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Gerald M Vettel

from Pine Island, MN
Age ~88
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Also known as:
Gerald Micheal Vettel, E Vettel, N Vettel
Phone and address:
225 2Nd St, Pine Island, MN 55963
(507) 356-4168
Related to:
Esther L Vettel, 61John M Vettel, 60Loraine M Vettel, 85
Connected to:
Trevor L Vettel, 33Alice A Vetter, 52Arthur Vetter, 73Brenda J Vetter, 50Brett J Vetter, 53Charlotte T Vetter, 76Claire L Vetter, 62Courtney L Vetter, 38Elysia D Vetter, 53Erwin C Vetter, 90

Gerald Vettel Phones & Addresses

  • 225 2Nd St, Pine Island, MN 55963 (507) 356-4168
  • Goodhue, MN
  • 225 2Nd St SW, Pine Island, MN 55963 (507) 382-9080

Work

Position: Sales Occupations

Education

Degree: Graduate or professional degree

Emails

g***[email protected]

Publications

Us Patents

Integrated Electronic Card-Frame Assembly For A Rigid Disk Drive

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US Patent:
50382390, Aug 6, 1991
Filed:
Jan 31, 1989
Appl. No.:
7/305226
Inventors:
Gerald M. Vettel - Pine Island MN
James M. Rigotti - Rochester MN
Lyle R. Tufty - Elgin MN
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G11B 1702
US Classification:
360 9801
Abstract:
A disk drive within the dimensional confines of a form factor can optimize volumetric density by using the full height dimension to house disks, but must thereafter utilize the remaining space for electrical components. The structure shown uses a stack of parallel cards with an interface card on the rear end wall to provide the principal drive control and data circuits exterior of the head-disk assembly (HDA). The motor driver circuitry is mounted on a flat flexible cable and is secured to the front wall at the opposite end of the drive in heat transfer relation. The heat generating motor drive circuits are physically isolated from the data/control circuits by the frame and HDA while some of the printed circuit cards are secured to the frame in a manner that enhances rigidity; the allocation of modules to the cards anticipates flow of data and control signals to minimize the number of connections and signal delays that impair performance.

Method Of Making An Electronic Package Assembly With Protective Encapsulant Material

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US Patent:
54149282, May 16, 1995
Filed:
Apr 2, 1993
Appl. No.:
8/042196
Inventors:
Barry A. Bonitz - Endicott NY
James V. Ellerson - Endicott NY
Kishen N. Kapur - Vestal NY
Jack M. McCreary - Apalachin NY
Irving Memis - Vestal NY
Gerald M. Vettel - Pine Island MN
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 334
US Classification:
29840
Abstract:
An electronic package assembly wherein a low profile package is soldered to an organic (e. g. , epoxy resin) substrate (e. g. , printed circuit board), the projecting conductive leads of the package and the solder which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (e. g. , polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.
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Gerald M Vettel from Pine Island, MN, age ~88 Get Report