Erich K Laetsch

6510223, Jan 21, 2003

Sep 14, 2001

09/952547

Erich K. Laetsch - Reno NV

Anacapa Technology, Inc. - Reno NV

H05K 720

379338, 361690

An improved service access and heat transfer design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by a cover, sealable to the housings sidewall, removable to provide field replaceable, plug-in access to the repeater modules and voltage protector assemblies wherein the voltage protector assemblies can be installed and removed without first removing the repeater modules protected by those voltage protector assemblies and by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. Thermal sleeves, which mount the repeater modules, collect the repeater modules waste heat through thermal interfaces, transfer the waste heat along thermal conduction paths to the housings sidewalls, and then distribute the waste heat over a substantial portion of the housings sidewalls.

6798878, Sep 28, 2004

Nov 26, 2002

10/304795

Erich K. Laetsch - Reno NV

Anacapa Technology, Inc. - Reno NV

H04M 700

379338, 361730

A design for passively cooled telecommunication repeater housings for use in wire transmission in the local loop outside plant provides mounting slots for repeaters and voltage protector assemblies disposed and arranged such that a repeater and its voltage protector assembly can be removed independently of each other by pulling either one in the same direction.

20020085354, Jul 4, 2002

Feb 8, 2001

09/780925

Erich Laetsch - Reno NV, US

H05K007/20

361/688000, 361/704000

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.

20030026415, Feb 6, 2003

Feb 1, 2002

10/062286

Erich Laetsch - Reno NV, US

H04M007/00

379/338000

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis for a thermally enhanced center housing of an 818/819 style repeater housing includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. The thermal collection, transfer and distribution members can be integrated into a thermal chassis.

20030078015, Apr 24, 2003

Nov 26, 2002

10/304779

Erich Laetsch - Reno NV, US

H04B003/36
H04B007/14
H04B001/38

455/090000, 455/007000

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis for a thermally enhanced center housing of an 818/819 style repeater housing includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. The thermal collection, transfer and distribution members can be integrated into a thermal chassis.

20040022385, Feb 5, 2004

Nov 27, 2002

10/306730

Erich Laetsch - Reno NV, US

H04M003/00
H04M001/00

379/338000, 379/325000

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.

62925563, Sep 18, 2001

Nov 6, 1997

8/965630

Erich K. Laetsch - Reno NV

Anacapa Technology, Inc. - Reno NV

H05K 720

379338

An improved thermal design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. A thermal chassis includes thermal collection, transfer and distribution members that collect the repeater modules' waste heat through respective thermal interfaces, transfer the waste heat along respective thermal conduction paths to the environmental enclosure, and then distribute the waste heat over a substantial portion of the enclosure's available surface area to form an enlarged thermal interface for convectively transferring the waste heat to the ambient air. Heat transfer is further improved by expanding the enclosure's external surface area and fabricating the distribution members so that they are in permanent and intimate thermal contact with the enclosure's expanded surface area.