Search

David A Sowatzke

from Spring Valley, WI
Age ~72
Get Report
Also known as:
Daivd A Sowatzke
Phone and address:
3156 Pierce Saint Croix Rd, Martell, WI 54767
(715) 772-4501
Related to:
Kathy Swenson, 72Brenda Kay Lund, 45Craig R Swenson, 50Justin E Bagley, 46James A Sowatzke, 39Rosalie A Sowatzke, 72Elizabeth A Bagley, 44Sara A Swenson, 42Mindy S Sowatzke, 38
Connected to:
Nicole Sowby, 35Aaron K Sowd, 54Mehran Sowdaey, 62Beth M Sowden, 55Bonnie L Sowden, 59Jodi J Sowden, 37Mandy N Sowden, 43Ray E Sowden, 85Russell L Sowden, 56Steve Sowden, 53

David Sowatzke Phones & Addresses

  • 3156 Pierce Saint Croix Rd, Spring Valley, WI 54767 (715) 772-4501 (715) 772-4531
  • Sheldon, WI
  • New Auburn, WI
  • Kearneysville, WV
  • 3156 Pierce Saint Croix Rd, Spring Valley, WI 54767 (715) 772-4501

Work

Position: Farmer

Education

Degree: High school graduate or higher

Professional Records

License Records

David A Sowatzke

License #:
13356 - Active
Category:
EMS Licensing
Issued Date:
Jan 10, 2016
Expiration Date:
Jun 30, 2018
Type:
First Responder (EMR)

Publications

Us Patents

Multilayer Emi Shielding Thin Film With High Rf Permeability

View page
US Patent:
20120236528, Sep 20, 2012
Filed:
Nov 19, 2010
Appl. No.:
13/512638
Inventors:
John D. Le - Woodbury MN, US
Robert C. Fitzer - North Oaks MN, US
Charles L. Bruzzone - Woodbury MN, US
Stephen P. Maki - North St. Paul MN, US
Bradley L. Givot - St. Paul MN, US
David A. Sowatzke - Spring Valley WI, US
International Classification:
H05K 9/00
C23C 16/06
C23C 16/56
US Classification:
361818, 174391, 427 58, 427124
Abstract:
A flexible multilayer electromagnetic shield is provided that includes a flexible substrate, a thin film layer of a first ferromagnetic material with high magnetic permeability disposed upon the substrate and a multilayer stack disposed upon the first ferromagnetic material. The multilayer stack includes pairs of layers, each pair comprising a polymeric spacing layer and a thin film layer of at least a second ferromagnetic material disposed on the spacing layer. At least one or more of the spacing layers includes an acrylic polymer. Also methods of making the flexible multilayer electromagnetic shield are provided.

Catalyst Particle Size Control With Organic Pigments

View page
US Patent:
20100273093, Oct 28, 2010
Filed:
Apr 23, 2010
Appl. No.:
12/766304
Inventors:
Mark K. Debe - Stillwater MN, US
Jason A. Bender - Woodbury MN, US
David A. Sowatzke - Spring Valley WI, US
International Classification:
H01M 4/92
H01M 4/02
US Classification:
429524, 429523
Abstract:
A fuel cell catalyst is provided comprising nanostructured elements comprising microstructured support whiskers bearing a thin film of nanoscopic catalyst particles, where the thin film of nanoscopic catalyst particles is made by alternating application of first layers comprising catalyst material, such as platinum or a platinum alloy, and second layers comprising a vacuum sublimable organic molecular solid, such as an aromatic organic pigments such as perylene red or a pthalocyanine

Plated Polymeric Article Including Tin/Copper Tie/Seed Layer

View page
US Patent:
20210310145, Oct 7, 2021
Filed:
Jun 16, 2021
Appl. No.:
17/349168
Inventors:
- St. Paul MN, US
David A. Sowatzke - Spring Valley WI, US
Steven Y. Yu - St. Paul MN, US
Gene B. Nesmith - Lago Vista TX, US
International Classification:
C25D 5/56
C23C 28/02
C23C 28/00
C23C 14/20
B32B 15/04
B32B 15/20
Abstract:
A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.

Plated Polymeric Article Including Tin/Copper Tie/Seed Layer

View page
US Patent:
20180187323, Jul 5, 2018
Filed:
Jun 13, 2016
Appl. No.:
15/736531
Inventors:
- St. Paul MN, US
David A. Sowatzke - Spring Valley WI, US
Steven Y. Yu - St. Paul MN, US
Gene B. Nesmith - Lago Vista TX, US
International Classification:
C25D 5/56
C23C 28/02
C23C 28/00
C23C 14/20
Abstract:
A plated article is provided comprising a) a polymeric substrate bearing b) a tie/seed layer in direct contact with the polymeric substrate and c) a plated metal layer, wherein the tie/seed layer has a thickness of less than 0.95 μm, and wherein the tie/seed layer comprises two or more layers of tin alternating with two or more layers of copper, and in some embodiments up to ten or more layers of tin alternating with ten or more layers of copper. In some embodiments, the tie/seed layer includes a layer of tin in direct contact with the polymeric substrate. Typically, the layers of tin and copper comprising the tie/seed layer are sputter coated layers. In some embodiments, the plated metal layer comprises an alloy of copper and tin. In some embodiments, the plated metal layer comprises layers comprised of tin alternating with layers comprised of copper.
Control profile
David A Sowatzke from Spring Valley, WI, age ~72 Get Report