US Patent:
20200035484, Jan 30, 2020
Inventors:
- Fremont CA, US
Bryan BUCKALEW - Tualatin OR, US
Stephen J. BANIK - Portland OR, US
Meng Wee Edwin GOH - Wilsonville OR, US
Joseph RICHARDSON - Sherwood OR, US
Lawrence OSSOWSKI - Tigard OR, US
Marc QUAGLIO - Sherwood OR, US
Douglas HIGLEY - Portland OR, US
International Classification:
H01L 21/02
B08B 3/08
B08B 3/10
B08B 3/14
B08B 3/04
B08B 3/02
B08B 7/04
C25D 5/34
C25D 7/12
H01L 21/288
Abstract:
A wetting tool that provides improved wettability and debris removal from features defined by a patterned resist layer on a substrate. The substrate wetting tool relies on a wetting solution having a pH of 2.0 or less and/or a temperature ranging from 20 to 50 C. With a pH of 2.0 or less, the resist material used to form features chemically reacts, making it more hydrophilic. The wetting solution is therefore attracted into the features, beneficially reducing the chance of bubble formation and removing debris. At elevated temperatures, the heated wetting solution improves particle de-lamination and aids in dissolving debris and oxides from the substrate surface.
