Dean N Mize

6645344, Nov 11, 2003

May 18, 2001

09/861322

Doug Caldwell - McKinney TX
Albert Garcia, Jr. - Gilbert AZ
Thomas J. Horback - Gilbert AZ
Michael James Lombardi - Phoenix AZ
Mark McNicholas - Gilbert AZ
Dean Mize - Sachse TX
Gon Wang - Gilbert AZ

Tokyo Electron Limited - Tokyo

H01L 2100

15634553, 15634551, 15634552, 118728, 118500, 20429801, 361234

A backplane assembly for a substrate processing system that is selectively configurable to provide an effective thermal contact with substrates of differing sizes. The backplane assembly includes a backplane base installed in a vacuum chamber of the substrate processing system and plural faceplates which are removably mountable to the backplane base. The backplane assembly is operable for regulating the temperature of the substrate and include elements that promote the efficient transfer of heat between the backplane base and the faceplate to perform the temperature regulation during processing. Each of the faceplates has a contact surface dimensioned and configured to engage a correspondingly dimensioned and/or configured type of substrate. The faceplates are readily demountable from the backplane base for exchange to accommodate a change in the dimension and/or configuration of the substrates being processed by the substrate processing system without removing the backplane base from the vacuum chamber.

45674329, Jan 28, 1986

Jun 9, 1983

6/490001

Douglas A. Buol - Dallas TX
Dean N. Mize - Garland TX
John W. Pattschull - Garland TX
Robert M. Wallace - Dallas TX

Texas Instruments Incorporated - Dallas TX

G01R 106
G01R 3126

324158F

A system for statically and dynamically testing an integrated circuit die in wafer form at various temperatures includes a multilayer support fixture in which the probes, the static test switching circuitry, and the dynamic test switching circuitry are mounted on separate, spaced apart, planar layers detachably connected to one another, the probe and the probe support board being formed of materials having a low temperature coefficient of thermal expansion. A heated/cooled wafer positioning chuck controls the temperature of the wafer thereon during static and dynamic testing.