Deana Rae Delp

7154256, Dec 26, 2006

Feb 27, 2003

10/504159

Richard Parsons - Phoenix AZ, US
Robert Jackson - Gilbert AZ, US
Deana R. Delp - Tempe AZ, US

Tokyo Electron Limited - Tokyo

G01R 31/02

324 72, 324 725, 324713

Integrated voltage and current (VI) probe () for integration inside a transmission line () having inner () and an outer () conductors. Current probes, often implemented as loop antennas, can be coupled to the outer conductor. The probes can either be built onto the same panel or on different panels.

7158845, Jan 2, 2007

Oct 31, 2002

10/493470

Richard Parsons - Phoenix AZ, US
Deana R. Delp - Tempe AZ, US

Tokyo Electron Limited - Tokyo

G06F 19/00

700 96, 700 83, 700222, 702188, 715736

A process monitoring system () for monitoring a plasma processing system. The process monitoring system () includes a plurality of processing subsystems (), and a control system () coupled to the processing subsystems (). The control system () is configured to receive monitor data from the processing subsystems () and send control data to the processing subsystems (). The process monitoring system () also includes an external interface () coupled to the control system (), where the external interface () includes a paging system. The process monitoring system further includes a man-machine interface (MMI) coupled to the control system (). The MMI is configured to display the monitor data, display the control data, and access the paging system.

20040250108, Dec 9, 2004

Mar 1, 2004

10/486365

Richard Parsons - Phoenix AZ, US
Deana Delp - Tempe AZ, US

H04L009/32

713/200000

The facility monitor () is used to monitor and collect measured parameter data and alarm status data for a facility (), such as a semiconductor processing facility. A graphical user interface (GUI) is used for monitoring the current status () and accessing the system history of the facility (). The GUI provides easily readable screens where the graphical display is organized so that the measured parameter data is logically presented to the user, alarm status data are clearly indicated to the user, and the user can efficiently review the data and respond.

20050087515, Apr 28, 2005

Aug 12, 2004

10/916386

Deana Delp - Tempe AZ, US

TOKYO ELECTRON LIMITED - Minato-ku

C23F001/00

216060000

A method and system for determining an endpoint in a (near) real-time environment using statistical process control. By utilizing such control, an endpoint of a semiconductor process (e.g., an etch) can be monitored. Monitoring may lead to increased yields by avoiding or reducing error conditions (e.g., under- or over-etching).

20050199341, Sep 15, 2005

Mar 30, 2005

11/093277

Deana Delp - Tempe AZ, US
Lee Chen - Cedar Creek TX, US

TOKYO ELECTRON LIMITED - Tokyo

C23F001/00

156345240, 216059000

A method and system for analyzing multivariate data of plasma processes in which response surface and neural networks are utilized to improve or find optimal process settings of the plasma process such that performance measurements are compared against model measurements to modify a current plasma process to achieve optimized processing performance.

20060259198, Nov 16, 2006

May 26, 2006

11/441050

Jozef Brcka - Loundonville NY, US
Deana Delp - Tempe AZ, US
Michael Grapperhaus - Dracut MA, US
Paul Moroz - Marblehead MA, US

TOKYO ELECTRON LIMITED - Tokyo

G05B 19/04

700246000

Embodiments of an intelligent modeling method and system monitor and perform analysis of semiconductor processing equipment as well as predict future states of that equipment based on the analysis, predict failures of the semiconductor processing equipment and/or determine equipment maintenance schedules.

20110178967, Jul 21, 2011

Mar 9, 2011

13/044202

Deana Delp - Tempe AZ, US

G06N 3/02

706 20

A method and apparatus for data analysis according to various aspects of the present invention is configured to test a set of components and generate test data for the components. A diagnostic system automatically analyzes the test data to identify a characteristic of a component fabrication process by recognizing a pattern in the test data and classifying the pattern using a neural network.

20180293500, Oct 11, 2018

May 29, 2018

15/991324

- Plano TX, US
Deana Delp - Tempe AZ, US

G06N 3/08
G05B 23/02
G06F 11/22
G06F 11/273
H01L 21/66

A method and apparatus for data analysis according to various aspects of the present invention is configured to test a set of components and generate test data for the components. A diagnostic system automatically analyzes the test data to identify a characteristic of a component fabrication process by recognizing a pattern in the test data and classifying the pattern using a neural network.