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Farhang F Shadman

from Tucson, AZ
Age ~79
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Also known as:
Farhang Farah Shadman, Farhang Frank Shadman, Frank F Shadman, Farshan F Shadman, Farhang F Shabman, Fahrang Shadman, G Shadman
Phone and address:
5849 Camino Miraval, Tucson, AZ 85718
(520) 329-8248
Related to:
Melissa A Lazarevic, 42Jovica Lazarevic, 43Ramin F Shadman, 46Farah M Shadman, 75
Connected to:
Kareem Shadman, 43Layla A Shadman, 37Austin J Shadoan, 33Belynda J Shadoan, 67Jan C Shadoan, 80Linda A Shadoan, 61Michael D Shadoan, 65Scott Shadoin, 60Mark A Shadood, 64Phillip P Shadood, 62

Farhang Shadman Phones & Addresses

  • 5849 Camino Miraval, Tucson, AZ 85718 (520) 329-8248
  • 4351 E Dracena Ln, Tucson, AZ 85712 (520) 323-1869
  • 6875 N Calle Mechero, Tucson, AZ 85718 (520) 577-8831
  • 12904 Carmel Creek Rd, San Diego, CA 92130 (858) 792-8261
  • 12904 Carmel Creek Rd #89, San Diego, CA 92130 (520) 329-8248
  • Pima, AZ

Work

Company: The university of arizona Position: Professor

Education

Degree: Graduate or professional degree

Interests

Cooking • Exercise • Collecting Antiques • Outdoors • Investing • Electronics • Home Improvement • Reading • Music • Sports • The Arts • Travel • Movies • Collecting • Home Decoration

Industries

Higher Education

Resumes

Resumes

Farhang Shadman Photo 1

Professor

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Location:
Tucson, AZ
Industry:
Higher Education
Work:
The University of Arizona
Professor
Interests:
Cooking
Exercise
Collecting Antiques
Outdoors
Investing
Electronics
Home Improvement
Reading
Music
Sports
The Arts
Travel
Movies
Collecting
Home Decoration

Business Records

Name / Title
Company / Classification
Phones & Addresses
Farhang F Shadman
4351 EAST DRACENA LANE INVESTMENT PROPERTY, LLC
5849 N Camino Miraval, Tucson, AZ 85718
Farhang Shadman
Chief Executive Officer
Environmental Metrology Corporation
Envronmental Metrology · Instruments To Measure Electricity · Miscellaneous Publishing
6595 N Oracle Rd, Tucson, AZ 85704
(520) 742-3300

Publications

Us Patents

Process For Removing Organics From Ultrapure Water

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US Patent:
6991733, Jan 31, 2006
Filed:
May 25, 2004
Appl. No.:
10/852166
Inventors:
Kon-Tsu Kin - Hsinchu, TW
Pei-Lin Chang - Hsinchu, TW
Farhang Shadman - Tucson AZ, US
Hsiao-Fen Cheng - Hsinchu, TW
Assignee:
Industrial Technology Research Institute - Hsinchu
International Classification:
B01D 19/00
C02F 1/04
US Classification:
210683, 210691, 210692, 210900, 210760, 210748, 210750, 210664
Abstract:
In order to reduce a total organic carbon (TOC) in ultrapure water to a level less than 1 ppb, several cycles of ozone contact/UV irradiation treatments are carried out in sequence. Preferably, the first cycle further includes an ion exchange treatment which is applied to the resulting UV irradiation water.

Method And Apparatus For Treating A Substrate Surface By Bubbling

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US Patent:
7202175, Apr 10, 2007
Filed:
Nov 7, 2003
Appl. No.:
10/702442
Inventors:
Kon-Tsu Kin - Hsinchu, TW
Chiou-Mei Chen - Hsinchu, TW
Jen-Chung Lou - Hsinchu, TW
Ching-Yi Hsu - Hsinchu, TW
Farhang Shadman - Tucson AZ, US
Assignee:
Industrial Technology Research Institute - Hsinchu
International Classification:
H01L 21/302
US Classification:
438704, 438745, 430329, 134 13
Abstract:
The present invention discloses a technique of removing a substance from a substrate surface, such as stripping photoresist from a wafer, or forming a substance on a substrate surface. Substrates to be treated are parallel arranged at an equal interval and are immersed in a liquid with only a lower portion thereof being below the liquid surface. Gas such as ozone is introduced into the liquid and is continuously bubbling below the substrates. The bubbles will ascend between two adjacent substrates and climb on the surfaces of the substrates before they burst. The liquid boundary layers on the substrate surfaces are compressed and refreshed in the course of a dragging ascent of the bubbles, enhancing mass transfer between gas/liquid/solid substances across the liquid boundary layer, thereby resulting in a fast reaction and a fast treatment of the surface of the substrates.

