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Francis J Bucek

from Binghamton, NY
Age ~91

Francis Bucek Phones & Addresses

  • 34 Bartell Rd, Binghamton, NY 13905 (607) 797-4089
  • Kure Beach, NC
  • East Haven, CT
  • Littleton, CO
  • 34 Bartell Rd, Binghamton, NY 13905

Industries

Gambling & Casinos

Resumes

Resumes

Francis Bucek Photo 1

Francis Bucek

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Location:
34 Bartell Rd, Binghamton, NY 13905
Industry:
Gambling & Casinos

Publications

Us Patents

Storage Apparatus For Video Data

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US Patent:
45009287, Feb 19, 1985
Filed:
Nov 26, 1982
Appl. No.:
6/444557
Inventors:
Francis J. Bucek - Binghamton NY
Frank V. Paxhia - Johnson City NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H04N 122
H04N 140
US Classification:
358296
Abstract:
Apparatus for recording in memory the data of a displayed video frame by storing as data bytes all of the binary data bits from the video data signal appearing as scan lines generated in succession within groups in a frame. The capture of video data occurs within a single regeneration of the raster image. Also recorded in memory for each scan line is a status byte to designate whether the next predetermined number of scan lines are to be omitted to provide spacing between rows of displayed characters.

Printed Circuit Board With Aligned Connections And Method Of Making Same

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US Patent:
54502900, Sep 12, 1995
Filed:
Feb 14, 1994
Appl. No.:
8/195532
Inventors:
Christina M. Boyko - Conklin NY
Francis J. Bucek - Binghamton NY
Richard W. Carpenter - Johnson City NY
Voya R. Markovich - Endwell NY
Darleen Mayo - Knightdale NC
Cindy M. Reidsema - Austin TX
Joseph G. Sabia - Norwich NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 114
H05K 336
B05D 512
US Classification:
361792
Abstract:
The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon. The vias and plated through holes are arranged in groups and patterns which provide some direct connection between the pads and plated through holes, some pads wired to vias on the exposed surface of the film of dielectric material and some vias wired to plated through holes on the surface of the substrate.
Francis J Bucek from Binghamton, NY, age ~91 Get Report