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Dana John Thygesen

from Bristol, VT
Age ~66

Dana Thygesen Phones & Addresses

  • 1349 Mountain Rd, Bristol, VT 05443 (802) 453-7100
  • 135 Texas Hill Rd, Huntington, VT 05462 (802) 434-4664
  • North Hero, VT
  • Burlington, VT
  • Monkton, VT
  • 1349 Mountain Rd, Bristol, VT 05443

Work

Company: Ibm redbooks Feb 2006 Position: Ibm middle manager

Emails

Industries

Information Technology And Services

Resumes

Resumes

Dana Thygesen Photo 1

Functional Manager

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Location:
1349 Mountain Rd, Bristol, VT 05443
Industry:
Information Technology And Services
Work:
Ibm Redbooks
Ibm Middle Manager

Ibm
Functional Manager

Publications

Us Patents

Chip Package Having Connectors On At Least Two Sides

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US Patent:
6665194, Dec 16, 2003
Filed:
Nov 9, 2000
Appl. No.:
09/711038
Inventors:
Janak G. Patel - South Burlington VT
Dana J. Thygesen - Monkton VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 700
US Classification:
361767, 361748, 361760, 257777, 257778, 438106, 438107, 438108
Abstract:
A substrate for supporting a semiconductor chip has area array connectors on at least two surfaces to provide a large number of connectors to the chip. At least one contact on one surface is not connected to a contact on the other surface through the substrate. Carriers, such as printed circuit boards are mounted to the two surfaces.

System And Method For Synchronizing Divide-By Counters

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US Patent:
6989696, Jan 24, 2006
Filed:
Nov 19, 2003
Appl. No.:
10/707066
Inventors:
Rolf Hilgendorf - Boeblingen, DE
Jens Kuenzer - Leinfelden-Echterdingen, DE
Cédric Lichtenau - Boeblingen, DE
Thomas Pflueger - Leinfelden, DE
Mathew I. Ringler - Burlington VT, US
Gerard M. Salem - Essex Junction VT, US
Peter A. Sandon - Essex Junction VT, US
Dana J. Thygesen - Monkton VT, US
Ulrich Weiss - Holzgerlingen, DE
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H03L 7/00
US Classification:
327154, 375356
Abstract:
A synchronization system capable of simultaneously resetting frequency divide-by counters () of multiple processors (A, B) to zero regardless of the divide-by frequency signal (Mclk/n signal ()) and regardless of the magnitude of the clock mesh delays experienced by the Mclk/n signals in the processors. The synchronization system includes a mesh delay circuit () for each processor that simulates in the undivided signal (Mclk/1 signal ()) the clock mesh delay experienced by the Mclk/n signal in that processor so as to provide an Lclk signal (). A phase detector detects the phase offset between the Mclk/n signal and the Sysclk signal () and sends an asynchronous offset signal () to a counter re-setter () that resets the divide-by counter to zero based on the offset signal.

System And Method For Asynchronous Dual Bus Conversion Using Double State Machines

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US Patent:
57108927, Jan 20, 1998
Filed:
Jul 19, 1995
Appl. No.:
8/504347
Inventors:
Kenneth Joseph Goodnow - Essex Jct. VT
Dana John Thygesen - Huntington VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 1300
G06F 1314
US Classification:
395307
Abstract:
A bus interface system and method for communication between different computer components having buses with different speeds, data widths, or protocols. A first state machine communicates with the first bus and a second state machine communicates with the second bus. Each of the buses communicates with a data storage device. The first and second state machines are in selective communication using an asynchronous handshaking protocol, whereby data is transferred between said first and second buses. The handshaking protocol comprises an asynchronous request signal from the first bus requesting a data transfer and an asynchronous reply signal from the second bus indicating that data has been sent or is available.

Interposer And Module Test Card Assembly

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US Patent:
59296461, Jul 27, 1999
Filed:
Dec 13, 1996
Appl. No.:
8/766234
Inventors:
Janak Ghanshyambhai Patel - South Burlington VT
Dana John Thygesen - Huntington VT
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 107
US Classification:
324754
Abstract:
The preferred embodiment of the present invention provides an apparatus and method to facilitate the testing of semiconductor devices packaged in surface mount modules (such as ball grid array modules and cylinder grid array modules) while the module is connected to a system board. The preferred embodiment provides an interposer mechanism that includes a top array of interposer landing pads and a bottom array of interposer landing pads. The bottom array of interposer landing pads are connected to the top array of interposer landing pads. The preferred embodiment also provides a module test card mechanism. The module test card mechanism includes a plurality of landing pads arranged to receive the surface mount module. The plurality of landing pads are connected to a plurality of test pins, and a plurality of landing pads underneath the module test card mechanism. The surface mount module can be coupled the system board through the module test card mechanism and the interposer mechanism with the plurality of test pins providing access to the semiconductor device for testing.
Dana John Thygesen from Bristol, VT, age ~66 Get Report