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George L Goblish

from Hernando, FL
Age ~77
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Also known as:
George Lucian Goblish, George J Goblish, George D Goblish, George G Goblish
Related to:
Gregory Oxendale, 40Jack C Waite, 97Douglas G Oxendale, 68Sarah M Goblish, 37Jan M Oxendale, 66Ryan B Oxendale, 38Heidi L Oxendale, 39Judy D Goblish, 72
Connected to:
Juanita M Gobourne, 65Timothy Gobourne, 33Karim Gobran, 40Mena M Gobran, 39Romani E Gobran, 47Cekecia O Gobre, 39Lorena M Gobrogge, 80Gabriel G Gobron, 53Dinesh K Goburdhun, 55Shawn R Goburn, 42

George Goblish Phones & Addresses

  • Hernando, FL
  • 62 Meadowlark Dr, Hudson, WI 54016 (715) 808-0300
  • 1606 Innsbruck Pkwy, Columbia Heights, MN 55421 (763) 571-4126
  • Minneapolis, MN
  • Citra, FL
  • 62 Meadowlark Ln, Hudson, WI 54016 (715) 808-0300

Work

Company: Honeywell inc. - Minneapolis, MN Jan 1979 Position: Senior principal design engineer and supplier quality engineer

Education

School / High School: St. Paul- Saint Paul, MN Mar 2003 Specialities: Design For Six Sigma Green Belt

Skills

Hardware & Operating Systems: PC &a... • Windows • Internet Explorer & information sear... • Excel • Powerpoint • Outlook • Visio • Oracle • PurchasePro • eMatrix PDM. Working skills: Six Sigma... • TQM and Six Sigma problem solving method... • ISO 9001 auditor certified by BSI • Certified Quality Auditor by ASQ • familiar with Aerospace industry standar... • attentive to detail • good planning • organizing • and written communication skills • work well on teams.

Resumes

Resumes

George Goblish Photo 1

George Goblish Hudson, WI

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Work:
Honeywell Inc.
Minneapolis, MN
Jan 1979 to Jan 2015
Senior Principal Design Engineer and Supplier Quality Engineer
Programmed & Remote Systems
Saint Paul, MN
Jun 1975 to Dec 1978
Engineering Project Manager
Onan/Cummins
Fridley, MN
Jan 1973 to May 1975
Product Engineer and Project Engineer
McDonnell Douglas (now Boeing)
St. Louis, MO
Jun 1969 to Dec 1972
Structural and Mechanical Design Engineer
Bureau of Field Studies and Surveys, University of Minnesota (School of Education)
Saint Paul, MN
May 1968 to May 1968
Engineer's Assistant
Education:
St. Paul
Saint Paul, MN
Mar 2003
Design For Six Sigma Green Belt
Lehigh University
Jul 2001
International Supply Chain Management
American Institute of Motion Engineers
Warrendale, PA
Sep 1996
Design Mastery
University of Missouri-Rolla
St. Louis, MO
Jun 1972
M.S. in Engineering Management
University of Minnesota
Minneapolis, MN
1965 to 1969
B.S. (B.Aero.E) in Aeronautical Engineering & Engineering Mechanics
Redwood Falls High School
Redwood Falls, MN
1965
High School Diploma
Skills:
Hardware & Operating Systems: PC & compatibles, Windows, Internet Explorer & information searching methods.Software: MS Office Word, Excel, Powerpoint, Outlook, Visio, Oracle, PurchasePro, eMatrix PDM. Working skills: Six Sigma certified, TQM and Six Sigma problem solving methodologies, ISO 9001 auditor certified by BSI, Certified Quality Auditor by ASQ, familiar with Aerospace industry standards and design practices, attentive to detail, good planning, organizing, and written communication skills, work well on teams.

Publications

Us Patents

Temperature Sensor Attachment Facilitating Thermal Conductivity To A Measurement Point And Insulation From A Surrounding Environment

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US Patent:
20130083326, Apr 4, 2013
Filed:
Sep 30, 2011
Appl. No.:
13/250478
Inventors:
Matthew Clark - Blaine MN, US
Terry Dean Stark - St. Louis Park MN, US
George Goblish - Hudson WI, US
Myles Koshiol - St. Louis Park MN, US
Assignee:
HONEYWELL INTERNATIONAL INC. - Morristown NJ
International Classification:
G01C 19/66
G01K 7/22
US Classification:
356459, 374185, 374E07028
Abstract:
A temperature sensor package includes a temperature sensor having a first side and a second side, wherein the first side of the temperature sensor includes an active region configured for coupling with a target area for temperature measurement of an object. The temperature sensor package further includes a circuit board having a first side and a second side, the first side of the circuit board coupled to the second side of the temperature sensor, wherein the circuit board provides thermal insulation between the active region of the temperature sensor and an environment on the second side of the circuit board.

Means To Attach Getter To Getter Retaining Ring

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US Patent:
20130232739, Sep 12, 2013
Filed:
Mar 6, 2012
Appl. No.:
13/413289
Inventors:
Rodney H. Thorland - Blaine MN, US
George L. Goblish - Hudson WI, US
Bruce A. Seiber - Arden Hills MN, US
Assignee:
HONEYWELL INTERNATIONAL INC. - Morristown NJ
International Classification:
F16B 2/20
B21D 31/00
US Classification:
24458, 723792
Abstract:
A retaining clip for a getter is provided. The retaining clip for a getter includes a curved structure including a first surface, a second surface opposing the first surface, a first-edge surface, and a second-edge surface opposing the first-edge surface, the curved structure curved in a major curve having a major radius-of-curvature and a major axis perpendicular to the major radius-of-curvature; and at least one tab seamlessly extending from at least one of the first-edge surface and the second-edge surface. The curved structure is configured to be operably retained in a getter cavity with the getter that is attached to the at least one tab.

Mitigation Of Block Bending In A Ring Laser Gyroscope Caused By Thermal Expansion Or Compression Of A Circuit Board

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US Patent:
20130081860, Apr 4, 2013
Filed:
Sep 30, 2011
Appl. No.:
13/250503
Inventors:
Matthew Clark - Blaine MN, US
Craig A. Galbrecht - Lino Lakes MN, US
George Goblish - Hudson WI, US
Myles Koshiol - St. Louis Park MN, US
Assignee:
HONEYWELL INTERNATIONAL INC. - Morristown NJ
International Classification:
H05K 1/11
H05K 1/00
H05K 3/00
H05K 1/02
US Classification:
174254, 174261, 174250, 29829
Abstract:
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
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George L Goblish from Hernando, FL, age ~77 Get Report