Shielded Micro Sensor And Method For Electrochemically Monitoring Residue In Micro Features

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US Patent:
7317317, Jan 8, 2008
Filed:
Aug 16, 2005
Appl. No.:
11/205635
Inventors:
Bert M. Vermeire - Phoenix AZ, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01R 27/28
G01R 27/04
US Classification:
324627, 324629, 324628
Abstract:
The micro sensor is fabricated with a guard that shields the electrodes from the surrounding environment, thereby reducing loss of measurement signal through the parasitic capacitances to the substrate and fluid. The guards are low impedance points in the circuit that are biased to track as closely as possible the ac voltages of the respective electrodes. Each guard is suitably connected to the output of a guard buffer that supplies the current required to ensure that the guard is at all times at nearly the same voltage as the electrode it is guarding. The micro sensor has an improved signal to noise ratio (SNR) over an extended measurement frequency range (bandwidth) for monitoring in-situ the cleaning and drying processes for high aspect ratio micro features in dielectric films oriented perpendicular to the fluid-solid interface during the manufacture of ICs, MEMS and other micro-devices.

Micro Sensor For Electrochemically Monitoring Residue In Micro Channels

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US Patent:
7332902, Feb 19, 2008
Filed:
Aug 16, 2005
Appl. No.:
11/205582
Inventors:
Bert M. Vermeire - Phoenix AZ, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01N 27/00
G01N 27/26
G01R 27/28
US Classification:
324 714, 324627, 204451, 204452
Abstract:
The present invention provides a micro sensor for monitoring the cleaning and drying processes for very high aspect ratio micro channels in dielectric films oriented parallel to the fluid-solid interface during the manufacture of ICs, MEMS and other micro-devices. The micro sensor can be used to monitor “vertical” micro features common in microelectronics fabrication or “horizontal” micro features found in MEMS or microfluidic fabrication. By forming the micro channels parallel to the interface, the channels can be made with much higher and well controlled aspect ratios. In addition, multiple sensors can sense the impedance at various points along the micro features. The addition of a guard reduces the effects of any parasitic capacitance, which extends the measurement bandwidth of the sensor.

Surface Micro Sensor And Method

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US Patent:
7489141, Feb 10, 2009
Filed:
Aug 16, 2005
Appl. No.:
11/205636
Inventors:
Bert M. Vermeire - Phoenix AZ, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01R 27/00
G01R 27/04
G01R 27/32
G01R 27/08
US Classification:
324646, 324 711, 324693
Abstract:
The present invention provides a micro sensor for monitoring the cleaning and drying processes of surfaces of dielectric films, micro features in porous dielectric films and biologic or other cells common in microelectronics fabrication, MEMS fabrication or microbiology test system fabrication. By embedding electrodes in the surface of a supporting dielectric, the sensor can probe the surface and pores of a covering dielectric or a cell on the covering dielectric. The addition of a guard reduces the effects of any parasitic capacitance, which extends the measurement bandwidth of the sensor and allows it to be manufactured at the scale of a single cell, a feature that is particularly important for applications in microbiology.

Method Of Design Optimization And Monitoring The Clean/Rinse/Dry Processes Of Patterned Wafers Using An Electro-Chemical Residue Sensor (Ecrs)

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US Patent:
7932726, Apr 26, 2011
Filed:
Jan 3, 2008
Appl. No.:
11/968726
Inventors:
Bert M. Vermeire - Mesa AZ, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01R 31/08
G01N 27/00
US Classification:
324525, 324 714
Abstract:
A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The measured impedance can be used to determine what process variables and specifically how process conditions affect the rate of change of the measured impedance. The in-situ measurements are used to design and optimize a production process and/or to monitor the production run in real-time to control the process conditions and transfer of a patterned wafer through the processes.

Method Of Monitoring The Clean/Rinse/Dry Processes Of Patterned Wafers Using An Electro-Chemical Residue Sensor (Ecrs)

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US Patent:
8120368, Feb 21, 2012
Filed:
Mar 14, 2011
Appl. No.:
13/047509
Inventors:
Bert M. Vermeire - Escondido CA, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01R 31/08
G01R 27/08
US Classification:
324525, 324696
Abstract:
A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The measured impedance can be used to determine what process variables and specifically how process conditions affect the rate of change of the measured impedance. The in-situ measurements are used to design and optimize a production process and/or to monitor the production run in real-time to control the process conditions and transfer of a patterned wafer through the processes.

Method Of Manufacture Of Wafers Using An Electro-Chemical Residue Sensor (Ecrs)

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US Patent:
8253422, Aug 28, 2012
Filed:
Mar 15, 2011
Appl. No.:
13/048703
Inventors:
Bert M. Vermeire - Escondido CA, US
Farhang F. Shadman - Tucson AZ, US
Assignee:
Environmental Metrology Corporation - Tucson AZ
International Classification:
G01R 31/08
US Classification:
324525
Abstract:
A method of improving the clean, rinse and dry processes during the manufacture of ICs, MEMS and other micro-devices to conserve solution and energy while completing the process within a specified time. An electro-chemical residue sensor (ECRS) provides in-situ and real-time measurement of residual contamination on a surface or inside void micro features within the sensor representative of conditions on production wafers. The in-situ measurements are used to design and optimize a production process. The wafers are manufactured in accordance with the production process without the ECRS.
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Farhang F Shadman from Tucson, AZ, age ~79 Get Report