Ender Canan E Savrun

20120115709, May 10, 2012

Nov 9, 2010

12/942364

Ender Savrun - Seattle WA, US
Stephanie J. Sawhill - Bothell WA, US

Sienna Technologies, Inc. - Woodinville WA

B01J 32/00
C01G 27/02
B29C 35/02
B01J 37/30
B01J 37/02
C01G 25/02
B01J 21/06

502 11, 502439, 42359412, 42359416, 502328, 502340, 264 28

Ceramic catalyst carriers that are mechanically, thermally and chemically stable in a ionic salt monopropellant decomposition environment, high temperature catalysts for decomposition of liquid high-energy-density monopropellants and ceramic processing techniques for producing spherical catalyst carrier granules are disclosed. The ceramic processing technique is used to produce spherical catalyst carrier granules with controlled porosities and desired composition and allows for reproducible packing densities of catalyst granules in thruster chambers. The ceramic catalyst carrier has excellent thermal shock resistance, good compatibility with the active metal coating and metal coating deposition processes, melting point above >2300 C., chemical resistance to steam, nitrogen oxides and nitric acid, resistance to sintering to prevent void formation, and the absence of phase transition associated with volumetric changes at temperatures up to and beyond 1800 C.

20120192750, Aug 2, 2012

Oct 6, 2008

12/246121

Ender Savrun - Seattle WA, US
Di Wu - Bothell WA, US
Stephanie J. Sawhill - Bothell WA, US

Sienna Technologies, Inc - Woodinville WA

F42B 4/26
C23C 16/06
B65B 1/04
C23C 16/455

102336, 4272481, 427250, 427209, 53473

Methods of producing pyrophoric countermeasure decoy flares include depositing a sculptured thin film of a pyrophoric material onto a substrate using physical vapor deposition. In an example embodiment, physical vapor deposition is performed using a glove box integrated sputtering system. The methods may also include pre-treating the substrate to modify an atomic shadowing effect during pyrophoric material deposition and packaging a plurality of the pyrophoric decoy flares in an airtight container.

20120297779, Nov 29, 2012

May 25, 2011

13/115814

Ender Savrun - Seattle WA, US
Stephanie J. Sawhill - Bothell WA, US

SIENNA TECHNOLOGIES, INC. - Woodinville WA

F02K 1/78
B01J 21/10
B01J 21/06

60770, 502439, 502308, 502349, 502352, 502 11, 502334, 502332, 502339, 502325

Ceramic catalyst carriers that are mechanically, thermally and chemically stable in a ionic salt monopropellant decomposition environment and high temperature catalysts for decomposition of liquid high-energy-density monopropellants are disclosed. The ceramic catalyst carrier has excellent thermal shock resistance, good compatibility with the active metal coating and metal coating deposition processes, melting point above 1800 C., chemical resistance to steam, nitrogen oxides and acids, resistance to sintering to prevent void formation, and the absence of phase transition associated with volumetric changes at temperatures up to and beyond 1800 C.

50682113, Nov 26, 1991

Feb 15, 1991

7/656770

Giovanni Giunchi - Novara, IT
Ender Savrun - Tucson AZ
Alberto Grenni - Segrate Milan, IT
Ching-Fong Chen - Tucson AZ

Keramont Italia S.p.A. - Milan

C04B 3558

501 98

Refractory and electroconductive ceramic compositions having a density higher than 4 g/cm. sup. 3, ultimate tensile strength higher than 250 MPa, Vickers microhardness higher than 1000 kg/mm. sup. 2 and electric resistivity lower than 600 microohm. cm, essentially consisting of alumina and of a nitride component of at least one transition metal belonging to groups IVB, VB or VIB of the Periodic Chart of the Elements.

20160016152, Jan 21, 2016

Sep 16, 2014

14/488070

- Woodinville WA, US
Ender Savrun - Seattle WA, US

B01J 23/63

Ceramic catalyst carriers that are mechanically, thermally and chemically stable in a ionic salt monopropellant decomposition environment and high temperature catalysts for decomposition of liquid high-energy-density monopropellants are disclosed. The ceramic catalyst carrier has excellent thermal shock resistance, good compatibility with the active metal coating and metal coating deposition processes, melting point above 1800 C., chemical resistance to steam, nitrogen oxides and acids, resistance to sintering to prevent void formation, and the absence of phase transition associated with volumetric changes at temperatures up to and beyond 1800 C.