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Donald S Eisenberg

from Carlsbad, CA
Age ~85
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Also known as:
Donald C Eisenberg, Donald E Isenberg
Phone and address:
7259 Spoonbill Ln, Carlsbad, CA 92011
(760) 518-5737
Related to:
Douglas Eisenberg, 69Irene HymanHarris Silver
Connected to:
Alison R Eisenbeis, 44Alvin S Eisenberg, 101Brittany P Eisenberg, 29Catherine Eisenbeil, 45Cheri F Eisenberg, 72Dara A Eisenberg, 38Dianna R Eisenberg, 61Dianne J Eisenberg, 81Edwin J Eisenbeisz, 63Elana D Eisenberg, 44

Donald Eisenberg Phones & Addresses

  • 7259 Spoonbill Ln, Carlsbad, CA 92011 (760) 518-5737
  • 1311 Cassins St, Carlsbad, CA 92008
  • Lauderhill, FL
  • Weston, CT
  • San Diego, CA
  • Del Mar, CA
  • Westport, CT

Resumes

Resumes

Donald Eisenberg Photo 1

President

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Location:
7259 Spoonbill Ln, Carlsbad, CA 92011
Industry:
Electrical/Electronic Manufacturing
Work:
Autosplice Jul 1995 - Jul 2005
President and Chief Operations Officer
Emr Associates Jul 1995 - Jul 2005
President
Interplex Industies Jul 1995 - Jul 2005
Consultant
Board of Advisors Pmt Jul 1995 - Jul 2005
Consultant
Amphenol 1993 - 1995
General Manager, Tape Cable Division
Education:
Baruch College 1963 - 1969
Master of Business Administration, Masters, Management The Cooper Union For the Advancement of Science and Art 1957 - 1961
Bachelor of Science In Mechanical Engineering, Bachelors, Mechanical Engineering
Skills:
Manufacturing
Lean Manufacturing
Cross Functional Team Leadership
Electronics
Product Development
Six Sigma
Engineering
Continuous Improvement
Product Management
New Business Development
Spc
Manufacturing Operations Management
Supply Chain Management
Engineering Management
Product Marketing
Sales Management
Injection Molding
Fmea
Kaizen
Donald Eisenberg Photo 2

Donald Eisenberg

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Donald S. Eisenberg
President
EMR ASSOCIATES, LTD
7259 Spoonbill Ln, Carlsbad, CA 92011
1311 Cassins St, Carlsbad, CA 92011
Donald Eisenberg
President
DOWN THE HALL SERVICES, INC
1601 N Palm Ave SUITE 310C, Hollywood, FL 33026
Donald Eisenberg
Director
National Self-Defense Institute, Inc
1601 N Palm Ave, Hollywood, FL 33026
310 1601 N Palm Ave, Hollywood, FL 33026
Donald S. Eisenberg
Principal
Day Dreamer
Business Services at Non-Commercial Site
1311 Cassins St, Carlsbad, CA 92011
Donald Eisenberg
Secretary
National Charity Services, Inc
Management Consulting Services
1601 N Palm Ave, Hollywood, FL 33026
1905 Brentwood Rd NE, Washington, DC 20018
PO Box 90967, Washington, DC 20090
(202) 461-2054
Donald Eisenberg
Treasurer
Capital Auto Tracking Systems, LLC
Business Services
1601 N Palm Ave, Hollywood, FL 33026
Donald Eisenberg
Secretary
The Third Floor Company, Inc
Ret Floor Covering
1601 N Palm Ave, Hollywood, FL 33026
Donald Eisenberg
INSIDE OUT THEATRE COMPANY, INC
492 Carrington Ln, Fort Lauderdale, FL 33326
Fort Lauderdale, FL 33326
701 SW 113 Ter, Hollywood, FL 33025

Publications

Us Patents

Solder Reserve Transfer Device And Process

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US Patent:
6780028, Aug 24, 2004
Filed:
Dec 6, 2002
Appl. No.:
10/310215
Inventors:
Craig M. Kennedy - San Marcos CA
Donald S. Eisenberg - Carlsbad CA
Assignee:
Autosplice Systems Inc. - San Diego CA
International Classification:
H01R 1200
US Classification:
439 83, 439876
Abstract:
A solder transfer method which uses an electrically-conductive, e. g. , metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Solder Reserve Transfer Device And Process

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US Patent:
6976855, Dec 20, 2005
Filed:
May 13, 2004
Appl. No.:
10/843972
Inventors:
Craig M. Kennedy - San Marcos CA, US
Donald S. Eisenberg - Carlsbad CA, US
Assignee:
Auto Splice Systems Inc. - San Diego CA
International Classification:
H01R009/09
US Classification:
439 83, 439876
Abstract:
A solder transfer method which uses an electrically-conductive, e. g. , metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In one of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.

Non-Skew Cable Assembly And Method Of Making The Same

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US Patent:
57674426, Jun 16, 1998
Filed:
Dec 22, 1995
Appl. No.:
8/577937
Inventors:
Donald Eisenberg - Weston CT
Carl S. Booth - Storrs CT
William H. Pendleton - Cheshire CT
Assignee:
Amphenol Corporation - Wallingford CT
International Classification:
H01B 328
H01B 906
US Classification:
174 36
Abstract:
A cable assembly includes a plurality of insulated wires that are arranged in groups of one or more wires with adjacent pairs of the groups being interconnected at any given longitudinal location over the length of the cable. Therefore, the cable defines spaced attachment zones and unattached zones for the groups of wires along the length of the cable with each of the attachment zones including the interconnection of only a single pair of the groups of wires, successive attachment zones being spaced by a respective unattached zone and successive attachment zones interconnecting alternating pairs of the groups of wires. All of the wires are preferably encased in a flexible jacket having a substantially circular cross-section. With this arrangement, the wires extend for the length of the cable without skew and yet the overall cable is extremely flexible.

Bi-Level Card Edge Connector And Method Of Making The Same

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US Patent:
49349619, Jun 19, 1990
Filed:
Dec 21, 1988
Appl. No.:
7/287765
Inventors:
Heinz Piorunneck - Trumbull CT
Donald S. Eisenberg - Weston CT
Assignee:
Burndy Corporation - Norwalk CT
International Classification:
H05K 100
US Classification:
439637
Abstract:
A bi-level connector for making mechanical and electrical contact between a mother printed circuit board and a daughter printed circuit board. The connector comprises lower level contacts with a varied spring rate when a daughter printed circuit board is inserted. The method of manufacturing the connector comprises forming a strip of two types of contacts, upper contacts and lower contacts, on a single carry strip in alternating fashion such that both the upper and lower contacts can be simultaneously inserted into a connector housing in a single insertion process.

Bi-Level Card Edge Connector And Method Of Making The Same

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US Patent:
49967665, Mar 5, 1991
Filed:
Feb 7, 1990
Appl. No.:
7/476944
Inventors:
Heinz Piorunneck - Trumbull CT
Donald S. Eisenberg - Weston CT
Assignee:
Burndy Corporation - Norwalk CT
International Classification:
H01R 900
US Classification:
29842
Abstract:
A bi-level connector for making mechanical and electrical contact between a mother printed circuit board and a daughter printed circuit board. The connector comprises lower level contacts with a varied spring rate when a daughter printed circuit board is inserted. The method of manufacturing the connector comprises forming a strip of two types of contacts, upper contacts and lower contacts, on a single carry strip in alternating fashion such that both the upper and lower contacts can be simultaneously inserted into a connector housing in a single insertion process.
Control profile
Donald S Eisenberg from Carlsbad, CA, age ~85 Get Report