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Douglas Kye Yip

from Bellevue, WA
Age ~66

Douglas Yip Phones & Addresses

  • 5017 136Th Pl SE, Bellevue, WA 98006 (425) 747-0308
  • 16033 46Th St, Bellevue, WA 98006 (425) 747-0308
  • Redmond, WA
  • Seattle, WA
  • 5017 136Th Pl SE, Bellevue, WA 98006

Work

Position: Professional/Technical

Education

Degree: Graduate or professional degree

Publications

Us Patents

Quasi-Power Measurement Circuit

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US Patent:
48376531, Jun 6, 1989
Filed:
Jun 26, 1987
Appl. No.:
7/067360
Inventors:
Douglas Yip - Bellevue WA
Assignee:
Data I/O Corporation - Redmond WA
International Classification:
H02M 326
US Classification:
361 86
Abstract:
A circuit for signaling when an electrical component is consuming excessive power and for protecting the electrical component from the excessive power. The electrical component is connected to a circuit which supplies and measures the current through and measures the voltage drop across the component. The circuit produces a comparison voltage that represents the sum of the current through and voltage across the component, as normalized according to the maximum current and voltage that are expected to be used by the component. The sum of the values of the current and voltage is an approximation to the power consumed by the electrical component. The comparison voltage is compared to a threshold voltage that represents an approximate maximum power level to be sustained by the component. If the first voltage exceeds the threshold voltage, the comparator produces an overpower signal that can be used to cause the current supply to the electrical component to be interrupted.

Zero Insertion Force Socket For Surface-Mounted Integrated Circuits

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US Patent:
48405760, Jun 20, 1989
Filed:
Oct 14, 1987
Appl. No.:
7/108775
Inventors:
David Nierescher - Renton WA
Douglas Yip - Bellevue WA
Assignee:
Data I/O Corporation - Redmond WA
International Classification:
H01R 1362
US Classification:
439331
Abstract:
A zero insertion force socket for integrated circuits having a contact pattern formed on the upper surface of a resilient circuit on which an integrated circuit is adapted to be placed with its leads in contact with the contact pattern. A plurality of frames having different sized cutouts conforming to the shape of integrated circuit cases of different sizes are used to position integrated circuits having cases of different sizes at predetermined locations on the contact pattern. The positioning frames are pivotally mounted on a common pin, and they nest together so that at least some of the positioning frames fit within the rectangular cutout of the next larger positioning frame. In order to bias the integrated circuit into the resilient circuit, a lid having a plunger is positioned over the integrated circuit. The plunder contacts the upper surface of the integrated circuit case to force it against the resilient circuit either with a constant force or a constant displacement. The plunger may project through the lid when it is displaced by an integrated circuit in order to indicate that an integrated circuit is installed in said socket.

Method And Apparatus For Determining An Internal State Of An Electronic Component

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US Patent:
49982508, Mar 5, 1991
Filed:
Sep 8, 1988
Appl. No.:
7/241617
Inventors:
F. David Kohlmeier - Redmond WA
Kellee Crisafulli - Redmond WA
Stephen A. Kaufer - Seattle WA
John P. Rostykus - Redmond WA
Douglas K. Yip - Bellevue WA
Assignee:
Data I/O Corporation - Redmond WA
International Classification:
G06F 1100
US Classification:
371 151
Abstract:
A method and apparatus for observing an internal state of an electronic component in an electronic system comprising one or more electronic components. The apparatus consists of an electronic switch, a second electronic component, and a control circuit. The electronic switch can be operated in a first mode or a second mode. A first set of terminals on the electronic switch is connectable, in the first mode, to the first component to intercept both the signals being transmitted to the first component by the electronic system and the signals being transmitted by the first component to the electronic system. The electronic switch produces output signals in response to the intercepted signals and transmits them to the second electronic component. The control circuit causes the electronic switch to switch from the first mode to the second mode. In the second mode, the electronic switch can transmit test signals from the control circuit to the second component.
Douglas Kye Yip from Bellevue, WA, age ~66 Get Report