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Dirk M Baars

from Phoenix, AZ
Age ~65
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Also known as:
Dirk Barrs
Phone and address:
5445 E Osborn Rd, Phoenix, AZ 85018
(860) 539-9280
Related to:
Brian E Baars
Connected to:
Heike Baars, 56Jacqueline M Baars, 94Timothy Baars, 40Tina M Baars, 59Christopher S Baarstad, 39Nadine P Baarstad, 58Jennifer S Baartman, 35John M Baartz, 55Rebecca L Baarz, 46Alexander T Baas, 32

Dirk Baars Phones & Addresses

  • 5445 E Osborn Rd, Phoenix, AZ 85018 (860) 539-9280
  • Saint Louis, MO
  • 35 Cambridge Dr, South Windsor, CT 06074 (860) 432-2283 (860) 648-2669
  • 20 Kevin Dr, East Windsor, CT 06088
  • Filer, ID
  • Brighton, MA
  • Maricopa, AZ
  • East Windsor Hill, CT

Work

Company: Rogers corporation Jan 2019 Position: Director, innovation center west

Education

Degree: Master of Science, Masters, Bachelors, Bachelor of Science School / High School: Massachusetts Institute of Technology 1977 to 1981 Specialities: Chemical Engineering

Skills

Cross Functional Team Leadership

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Dirk Baars Photo 1

Director, Innovation Center West

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Location:
Phoenix, AZ
Industry:
Electrical/Electronic Manufacturing
Work:
Rogers Corporation
Director, Innovation Center West
Rogers Corporation 1991 - 2000
Vice President and General Manager, Molding Materials Division
Rogers Corporation 1991 - 2000
Director, Advanced Materials Group at Rogers Corporation
Albany International 1981 - 1987
Research Engineer
Education:
Massachusetts Institute of Technology 1977 - 1981
Master of Science, Masters, Bachelors, Bachelor of Science, Chemical Engineering
Skills:
Cross Functional Team Leadership

Publications

Us Patents

Apparatus And Method Of Manufacture Of Electrochemical Cell Components

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US Patent:
7138203, Nov 21, 2006
Filed:
Aug 7, 2003
Appl. No.:
10/638117
Inventors:
Dirk M. Baars - South Windsor CT, US
Hillary P. Borges - Pomfret Center CT, US
Seung B. Chun - Pomfret Center CT, US
Assignee:
World Properties, Inc. - Lincolnwood IL
International Classification:
H01M 2/08
H01M 8/04
H01M 2/14
US Classification:
429 36, 429 26, 429 38
Abstract:
A component for an electrochemical cell comprises a thermally and electrically conductive core, wherein the conductive core comprises apertures, and wherein the conductive core further comprises an active area substantially covered by an electrically and thermally conductive polymeric composite. The conductive polymeric composite is adhered to the core by an adhesion promoter comprising electrically conductive particles to reduce the volume resistivity of the component, and an optional adhesive composition. Components may be manufactured having a volume resistivity of about 0. 500 ohm-cm or less and a thermal conductivity of at least about 5 watts/meter K. In addition, the component is economical to produce due to inexpensive starting materials as well as the use of conventional processing equipment.

Circuit Materials, Circuits Laminates, And Method Of Manufacture Thereof

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US Patent:
8187696, May 29, 2012
Filed:
Jul 17, 2009
Appl. No.:
12/504996
Inventors:
Sankar K. Paul - Bradford CT, US
Christopher J. Caisse - Danielson CT, US
Dirk M. Baars - South Windsor CT, US
Assignee:
World Properties, Inc. - Lincolnwood IL
International Classification:
B32B 15/00
US Classification:
428209, 4283202, 428323, 428325, 428327, 174148, 174149 R, 174250, 174258, 42721334, 1562755, 1563082, 1563096
Abstract:
A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3. 5 and a dissipation factor of less than about 0. 006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.

