Don L Kleyer

6361716, Mar 26, 2002

Jul 20, 2000

09/620179

Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08K 302

252514, 524398, 524261, 524266, 524267, 524588, 525479, 528 15, 528 31, 528 32

A curable silicone composition for preparing a silicone adhesive, the composition comprising (A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule; (B) an organohydrogenpolysiloxane containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound is free of acetylenic hydroxy groups and the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a hydrosilylation catalyst. A silicone adhesive and a multi-part curable silicone composition.

6433055, Aug 13, 2002

Sep 13, 2000

09/661416

Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08K 505

524379, 156329, 252514, 25251931, 524398, 524588

An electrically conductive hot-melt silicone adhesive composition, comprising (A) a hot-melt silicone adhesive; (B) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (C) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided that when the composition is curable, the compound does not substantially inhibit cure.

6433057, Aug 13, 2002

Mar 28, 2000

09/536845

Dorab Edul Bhagwagar - Saginaw MI
Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08K 310

524403, 524785, 524780, 524588, 252514

A silicone composition, comprising (A) 10 to 50 parts by weight of a polydiorganosiloxane having the formula R SiO(R SiO) SiR wherein each R is independently a monovalent aliphatic hydrocarbon group or a monovalent halogenated aliphatic hydrocarbon group, n has a value such that the polydiorganosiloxane has a viscosity from 0. 1 to 200 PaÂs at 25Â C. , and the polydiorganosiloxane contains an average of at least two alkenyl groups per molecule; (B) 50 to 90 parts by weight of an organopolysiloxane resin consisting essentially of R SiO siloxane units and SiO siloxane units wherein each R is independently alkyl or alkenyl, the mole ratio of R SiO units to SiO units is from 0. 65 to 1. 9, the resin contains an average of from about 3 to 30 mole percent of alkenyl groups, and the total amount of components (A) and (B) is 100 parts by weight; (C) an organohydrogenpolysiloxane having an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition; (D) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the composition; and (E) a catalytic amount of a hydrosilylation catalyst. An electrically conductive silicone adhesive comprising a reaction product of the above-described composition and a multi-part silicone composition comprising components (A) through (E) in two or more parts, provided neither component (A) nor component (B) are present with components (C) and (E) in the same part.

6465550, Oct 15, 2002

Aug 8, 2000

09/633997

Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08L 8304

524268, 252514, 2525203, 524440, 524588, 528 16, 528 26, 528 34

A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecules; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

6534581, Mar 18, 2003

Jul 20, 2000

09/620397

Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08K 505

524379, 252514, 524398, 524266, 524268, 524439, 524440, 524588, 524858, 528 18, 528 34, 528 38

A silicone composition for preparing a silicone adhesive, the composition prepared by mixing (A) an organopolysiloxane containing an average of at least two silicon-bonded hydroxy groups per molecule; (B) a crosslinking agent in an amount sufficient to cure the composition; wherein the agent is selected from (i) at least one silane having the formula R SiX wherein each R is independently selected from monovalent hydrocarbon and monovalent halogenated hydrocarbon groups having from 1 to about 8 carbon atoms, n is 0 or 1, and X is âOR or âOCH CH OR ; (ii) a partial hydrolyzate of (i), and (iii) mixtures comprising (i) and (ii); (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone adhesive, wherein the filler comprises particles having at least an outer surface of a metal selected from the group consisting of silver, gold, platinum, palladium, and alloys thereof; (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition; and (E) a catalytic amount of a condensation catalyst comprising a metal salt of a carboxylic acid. A silicone adhesive and a multi-part curable silicone composition.

6831145, Dec 14, 2004

Aug 23, 2002

10/226396

Don Lee Kleyer - Hemlock MI
Michael Andrew Lutz - Hope MI

Dow Corning Corporation - Midland MI

C08G 7708

528 23, 528 25, 524379, 524385, 524386, 524387, 524439, 524440, 524588

A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the composition, provided the curing agent is free of phenolic hydroxy groups; (C) an electrically conductive filler in an amount sufficient to impart electrical conductivity to the silicone product, wherein the filler comprises particles having at least an outer surface of a metal selected from silver, gold, platinum, palladium, and alloys thereof; and (D) an effective amount of a hydroxy-functional organic compound having a molecular weight up to about 1000 and containing at least one hydroxy group per molecule, provided the compound does not substantially inhibit cure of the composition. A cured silicone product and a multi-part silicone composition.

8211544, Jul 3, 2012

Mar 30, 2006

11/910356

Yasuo Itami - Osaka, JP
Tetsuya Masutani - Osaka, JP
Peter C. Hupfield - South Glamorgan, GB
Don Lee Kleyer - Midland MI, US

Daikin Industries, Ltd. - Osaka-shi, Osaka
Dow Corning Corporation - Midland MI

B32B 27/04
B32B 17/06

428429, 428447, 528 25, 528 31, 528 42, 528 15

A surface modifier comprising an organosilicone compound represented by General Formula (A) and/or General Formula (B): F—(CF)—(OCF)—(OCF)—(OCF)(CH)X(CH)Si(X′)(R)(A) and F—(CF)—(OCF)—(OCF)—(OCF)(CH)X(CH)(X′)(R)SiO(F—(CF)—(OCF)—(OCF)—(OCF)(CH)X(CH)(X′)(R)SiO)F—(CF)—(OCF)—(OCF)—(OCF)(CH)X(CH)(X′)(R)Si (B) wherein q is an integer from 1 to 3; m, n, and o are independently integers from 0 to 200; p is 1 or 2; X is O or a bivalent organic group; r is an integer from 2 to 20; Ris a Clinear or branched hydrocarbon group; a is an integer from 0 to 2; X′ is hydrolysable group; and z is an integer from 0 to 10 when a is 0 or 1.

8247357, Aug 21, 2012

Jan 22, 2008

12/525573

Eric Jude Joffre - Midland MI, US
Don Kleyer - Hemlock MI, US

Dow Corning Corporation - Midland MI

C10M 125/26
C10M 155/02

508202, 508208

A composition includes (i) a matrix, (ii) a filler, and (iii) a filler treating agent; where the filler treating agent comprises a polyorganosiloxane capable of hydrogen bonding. The filler treating agent can be a saccharide-siloxane polymer, an amino-functional polyorganosiloxane, or a combination thereof.