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Darius K Deak

from Shorewood, WI
Age ~54
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Related to:
Nicholas E Deak, 32
Connected to:
Cody J Deak, 31Ferenc Deak, 55Istvan Deak, 87Jason W Deak, 43Jon A Deak, 72Katalin R Deak, 59Kayla Deak, 34Mihaly Deak, 90Paul B Deak, 51Rick M Deak, 73

Darius Deak Phones & Addresses

  • 4301 N Prospect Ave, Milwaukee, WI 53211 (414) 488-2369
  • Shorewood, WI
  • Belchertown, MA
  • Carlsbad, CA
  • Middleton, MA
  • Haverhill, MA
  • South Hadley, MA
  • Wilmington, DE
  • Amherst, MA

Work

Company: Bostik Jun 2018 Position: Global r and d director - industrial adhesives

Education

Degree: Master of Business Administration, Masters School / High School: Babson College 2004 to 2008

Skills

Adhesives • R&D • Polymers • Polyurethane • Polymer Science • Product Development • Polymer Chemistry • Manufacturing • Coatings • Laminating • Resin • Plastics • Chemistry • Process Simulation • Polymer Characterization • Process Engineering • Additives • Raw Materials • Chemical Engineering • Materials • Polyester • Materials Science • Extrusion • Design of Experiments • Characterization • Management • Adhesion • Thermoplastics • Spectroscopy • Team Management

Industries

Chemicals

Resumes

Resumes

Darius Deak Photo 1

Global R And D Director - Industrial Adhesives

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Location:
Milwaukee, WI
Industry:
Chemicals
Work:
Bostik
Global R and D Director - Industrial Adhesives
Bostik Sep 2015 - Jun 2018
Global R and D Director - Nonwovens
Bostik Jan 2015 - Aug 2015
Global Product Development Director - Nonwovens
Bostik May 2013 - Jan 2015
Asia Pacific Technology Director
Bostik Aug 2011 - May 2013
Asia R and D Manager - Reactives; New Business Development Manager - Flexible Laminations
Education:
Babson College 2004 - 2008
Master of Business Administration, Masters University of Massachusetts Amherst 1992 - 1996
Doctorates, Doctor of Philosophy Cornell University 1988 - 1992
Bachelors, Bachelor of Science, Materials Science
Skills:
Adhesives
R&D
Polymers
Polyurethane
Polymer Science
Product Development
Polymer Chemistry
Manufacturing
Coatings
Laminating
Resin
Plastics
Chemistry
Process Simulation
Polymer Characterization
Process Engineering
Additives
Raw Materials
Chemical Engineering
Materials
Polyester
Materials Science
Extrusion
Design of Experiments
Characterization
Management
Adhesion
Thermoplastics
Spectroscopy
Team Management

Publications

Us Patents

Process For Packaging Tacky Polyester Resins

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US Patent:
20110268909, Nov 3, 2011
Filed:
Dec 22, 2010
Appl. No.:
12/975645
Inventors:
Darius K. Deak - Haverhill MA, US
Herve Philippe Burriez - Vineuil, FR
Assignee:
BOSTIK, INC. - Wauwatosa WI
International Classification:
B32B 27/36
B65B 11/00
US Classification:
428 76, 53461
Abstract:
A method for packaging plastic material using a film to surround the material, and more particularly to a method for packaging a copolyester, and the resulting package formed thereby. The method is preferably a coextrusion process for packaging an amorphous or semi-crystalline copolyester having a low glass transition temperature by extruding it through a die orifice, and coextruding a copolyester polymeric film having a high glass transition temperature to surround the low glass transition copolyester. The coated low glass transition copolyester may then be formed into individual packaged units having a finite size and shape.

Poly(3-Hydroxyacid) Polymers From Long-Chain Epoxides And Their Uses Related To Hot Melt Adhesives

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US Patent:
20230002549, Jan 5, 2023
Filed:
Jun 29, 2022
Appl. No.:
17/852469
Inventors:
- Colombes, FR
Darius Deak - Wauwatosa WI, US
International Classification:
C08G 63/08
C08G 63/91
C08F 283/00
C09J 167/04
Abstract:
A macromolecule comprises a ring-opened polymerized product of β-lactone monomers of formula I:

Styrene-Based Materials For Hot Melt Adhesives

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US Patent:
20200010743, Jan 9, 2020
Filed:
Feb 20, 2018
Appl. No.:
16/486880
Inventors:
- WAUWATOSA WI, US
Darius K. DEAK - Haverhill MA, US
Brian R. MINIX - Wauwatosa WI, US
Edward P. TOMLINSON - Brookfield WI, US
International Classification:
C09J 153/02
C09J 11/06
Abstract:
A hot melt adhesive comprises at least one polymer selected from the group consisting of polystyrene, polybutene, polyisobutene, linear low density polyethylene, polypropylene random copolymer, polypropylene, olefin block copolymer, polyolefins, styrene block copolymers, and ethyl vinyl acetate polymers; a tackifying resin; and at least one precisely end-capped polystyrene (PECPS). The use of the styrene-based oligomers and polymers with the precisely controlled end-groups in hot melt adhesive formulations to improve compatibility with polymers and block copolymers frequently used in such adhesives.
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Darius K Deak from Shorewood, WI, age ~54 Get Report