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Eli N Holzman

from Thousand Oaks, CA
Age ~84
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Also known as:
Ell Holzman, Eli Holznan, Holzman Ell
Phone and address:
2787 Parkview Dr, Thousand Oaks, CA 91362
(805) 492-0203
Related to:
Dror HolzmanOfer Holzman, 57Monique R Holzman, 56Nurit Holzman, 78Wanee Holzman, 47Oren D Holzman
Connected to:
Adele B Holzman, 41Alice Holzman, 98Arthur J Holzmann, 64Arthur H Holzman, 79Bernard H Holzman, 77Brenda Holzmann, 59Claire G Holzman, 80Ellen S Holzman, 78Janice L Holzman, 82Malcolm S Holzman, 84

Eli Holzman Phones & Addresses

  • 2787 Parkview Dr, Thousand Oaks, CA 91362 (805) 492-0203
  • Newbury Park, CA
  • Moorpark, CA
  • Hopkinton, MA
  • Framingham, MA

Work

Position: Building and Grounds Cleaning and Maintenance Occupations

Education

Degree: High school graduate or higher

Business Records

Name / Title
Company / Classification
Phones & Addresses
Eli Holzman
President
Burbank Post Group Services
3958 Ince Blvd, Los Angeles, CA 90232
6060 Ctr Dr, Los Angeles, CA 90045
30497 Canwood St, Calabasas, CA 91301
Eli Holzman
President
America's Finest Television Corp
Nonclassifiable Establishments · Radio/Television Repair
30497 Canwood St, Calabasas, CA 91301
6060 Ctr Dr, Los Angeles, CA 90045
3958 Ince Blvd, Los Angeles, CA 90232
Eli Holzman
President
ALL3MEDIA USA, Inc
10950 Washington Blvd, Los Angeles, CA 90232
1950 Sawtelle Blvd, Los Angeles, CA 90025
Eli Holzman
President
ZOO PRODUCTIONS
Motion Picture/Tape Distribution
6060 Ctr Dr, Los Angeles, CA 90045
30497 Canwood St, Calabasas, CA 91301
3958 Ince Blvd, Los Angeles, CA 90232
450 N Roxbury Dr, Beverly Hills, CA 90210
(310) 275-4055
Eli Holzman
President
AMALGAMATED CHEDDAR STACKERS, INC
730 Superba Ave, Venice, CA 90291
2000 Ave Of The Stars, Los Angeles, CA 90067
58 Market St, Venice, CA 90291
Eli Holzman
President
TRANS AMERICAN PICTURES
6060 Ctr Dr, Los Angeles, CA 90045
30497 Canwood St, Calabasas, CA 91301
3958 Ince Blvd, Los Angeles, CA 90232
Eli Holzman
President
LET THE GOOD TIMES ROLL, INC
Business Services at Non-Commercial Site
6060 Ctr Dr, Los Angeles, CA 90045
30497 Canwood St, Calabasas, CA 91301
3958 Ince Blvd, Los Angeles, CA 90232
Eli Holzman
President
RENTAL CASE, INC
6060 Ctr Dr, Los Angeles, CA 90045
3958 Ince Blvd, Los Angeles, CA 90232
30497 Canwood St, Calabasas, CA 91301

Publications

Wikipedia References

Eli Holzman Photo 2

Eli Holzman

Us Patents

Method Of Gold Removal From Electronic Components

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US Patent:
8413320, Apr 9, 2013
Filed:
Jan 28, 2011
Appl. No.:
13/016316
Inventors:
Paul B. Hafeli - Ventura CA, US
Eli Holzman - Thousand Oaks CA, US
Aaron J. Stein - Santa Barbara CA, US
Michael Vargas - Goleta CA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H01R 43/00
US Classification:
29825, 29840, 22818022, 228264
Abstract:
In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

