in which ultrasonic bulk waves at the frequency of operation of the transducers are suppressed by configuring the substrate and a method of suppressing the ultrasonic bulk waves.

High Quality Factor Resonators For Liquid Immersion Biological And Chemical Sensors

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US Patent:
7694552, Apr 13, 2010
Filed:
Feb 11, 2008
Appl. No.:
12/069730
Inventors:
Butrus T. Khuri-Yakub - Palo Alto CA, US
Goksen G. Yaralioglu - Mountain View CA, US
Assignee:
The Board of Trustees of the Leland Stanford Junior University - Palo Alto CA
International Classification:
G01N 29/00
G01N 15/06
US Classification:
73 6453, 73 6175, 73 6179
Abstract:
A mechanical resonator capable of providing an intrinsically high mechanical quality factor in immersion is provided. The resonator includes a membrane attached at its perimeter to a frame, such that a front side of the membrane is in contact with the liquid, and the back side of the membrane is not in contact with the liquid or the frame. The membrane can act as a mechanical resonator. The quality factor of this resonator is enhanced by providing a pressure release boundary region on the frame in proximity to the membrane and in contact with the liquid. The pressure release boundary region provides a soft boundary condition, in the sense that a mechanical impedance on the solid side of the solid-liquid interface is less than the liquid mechanical impedance. Providing such a soft boundary condition reduces the mechanical energy loss due to excitation of waves in the liquid, thereby improving resonator quality factor. Such high-Q resonators are particularly useful for sensor applications.

Performance-Enhancing Two-Sided Mems Anchor Design For Vertically Integrated Micromachined Devices

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US Patent:
7863698, Jan 4, 2011
Filed:
Apr 3, 2009
Appl. No.:
12/418554
Inventors:
Joseph Seeger - Menlo Park CA, US
Goksen G. Yaralioglu - Mountain View CA, US
Bruno Borovic - San Francisco CA, US
Alexander Castro - San Jose CA, US
Assignee:
Invensense, Inc. - Sunnyvale CA
International Classification:
H01L 29/84
US Classification:
257415, 257254, 257E29324
Abstract:
An anchoring assembly for anchoring MEMS device is disclosed. The anchoring assembly comprises: a top substrate; a bottom substrate substantially parallel to the top substrate; and a first portion of the anchor between the top substrate and the bottom substrate. The first portion of the anchor is rigidly connected to the top substrate; and the first portion of the anchor is rigidly connected to the bottom substrate. A second portion of the anchor is between the top substrate and the bottom substrate. The second portion of the anchor is rigidly connected to the top substrate; the second portion of the anchor being an anchoring point for the MEMS device. A substantially flexible mechanical element coupling the first portion of the anchor and the second portion of the anchor; the flexible element providing the electrical connection between the first portion of the anchor and the second portion of the anchor.

Vertically Integrated 3-Axis Mems Angular Accelerometer With Integrated Electronics

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US Patent:
7934423, May 3, 2011
Filed:
Dec 10, 2007
Appl. No.:
11/953762
Inventors:
Steven S. Nasiri - Saratoga CA, US
Goksen G. Yaralioglu - Mountain View CA, US
Joseph Seeger - Menlo Park CA, US
Babak Taheri - San Francisco CA, US
Assignee:
Invensense, Inc. - Sunnyvale CA
International Classification:
G01P 15/08
G01P 15/125
US Classification:
7351402, 7351432
Abstract:
Sensors for measuring angular acceleration about three mutually orthogonal axes, X, Y, Z or about the combination of these axes are disclosed. The sensor comprises a sensor subassembly. The sensor subassembly further comprises a base which is substantially parallel to the X-Y sensing plane; a proof mass disposed in the X-Y sensing plane and constrained to rotate substantially about the X, and/or Y, and/or Z, by at least one linkage and is responsive to angular accelerations about the X, and/or Y, and/or Z directions. Finally, the sensor includes at least one electrode at the base plate or perpendicular to the base plate and at least one transducer for each sensing direction of the sensor subassembly responsive to the angular acceleration. Multi-axis detection is enabled by adjusting a configuration of flexures and electrodes.

Vertically Integrated 3-Axis Mems Accelerometer With Electronics

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US Patent:
8047075, Nov 1, 2011
Filed:
Jun 21, 2007
Appl. No.:
11/766776
Inventors:
Steven S. Nasiri - Saratoga CA, US
Joseph Seeger - Menlo Park CA, US
Goksen Yaralioglu - Mountain View CA, US
Assignee:
Invensense, Inc. - Santa Clara CA
International Classification:
G01P 15/125
US Classification:
7351432, 73510
Abstract:
A system and method in accordance with the present invention provides for a low cost, bulk micromachined accelerometer integrated with electronics. The accelerometer can also be integrated with rate sensors that operate in a vacuum environment. The quality factor of the resonances is suppressed by adding dampers. Acceleration sensing in each axis is achieved by separate structures where the motion of the proof mass affects the value of sense capacitors differentially. Two structures are used per axis to enable full bridge measurements to further reduce the mechanical noise, immunity to power supply changes and cross axis coupling. To reduce the sensitivity to packaging and temperature changes, each mechanical structure is anchored to a single anchor pillar bonded to the top cover.

Method And System For Using A Mems Structure As A Timing Source

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US Patent:
8183944, May 22, 2012
Filed:
Apr 3, 2009
Appl. No.:
12/418547
Inventors:
Joseph Seeger - Menlo Park CA, US
Goksen G. Yaralioglu - Mountain View CA, US
Baris Cagdaser - Sunnyvale CA, US
Assignee:
Invensense, Inc. - Sunnyvale CA
International Classification:
H03B 5/30
US Classification:
331154, 331116 M, 331 34, 331177 R
Abstract:
A system and method is disclosed that provides a technique for generating an accurate time base for MEMS sensors and actuators which has a vibrating MEMS structure. The accurate clock is generated from the MEMS oscillations and converted to the usable range by means of a frequency translation circuit.

Wafer Scale Chip Scale Packaging Of Vertically Integrated Mems Sensors With Electronics

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US Patent:
8508039, Aug 13, 2013
Filed:
May 8, 2008
Appl. No.:
12/117264
Inventors:
Steven S. Nasiri - Saratoga CA, US
Goksen G. Yaralioglu - Mountain View CA, US
Assignee:
Invensense, Inc. - Sunnyvale CA
International Classification:
H01L 23/12
US Classification:
257704, 257678, 257783, 257E21499, 438 66, 438106, 438125
Abstract:
In a method and system in accordance with the present invention, solder balls are added on top of vertically integrated MEMS with CMOS by using wafer scale fabrication compatible with existing chip scale packaging capabilities. In the present invention, both the MEMS and the CMOS dies are fabricated in equal dimensions. On the MEMS level, silicon islands are defined by DRIE etching to be bonded on top of CMOS pads. These conducting silicon islands later provide electrical connections between the CMOS pads and the conducting traces that lead to solder balls on top.
Goksen G Yaralioglu from Los Altos, CA, age ~54 Get Report