US Patent:
20200342205, Oct 29, 2020
Inventors:
- Cambridge MA, US
Dushan Wadduwage - Cambridge MA, US
Yi Xue - Cambridge MA, US
Elly Nedivi - Newton MA, US
Peter T.C. So - Boston MA, US
Christopher Rowlands - West Kensington, GB
Kalen Berry - Florence KY, US
International Classification:
G06K 9/00
G02B 21/00
G02B 21/16
G02B 21/06
A61B 1/00
G01N 21/64
Abstract:
Systems and methods herein provide improved, high-throughput multiphoton imaging of thick samples with reduced emission scattering. The systems and methods use structured illumination to modify the excitation light. A reconstruction process can be applied to the resulting images to recover image information free of scattering. The disclosed systems and methods provide high throughput, high signal-to-noise ratio, and high resolution images that are depth selective.