Vent Blocking On Vented Ball Grid Arrays To Provide A Cleaner Solution Barrier

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US Patent:
8522426, Sep 3, 2013
Filed:
Jun 5, 2010
Appl. No.:
12/794735
Inventors:
Robert H. Dennis - Haverhill MA, US
Amanda Loehr - Tucson AZ, US
Robert E. Morris - Tucson AZ, US
Peter D. Patalano - North Chelmsford MA, US
Aaron J. Stein - Santa Barbara CA, US
John Stephens - Oxnard CA, US
Harold L. Wieck - Tucson AZ, US
Eli Holzman - Thousand Oaks CA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 3/34
H05K 3/20
H05K 3/30
H05K 3/00
H01R 9/00
H01K 3/10
B29C 65/00
B32B 37/00
G05G 15/00
US Classification:
29840, 29831, 29832, 29843, 29852, 156349
Abstract:
A vented BGA package is reconfigured by first applying a continuous bead of adhesive around the perimeter of the package to seal the gap between the lid and substrate. The continuous bead defines a channel through the pressure relief vents to a polarity through-hole in the lid. The BGA package is reflow soldered to a PWB at an elevated temperature using solder flux, clean or no-clean. The IC die achieves elevated temperature pressure relief through the pressure relief vents along the channel and out the polarity through-hole. After reflow a seal is applied to plug the polarity through-hole. The PWB is washed in an aqueous cleaner solution to remove flux residue. The continuous bead of adhesive and the seal form a cleaner solution barrier that prevents the solution from contacting conductors inside the package. The seal may be removed or left intact depending on the operating environment.

System For Securing A Semiconductor Device To A Printed Circuit Board

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US Patent:
8531821, Sep 10, 2013
Filed:
Jan 28, 2011
Appl. No.:
13/016701
Inventors:
Eli Holzman - Thousand Oaks CA, US
Paul Brian Hafeli - Ventura CA, US
Robert Michael Sterns - Lompoc CA, US
Assignee:
Raytheon Company - Waltham MA
International Classification:
H05K 7/10
H05K 7/12
US Classification:
361676, 361678, 361772, 361774, 361803, 439 66
Abstract:
In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs.

Gold Removal From Electronic Components

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US Patent:
20130186942, Jul 25, 2013
Filed:
Mar 11, 2013
Appl. No.:
13/793846
Inventors:
RAYTHEON COMPANY - Waltham MA, US
Eli Holzman - Thousand Oaks CA, US
Aaron J. Stein - Santa Barbara CA, US
Michael Vargas - Goleta CA, US
Assignee:
RAYTHEON COMPANY - Waltham MA
International Classification:
B23K 31/02
US Classification:
228176
Abstract:
In some embodiments, a method removes gold plating on an electronic component. The method includes forming a gold and solder mixture on the electronic component via a first incrementally controlled heating procedure; incrementally cooling the electronic component via a first cooling procedure; wicking part or all of the gold and solder mixture from the electronic component to a metallic screen via a second incrementally controlled heating procedure; and incrementally cooling the electronic component via a second cooling procedure.

Apparatus For Applying Surface-Mounted Electronic Components To Printed Circuit Boards

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US Patent:
49659278, Oct 30, 1990
Filed:
Sep 21, 1989
Appl. No.:
7/410726
Inventors:
Eli Holzman - Thousand Oaks CA
International Classification:
B23P 1900
B29C 3300
US Classification:
29740
Abstract:
Apparatus for applying surface-mounted electronic components to printed circuit boards incorporates a fixture for populating an entire board in a single operation. The fixture comprises an array of upstanding open-ended tubular guides rigidly supported in a block of elastomeric material. Component-dispensing magazines are inserted into the guides. Novel ejectors in each magazine dispense components from all of the magazines simultaneously.

Wikipedia

Eli Holzman

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Eli Holzman is a creatordeveloper, writer, and producer of several television programs and episodes, but has recently attained his greatest success in ...
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Eli N Holzman from Thousand Oaks, CA, age ~84 Get Report