David Allen Kneeburg

20070075243, Apr 5, 2007

Sep 30, 2005

11/241093

David Kneeburg - Santa Barbara CA, US
Rohit Jain - Ventura CA, US
Jason Osborne - Lompoc CA, US
Wei Yao - Ventura CA, US
Matthew Klonowski - Santa Barbara CA, US
Ingo Schmitz - Santa Barbara CA, US

G12B 21/20
G01N 13/10

250306000, 250307000, 073105000

The preferred embodiments are directed to a method and apparatus of operating a scanning probe microscope (SPM) to perform sample measurements using a survey scan that is less than five lines, and more preferably two lines, to accurately locate a field of features of a sample. This is accomplished by selecting a step distance between adjacent lines of the survey scan that does not equal the pitch of the features in a direction orthogonal to the direction the survey scan traverses, i.e., does not equal the pitch of the features in the scan direction, X. The aspect ratio of the scans can also be modified to further improve sample throughput.

20130146120, Jun 13, 2013

Dec 5, 2012

13/705980

Etienne Menard - Durham NC, US
David Kneeburg - Durham NC, US
Baron Kendrick - Cary NC, US
Bruce Furman - Plattsburgh NY, US
Wolfgang Wagner - Chapel Hill NC, US
Ray Jasinski - Chapel Hill NC, US
Scott Burroughs - Raleigh NC, US

H01L 31/052
H01L 31/18

136246, 438 65

A concentrator-type photovoltaic module includes a module enclosure having a rigid surface, and a flexible backplane within the enclosure and laminated to the rigid surface by an adhesive layer. The flexible backplane includes an array of interposer substrates having transfer-printed solar cells thereon and an interconnect network that provides electrical connections to the solar cells. A respective secondary spherical lens element is provided on respective ones of the solar cells within the enclosure. An optically transparent encapsulation layer may be provided on the secondary lens element of the respective ones of the solar cells, such that the secondary lens element including the encapsulation layer thereon has a different refractive index. A primary lens element is attached to the enclosure opposite to and spaced-apart from the rigid surface, and is positioned to concentrate light onto the respective ones of the solar cells through the secondary lens element thereon.

20130182333, Jul 18, 2013

Jul 21, 2011

13/812100

Matthew Meitl - Durham NC, US
Rudolph Bukovnik - Chapel Hill NC, US
Etienne Menard - Voglans, FR
Wolfgang Wagner - Chapel Hill NC, US
David Kneeburg - Durham NC, US
Jimmy Mark - Dunn NC, US

G02B 3/00

359619, 264 25

Coating a machined mold with a flowable, hardenable polymer coating produces an optically-smooth finish and maintains sharpness in upward-pointing features. These procedures produce molds for highly efficient plano-convex silicone-on-glass lens arrays in a fast and inexpensive manner in which an end-mill defines the shape of a lens, and the coating produces its smoothness. End-mill machining and coating lens-shaped features in plates that have movable pins produce molds with eject features disposed inside features that form templates for lens elements without significantly reducing optical performance. Additionally, machining and coating plates that have movable inserts produce molds for lens arrays with reduced volume and one or several rings in each lens element.

20210225815, Jul 22, 2021

Mar 16, 2021

17/203314

- Dublin, IE
Matthew Meitl - Durham NC, US
David Gomez - Holly Springs NC, US
Salvatore Bonafede - Chapel Hill NC, US
David Kneeburg - Durham NC, US
Alin Fecioru - Cork, IE
Carl Prevatte - Raleigh NC, US

H01L 25/075
G09G 3/32
H01L 33/38
H01L 23/482
H01L 23/538
H05B 45/50
G02F 1/167
H01L 33/62
H01L 33/50
H01L 33/60
G02B 26/04
H01L 25/16
H01L 33/36
H01L 33/48
H05K 1/03
H05K 1/09
H05K 1/18
H05K 5/00
G09G 3/22
H01L 27/15
F21V 9/08
H01L 33/58

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

20190148598, May 16, 2019

Jan 10, 2019

16/244860

- Cork, IE
Matthew Meitl - Durham NC, US
David Gomez - Holly Springs NC, US
Salvatore Bonafede - Chapel Hill NC, US
David Kneeburg - Durham NC, US
Alin Fecioru - Cork, IE
Carl Prevatte, JR. - Raleigh NC, US

H01L 33/38
H01L 23/538
H01L 23/482
H01L 33/50
H01L 33/60
H01L 25/16
H01L 33/36
H01L 33/48
H01L 25/075
H01L 33/62
H05B 33/08
H05K 1/09
H05K 1/03
H05K 1/18
G02B 26/04
G02F 1/167
G09G 3/32
H01L 33/58
F21V 9/08
H01L 27/15
G09G 3/22
H05K 5/00

The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

20180001614, Jan 4, 2018

Sep 15, 2017

15/705755

- Cork, IE
Matthew Meitl - Durham NC, US
David Gomez - Holly Springs NC, US
Salvatore Bonafede - Chapel Hill NC, US
David Kneeburg - Durham NC, US

B41F 16/00
B25J 15/00
H01L 21/52
H01L 21/56
H01L 21/67
H01L 21/3065
H01L 23/29
H01L 23/31
H01L 23/00
H01L 25/00
H01L 31/18
B41K 3/12
H01L 21/683

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.

20170207193, Jul 20, 2017

Jan 27, 2017

15/417780

- Cork, IE
Matthew Meitl - Durham NC, US
David Gomez - Holly Springs NC, US
Salvatore Bonafede - Chapel Hill NC, US
David Kneeburg - Durham NC, US
Ronald S. Cok - Rochester NY, US

H01L 23/00
B41F 16/00

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed. In yet another aspect, a method and structure for heat-assisted micro-transfer printing is disclosed.

20170103964, Apr 13, 2017

Dec 21, 2016

15/387389

- Cork, IE
Matthew Meitl - Durham NC, US
David Gomez - Holly Springs NC, US
Salvatore Bonafede - Chapel Hill NC, US
David Kneeburg - Durham NC, US

H01L 23/00
B41K 3/04
B41F 16/00

In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.