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Dongshun Bai

from Rolla, MO
Age ~52
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Related to:
Jingyi Bai, 26Jia Bai, 39
Connected to:
Billy Y Bai, 59Bruce X Bai, 58Cheng Bai, 60Guang Bai, 61Isaac Bai, 78Joy Bai, 70Kai Bai, 28Laxmi Bai, 101Lili Bai, 39Liqun Bai, 58

Dongshun Bai Phones & Addresses

  • 1021 Cobblestone Dr, Rolla, MO 65401 (573) 426-3657
  • 807 Halifax Dr, Rolla, MO 65401 (573) 426-3657
  • 3322 Fairmont Ct, Nashville, TN 37203 (615) 269-3898 (615) 383-4489
  • 1808 State St, Nashville, TN 37203 (615) 327-9247
  • 1808 State St, Nashville, TN 37203 (615) 479-0247

Work

Company: Brewer science Jan 2011 Position: Scientist

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Vanderbilt University 2002 to 2007 Specialities: Chemical Engineering, Philosophy

Industries

Semiconductors

Resumes

Resumes

Dongshun Bai Photo 1

Scientist

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Location:
2401 Brewer Dr, Rolla, MO 65401
Industry:
Semiconductors
Work:
Brewer Science
Scientist
Education:
Vanderbilt University 2002 - 2007
Doctorates, Doctor of Philosophy, Chemical Engineering, Philosophy

Publications

Us Patents

Cyclic Olefin Compositions For Temporary Wafer Bonding

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US Patent:
8221571, Jul 17, 2012
Filed:
Dec 15, 2010
Appl. No.:
12/969367
Inventors:
Wenbin Hong - Rolla MO, US
Dongshun Bai - Rolla MO, US
Tony D. Flaim - St. James MO, US
Rama Puligadda - Rolla MO, US
Assignee:
Brewer Science Inc. - Rolla MO
International Classification:
B29C 53/82
B29C 65/00
B32B 3/00
B32B 5/00
US Classification:
156155, 156 60, 156153, 156154, 156325, 4281951
Abstract:
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Cyclic Olefin Compositions For Temporary Wafer Bonding

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US Patent:
20100112305, May 6, 2010
Filed:
Oct 31, 2008
Appl. No.:
12/263120
Inventors:
Wenbin Hong - Rolla MO, US
Dongshun Bai - Rolla MO, US
Tony D. Flaim - St. James MO, US
Rama Puligadda - Rolla MO, US
International Classification:
B32B 5/00
C08L 65/00
C08L 93/00
C08L 93/04
C08K 5/51
C08K 5/13
B29C 63/00
B32B 37/00
US Classification:
4281951, 525416, 524500, 524270, 524414, 524384, 524115, 156344, 156247
Abstract:
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Cyclic Olefin Compositions For Temporary Wafer Bonding

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US Patent:
20120291938, Nov 22, 2012
Filed:
Jul 13, 2012
Appl. No.:
13/548674
Inventors:
Wenbin Hong - Rolla MO, US
Dongshun Bai - Rolla MO, US
Tony D. Flaim - James MO, US
Rama Puligadda - Rolla MO, US
International Classification:
B29C 65/52
US Classification:
156 60
Abstract:
New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.

Laser-Releasable Bonding Materials For 3-D Ic Applications

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US Patent:
20190194453, Jun 27, 2019
Filed:
Dec 21, 2018
Appl. No.:
16/229591
Inventors:
- Rolla MO, US
Qi Wu - Rolla MO, US
Rama Puligadda - Rolla MO, US
Dongshun Bai - Rolla MO, US
Baron Huang - Taipei, TW
International Classification:
C08L 71/12
H01L 23/00
H01L 23/31
H01L 23/528
Abstract:
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

Polyimides As Laser Release Materials For 3-D Ic Applications

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US Patent:
20160023436, Jan 28, 2016
Filed:
Jul 22, 2015
Appl. No.:
14/805898
Inventors:
- Rolla MO, US
Dongshun Bai - Rolla MO, US
Tony D. Flaim - St. James MO, US
Xing-Fu Zhong - Rolla MO, US
Qi Wu - Rolla MO, US
International Classification:
B32B 7/06
B32B 37/14
B32B 27/06
B05D 3/00
Abstract:
The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250 C. to about 350 C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
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Dongshun Bai from Rolla, MO, age ~52 Get Report