Resumes
Resumes
Geoffrey Mariner
View pageLocation:
United States
Geoffrey Mariner Phones & Addresses
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27 Oakwood Dr, Apalachin, NY 13732 (607) 625-3489
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27 Oakwood Dr, Apalachin, NY 13732 (607) 226-1845
Work
Position:
Production Occupations
Education
Degree:
High school graduate or higher
Emails
Publications
Us Patents
Electronic Package For High Density Applications
View pageUS Patent:
50993933, Mar 24, 1992
Filed:
Mar 25, 1991
Appl. No.:
7/674249
Inventors:
James R. Bentlage - Binghamton NY
David E. Engle - Vestal NY
Geoffrey R. Mariner - Apalachin NY
John J. Squires - Endicott NY
John H. Williams - Endicott NY
David E. Engle - Vestal NY
Geoffrey R. Mariner - Apalachin NY
John J. Squires - Endicott NY
John H. Williams - Endicott NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 909
H01R 2368
H01R 2368
US Classification:
361413
Abstract:
An electronic package including a first circuitized substrate (e. g. , printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated frame member, the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible substrate.