Circuit Materials With Improved Bond, Method Of Manufacture Thereof, And Articles Formed Therefrom

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US Patent:
8257820, Sep 4, 2012
Filed:
Feb 13, 2009
Appl. No.:
12/370806
Inventors:
Sankar Paul - Branford CT, US
Dirk M. Baars - South Windsor CT, US
Assignee:
World Properties, Inc. - Lincolnwood IL
International Classification:
B32B 7/12
B32B 27/32
US Classification:
4281951, 428523, 428492, 428515, 428494, 428219, 428344, 428500
Abstract:
A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Circuit Materials With Improved Bond, Method Of Manufacture Thereof, And Articles Formed Therefrom

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US Patent:
8519273, Aug 27, 2013
Filed:
Feb 13, 2009
Appl. No.:
12/937018
Inventors:
Sankar Paul - Branford CT, US
Dirk M. Baars - South Windsor CT, US
International Classification:
H05K 1/00
US Classification:
174258, 174256, 174259, 174255
Abstract:
A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Dielectric Materials, Methods Of Forming Subassemblies Therefrom, And The Subassemblies Formed Therewith

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US Patent:
8632874, Jan 21, 2014
Filed:
Aug 23, 2010
Appl. No.:
12/813556
Inventors:
Sankar Paul - Bradford CT, US
Scott D. Kennedy - Pomfret Center CT, US
Dirk M. Baars - South Windsor CT, US
Assignee:
Rogers Corporation - Rogers CT
International Classification:
B32B 25/02
B32B 25/08
H01L 49/00
US Classification:
4281951, 428334, 428422, 428521, 428901
Abstract:
A circuit subassembly, comprising a dielectric layer formed from a dielectric composition comprising, based on the total volume of the composition: about 15 to about 65 volume percent of a dielectric filler; and about 35 to about 85 volume percent of a thermosetting composition comprising: a poly(arylene ether), and a carboxy-functionalized polybutadiene or polyisoprene polymer.

Circuit Board Materials With Improved Bond To Conductive Metals And Methods Of The Manufacture Thereof

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US Patent:
20070093035, Apr 26, 2007
Filed:
Oct 19, 2006
Appl. No.:
11/583999
Inventors:
Robert Daigle - Amston CT, US
Amit Das - State College PA, US
Sankar Paul - Branford CT, US
Dirk Baars - South Windsor CT, US
Allen Horn - Pomfret Center CT, US
International Classification:
H01L 21/30
H01L 21/46
US Classification:
438455000, 438458000
Abstract:
Use of a roughened dielectric layer between a dielectric substrate and a conductive layer, which allows increased adhesion between layers without the conductor loss associated with roughened conductor layers, as well as improved accuracy in etching. The method is widely applicable to a variety of dielectric substrate and conductive layer constructions, and can be readily tuned to provide the desired level of adhesion and other advantageous properties.

Dielectric Bond Plies For Circuits And Multilayer Circuits, And Methods Of Manufacture Thereof

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US Patent:
20110214906, Sep 8, 2011
Filed:
Mar 4, 2011
Appl. No.:
13/040532
Inventors:
Dirk M. Baars - South Windsor CT, US
Dale J. Doyle - Santee CA, US
Sankar K. Paul - Branford CT, US
Diana J. Williams - Queen Creek AZ, US
Carlos L. Barton - Brooklyn CT, US
Assignee:
ROGERS CORPORATION - Rogers CT
International Classification:
H05K 1/09
B32B 27/04
B32B 27/38
H05K 1/00
H05K 1/11
B05D 5/12
B44C 1/17
B32B 37/00
US Classification:
174257, 428349, 428213, 174250, 174262, 427 58, 156235, 156297
Abstract:
A bond ply, comprising a first outer layer comprising a thermosetting composition and a filler composition; a second outer layer comprising a thermosetting composition and a filler composition that is of the same type as that of the first outer layer; and an intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting composition and a filler composition that is of the same type as the first and second outer layers, wherein the thermosetting composition of the intermediate layer has a degree of cure that is greater than a degree of cure for each of the thermosetting compositions of the first and the second outer layers.

Modified Seam Felt

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US Patent:
49486462, Aug 14, 1990
Filed:
Nov 7, 1989
Appl. No.:
7/432799
Inventors:
Ellen Lasinsky - Dedham MA
Dirk M. Baars - East Windsor CT
Assignee:
Albany International Corp. - Albany NY
International Classification:
B32B 502
US Classification:
428 60
Abstract:
The invention provides a press felt seam comprising a first felt end and a second felt end interconnected by hinge means wherein the soft cover layer on the first felt end is configured to provide a flap element overlaying said hinge means, and the soft cover layer on the second end is configured to support said flap. The surface of said flap contiguous the hinge means is provided with a resilient support material to impart to the seam area a compression recovered thickness substantially equal to or slightly greater than the rest of the felt.
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Dirk M Baars from Phoenix, AZ, age ~65 Get Report