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Galen C Kirkpatrick

from Aliso Viejo, CA
Age ~52
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Also known as:
Galen L Kirkpatrick, Gal Kirkpatrick, Ga Kirkpatrick, Golen C Kirkpatrick, Kirkpatrick Ga
Related to:
Linda L Hull, 83
Connected to:
Andy L Kirkpatrick, 46Angela Kirkpatrick, 45Benjamin Kirkpatrick, 44Bradley H Kirkpatrick, 47Brady S Kirkpatrick, 28Carter F Kirkpatrick, 40Casey S Kirkpatrick, 44Corey Kirkpatrick, 51Cristy G Kirkpatrick, 58Dale R Kirkpatrick, 70

Galen Kirkpatrick Phones & Addresses

  • Aliso Viejo, CA
  • Manhattan Beach, CA
  • 1703 Van Horne Ln, Redondo Beach, CA 90278 (310) 937-6168
  • Beaverton, OR
  • Hermosa Beach, CA
  • Fremont, CA
  • San Luis Obispo, CA
  • Phoenix, AZ
  • Kerman, CA

Work

Company: Signetics Position: Tpm

Education

School / High School: California Polytechnic State University - San Luis Obispo 1990 to 1994

Languages

English

Interests

Exercise • Home Improvement • Reading • Gourmet Cooking • Sports • Home Decoration • Cooking • Cruises • Outdoors • Electronics • Crafts • Fitness • Music • Movies • Kids • Diet • Automobiles • Travel • Motorcycling • Traveling • Self Improvement

Industries

Semiconductors

Resumes

Resumes

Galen Kirkpatrick Photo 1

Galen Kirkpatrick

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Location:
1703 Van Horne Ln, Redondo Beach, CA 90278
Industry:
Semiconductors
Work:
Signetics
Tpm
Education:
California Polytechnic State University - San Luis Obispo 1990 - 1994
Interests:
Exercise
Home Improvement
Reading
Gourmet Cooking
Sports
Home Decoration
Cooking
Cruises
Outdoors
Electronics
Crafts
Fitness
Music
Movies
Kids
Diet
Automobiles
Travel
Motorcycling
Traveling
Self Improvement
Languages:
English

Publications

Us Patents

Compact, Highly Integrated Microphone Assembly

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US Patent:
20130094674, Apr 18, 2013
Filed:
Apr 13, 2012
Appl. No.:
13/446644
Inventors:
Eric J. Lautenschlager - Geneva IL, US
Galen Kirkpatrick - Redondo Beach CA, US
International Classification:
H04R 19/04
US Classification:
381174
Abstract:
A microelectromechanical (MEMS) microphone assembly includes a MEMS structure, a base portion, and a lid. The MEMS structure includes a diaphragm that responds to changes in sound pressure and the MEMS structure contributes to a vertical dimension of the assembly. The MEMS structure is supported by the base portion. The lid partially but not completely encloses the MEMS structure, such that the portion of the MEMS structure is not surrounded by the lid, the lid, and the base portion form a boundary with and are exposed to the environment external to the microphone assembly.

Semiconductor Border Protection Sealant

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US Patent:
20160049348, Feb 18, 2016
Filed:
Oct 20, 2014
Appl. No.:
14/518947
Inventors:
- Irvine CA, US
Galen KIRKPATRICK - Redondo Beach CA, US
Edward LAW - Ladera Ranch CA, US
Reza KHAN - Irvine CA, US
Ming Wang SZE - Irvine CA, US
Assignee:
Broadcom Corporation - Irvine CA
International Classification:
H01L 23/31
H01L 21/683
H01L 23/544
H01L 23/00
H01L 21/66
H01L 21/56
H01L 21/78
Abstract:
A semiconductor package includes a semiconductor unit containing an active circuitry layer. The semiconductor package also includes a plurality of bonding pads on the active circuitry layer, which are configured to be connected to corresponding external conductive connectors. The semiconductor package also includes a protective sealant coating filling grooved edges of the active circuitry layer. The protective sealant coating contains an exterior wafer-singulated surface.
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Galen C Kirkpatrick from Aliso Viejo, CA, age ~52 Get Report