Delrae H Gardner

7283255, Oct 16, 2007

Mar 1, 2006

11/364972

Craig C. Ramsey - West Linn OR, US
Jeffrey K. Lassahn - Portland OR, US
Greg Huntzinger - West Linn OR, US
DelRae H. Gardner - Tualatin OR, US

CyberOptics Semiconductor, Inc. - Beaverton OR

G01B 11/14

356620, 356614

A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

7289230, Oct 30, 2007

Jan 31, 2003

10/356684

Craig C. Ramsey - West Linn OR, US
Jeffrey K. Lassahn - Portland OR, US
Greg Huntzinger - West Linn OR, US
DelRae H. Gardner - Tualatin OR, US

CyberOptics Semiconductors, Inc. - Beaverton OR

G01B 11/26
G01B 11/14
G01C 1/00
G01N 21/86
G01V 8/00
G01R 31/26
H01L 21/66
G06K 9/00

356622, 356138, 35613903, 3561391, 356147, 356614, 25055929, 25055938, 382151, 438 16, 414935

A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

7456977, Nov 25, 2008

Mar 15, 2006

11/375925

Craig C. Ramsey - West Linn OR, US
Jeffrey K. Lassahn - Portland OR, US
Greg Huntzinger - West Linn OR, US
DelRae H. Gardner - Tualatin OR, US

CyberOptics Semiconductor, Inc. - Beaverton OR

G01B 11/14
H04N 7/18
H04N 9/47
G06K 9/00
G05B 19/18
G05B 15/00
G05B 19/00
G01C 9/00
G01C 17/00
G01C 19/00
G06F 15/00

356620, 356614, 348 94, 348 95, 382153, 382154, 700 56, 700259, 702150, 702152, 702153

A wireless substrate-like sensor is provided to facilitate alignment and calibration of semiconductor processing systems. The wireless substrate-like sensor includes an optical image acquisition system that acquires one or more images of targets placed within the semiconductor processing system. Analysis of images of the targets obtained by the wireless substrate-like sensor provides position and/or orientation information in at least three degrees of freedom. An additional target is affixed to a known location within the semiconductor processing system such that imaging the reference position with the wireless substrate-like sensor allows the measurement and compensation for pick-up errors.

7804306, Sep 28, 2010

Feb 20, 2007

11/708653

DelRae H. Gardner - Tualatin OR, US
Craig C. Ramsey - West Linn OR, US
Dana L Patelzick - West Linn OR, US

CyterOptics Semiconductor, Inc. - Wilsonviller OR

G01R 27/26

324662, 324686

A wireless sensor includes at least one capacitive plate for sensing a distance relative to an object of interest within a semiconductor-processing environment. The sensor includes an internal power source and wireless communication such that distance and/or parallelism measurements effected using the capacitive plate(s) can be provided wirelessly to an external device.

7893697, Feb 22, 2011

Mar 26, 2008

12/055758

Craig C. Ramsey - West Linn OR, US
DelRae H. Gardner - Tualatin OR, US

CyberOptics Semiconductor, Inc. - Wilsonville OR

G01R 27/26

324662, 324686

A sensor for sensing a gap between the sensor and an object of interest within a semiconductor processing chamber is provided. The sensor includes a housing, a power source inside the housing, wireless communication circuitry, a controller, measurement circuitry and a plurality of capacitive plate pairs. The controller and wireless communication circuitry are coupled to each other, and to the power source. The plurality of capacitive plate pairs are configured to form capacitors having a capacitance that varies with the gap. Measurement circuitry is coupled to the controller and to the plurality of capacitive plate pairs. The measurement circuitry is configured to measure the capacitance of the capacitive plate pairs and provide indications thereof to the controller. The controller is configured to provide an indication relative to the gap based, at least in part, upon the measured capacitances.

20050086024, Apr 21, 2005

Sep 15, 2004

10/941646

Edward Seeberger - Portland OR, US
DelRae Gardner - Tualatin OR, US
Felix Schuda - Saratoga CA, US
Craig Ramsey - West Linn OR, US

CyberOptics Semiconductor Inc. - Portland OR

G06F015/00

702150000

Embodiments of the present invention generally provide accurate spatial determination, in three dimensions, of the wafer location, along with the provision of information about the presence of any error conditions relative to the wafer(s) such as cross slotting or double stacked wafers inside the wafer carrier. A device in accordance with an embodiment of the invention can be used in conjunction with a wafer handling system which requires the measurement of a wafer's location before it can be picked up and passed through a set of processing steps.

20050224899, Oct 13, 2005

Mar 8, 2005

11/075357

Craig Ramsey - West Linn OR, US
DelRae Gardner - Tualatin OR, US
Jeffrey Lassahn - Portland OR, US

H01L027/14
H01L029/82
H01L029/84

257414000, 257417000, 257682000

In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor is sealed except for one or more apertures. In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture is coupled to a pressure equalization member that deforms in response to a differential in pressure between the sensor interior and exterior.

20050224902, Oct 13, 2005

Mar 8, 2005

11/075363

Craig Ramsey - West Linn OR, US
DelRae Gardner - Tualatin OR, US
Jeffrey Lassahn - Portland OR, US

H01L021/338

257433000, 257434000

In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to be low-profile. One exemplary low-profile design includes using an image acquisition system on a leadless ceramic carrier chip. Then a circuit board, or rigid interconnect, is provided with a recess to accommodate the image acquisition system. The image acquisition system is disposed within the recess and coupled to the board through the periphery of the leadless ceramic carrier chip.