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Eric J Yakobson

from Cheshire, CT
Age ~64
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Also known as:
Eric Living Yakobson, Eric T Yakobson, Eric C Yakobson, Eric E Yakobson, Ernest J Yakobson, Eric Yacobson
Related to:
Saba S Yakobson, 90
Connected to:
Louis Yakobson, 38Solomon Yakoby, 53Gregory D Yakoobian, 90David M Yakopovich, 53Anait Yakoubian, 57Kenneth W Yakovac, 66Aleks V Yakovenko, 40Mariya N Yakovenko, 39Oleg Yakovenko, 36Olga Yakovenko, 42

Eric Yakobson Phones & Addresses

  • Cheshire, CT
  • East Haven, CT
  • 97 Colony Way, Aliso Viejo, CA 92656 (949) 425-3953
  • 76 Colony Way, Aliso Viejo, CA 92656
  • San Juan Capistrano, CA
  • Waterbury, CT
  • Orange, CA
  • Plymouth, CT
  • 97 Colony Way, Aliso Viejo, CA 92656 (949) 230-7415

Work

Position: Service Occupations

Education

Degree: Associate degree or higher

Emails

e***[email protected]

Publications

Us Patents

Cathodic Photoresist Stripping Process

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US Patent:
6436276, Aug 20, 2002
Filed:
Oct 6, 2000
Appl. No.:
09/684199
Inventors:
Eric Yakobson - Aliso Viejo CA
Assignee:
Polyclad Laminates, Inc. - Franklin NH
International Classification:
C25F 500
US Classification:
205703, 205705, 205717, 205723, 205674
Abstract:
A novel photoresist stripping process is disclosed. Specifically, it has been found that if a printed wiring board panel having photoresist on its surface is used as a cathode during electrolysis in an alkaline solution, the result is a rapid and complete photoresist removal with minimal sheeting of removed photoresist and no evidence of chemical attack upon metallic traces on the printed wiring board.

Resist Stripping Process

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US Patent:
6440647, Aug 27, 2002
Filed:
Oct 3, 2000
Appl. No.:
09/678465
Inventors:
Eric Yakobson - Aliso Viejo CA
Assignee:
Alpha Metals, Inc. - Jersey City NJ
International Classification:
G03F 742
US Classification:
430329, 430256, 430258, 430331, 134 13, 510175, 510176
Abstract:
A process for removing patterned negative working resist from the surface of a substrate during manufacture of printed wiring boards is disclosed. The process includes the steps of contacting the patterned resist with a stripping solution containing an alkalinity source as well as a source of ammonium ions. The stripping solution is characterized in that it does not contain volatile organic compounds (VOCs).

Adhesion Promotion In Printed Circuit Boards

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US Patent:
7232478, Jun 19, 2007
Filed:
Jul 14, 2003
Appl. No.:
10/619198
Inventors:
Abayomi I. Owei - Rancho Cucamonga CA, US
Hiep X. Nguyen - West Covina CA, US
Eric Yakobson - Aliso Viejo CA, US
Assignee:
Enthone Inc. - West Haven CT
International Classification:
C23C 22/00
C23C 22/05
C23C 22/52
C23C 22/63
C23F 11/00
US Classification:
106 1441, 106 1444, 10628726, 148243, 148248, 148282, 252 791, 252 792
Abstract:
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Cobalt And Nickel Electroless Plating In Microelectronic Devices

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US Patent:
7332193, Feb 19, 2008
Filed:
Mar 21, 2005
Appl. No.:
11/085304
Inventors:
Charles Valverde - Ansonia CT, US
Nicolai Petrov - Hamden CT, US
Eric Yakobson - Aliso Viejo CA, US
Qingyun Chen - Branford CT, US
Vincent Paneccasio, Jr. - Madison CT, US
Richard Hurtubise - Clinton CT, US
Christian Witt - Woodbridge CT, US
Assignee:
Enthone, Inc. - West Haven CT
International Classification:
C23C 18/16
C23C 18/36
C23C 18/32
US Classification:
427 995, 427437, 4274431
Abstract:
An electroless plating method and composition for depositing Co, Ni, or alloys thereof onto a metal-based substrate in manufacture of microelectronic devices, involving a source of deposition ions selected from the group consisting of Co ions and Ni ions, a reducing agent for reducing the depositions ions to metal onto the substrate, and a hydrazine-based leveling agent.

Capping Of Metal Interconnects In Integrated Circuit Electronic Devices

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US Patent:
7393781, Jul 1, 2008
Filed:
Sep 10, 2007
Appl. No.:
11/852513
Inventors:
Eric Yakobson - Aliso Viejo CA, US
Richard Hurtubise - Clinton CT, US
Christian Witt - Woodbridge CT, US
Qingyun Chen - Branford CT, US
Assignee:
Enthone Inc. - West Haven CT
International Classification:
H01L 21/44
US Classification:
438653, 438656, 438659, 438672, 438674
Abstract:
A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.

Adhesion Promotion In Printed Circuit Boards

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US Patent:
7682432, Mar 23, 2010
Filed:
Jun 7, 2007
Appl. No.:
11/759456
Inventors:
Abayomi I. Owei - Rancho Cucamonga CA, US
Hiep X. Nguyen - Santa Ana CA, US
Eric Yakobson - Aliso Viejo CA, US
Assignee:
Enthone Inc. - West Haven CT
International Classification:
C23C 22/00
C23C 22/05
C23C 22/52
C23C 22/63
C23F 11/00
US Classification:
106 1441, 106 1444, 10628726, 148243, 148248, 148282, 252 791, 252 792
Abstract:
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Adhesion Promotion In Printed Circuit Boards

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US Patent:
8142840, Mar 27, 2012
Filed:
Jun 7, 2007
Appl. No.:
11/759624
Inventors:
Abayomi I. Owei - Rancho Cucamonga CA, US
Hiep X. Nguyen - Santa Ana CA, US
Eric Yakobson - Aliso Viejo CA, US
Assignee:
Enthone Inc. - West Haven CT
International Classification:
C23C 22/02
US Classification:
427 961, 428901
Abstract:
An adhesion promotion process and composition for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The composition contains a corrosion inhibitor, an inorganic acid, and an alcohol which is effective to increase copper-loading in the composition.

Capping Of Metal Interconnects In Integrated Circuit Electronic Devices

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US Patent:
7268074, Sep 11, 2007
Filed:
Jun 14, 2004
Appl. No.:
10/867346
Inventors:
Eric Yakobson - Irvine CA, US
Richard Hurtubise - Clinton CT, US
Christian Witt - Woodbridge CT, US
Qingyun Chen - Branford CT, US
Assignee:
Enthone, Inc. - West Haven CT
International Classification:
H01L 21/44
US Classification:
438653, 438656, 438659, 438672, 438674
Abstract:
A multilayer metal cap over a metal-filled interconnect feature in a dielectric layer for incorporation into a multilayer integrated circuit device, and a method for forming the cap.
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Eric J Yakobson from Cheshire, CT, age ~64 Get Report