US Patent:
20060202317, Sep 14, 2006
Inventors:
Farid Barakat - Raleigh NC, US
Petros Negussu - Morrisville NC, US
Thoai Le - Cary NC, US
International Classification:
H01L 23/02
Abstract:
Embodiments of the invention generally provide methods and apparatus for constructing multi chip packages having balance performance as between the various integrated circuits in a stack. In one embodiment, contacts on an outer surface of a first pad are “redistributed” from one area of the outer surface to another area of the first pad (e.g., to a different area of the outer surface). A second chip is adjacent to, and laterally offset with, the first chip, thereby exposing the redistributed contacts of the first chip.