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Dana J Stoddard

from Venice, FL
Age ~42
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Also known as:
Dana J Mccutchan, Dan A Stoddard, Dana Mc Cutchan, Dana Mc
Phone and address:
1471 Southland Rd, Venice, FL 34293
Related to:
Christine L Mccomas, 52
Connected to:
Adam G Stoddart, 50Aimee W Stoddard, 48Amberlie Stoddard, 41Andrew J Stoddart, 33Anthony A Stoddart, 35Bates F Stoddard, 82Betsy A Stoddard, 46Beverly A Stoddard, 49Bobby L Stoddard, 87Boel M Stoddard, 64

Dana Stoddard Phones & Addresses

  • 1471 Southland Rd, Venice, FL 34293
  • Eagle, ID
  • Shingle Springs, CA
  • Rescue, CA
  • Citrus Heights, CA
  • El Dorado Hills, CA

Resumes

Resumes

Dana Stoddard Photo 1

Investigator

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Work:
Stoddard Investigations
Investigator
Dana Stoddard Photo 2

Dana Stoddard

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Skills:
Hr
Shared Services
Dana Stoddard Photo 3

Owner

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Location:
1471 Southland Rd, Venice, FL 34293
Industry:
Food Production
Work:
Relic Coffee
Owner
Skills:
Employee Relations
Onboarding
Employee Benefits
Workday
Peoplesoft
Enwisen
Six Sigma
U.s. Immigration
Employee Engagement
Talent Management
Human Resources
Personnel Management
Dana Stoddard Photo 4

Dana Stoddard

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Dana Stoddard Photo 5

Dana Stoddard

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Dana Stoddard Photo 6

Dana Stoddard

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Publications

Us Patents

Solder Ball Landpad Design To Improve Laminate Performance

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US Patent:
6914326, Jul 5, 2005
Filed:
Apr 23, 2003
Appl. No.:
10/421132
Inventors:
Brad D. Rumsey - Meridian ID, US
Patrick W. Tandy - Bosie ID, US
Willam J. Reeder - Boise ID, US
Stephen F. Moxham - Boise ID, US
Steven G. Thummel - Boise ID, US
Dana A. Stoddard - Boise ID, US
Joseph C. Young - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L023/52
H05K001/02
H05K001/18
US Classification:
257691, 257692, 257207, 257211, 257210, 257700, 257696, 257697, 257668, 257784, 257786, 257698, 257693, 361777, 361760, 361790, 361767, 174250, 174261, 174260, 439 70, 439 66, 439 75, 2281801, 333 1
Abstract:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.

Solder Ball Landpad Design To Improve Laminate Performance

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US Patent:
7951646, May 31, 2011
Filed:
Apr 23, 2003
Appl. No.:
10/421079
Inventors:
Brad D. Rumsey - Meridian ID, US
Patrick W. Tandy - Boise ID, US
Willam J. Reeder - Boise ID, US
Stephen F. Moxham - Boise ID, US
Steven G. Thummel - Boise ID, US
Dana A. Stoddard - Boise ID, US
Joseph C. Young - Boise ID, US
Assignee:
Round Rock Research, LLC - Mt. Kisco NY
International Classification:
H01L 21/44
US Classification:
438108, 257E33001
Abstract:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.

Solder Ball Landpad Design To Improve Laminate Performance

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US Patent:
6577004, Jun 10, 2003
Filed:
Aug 31, 2000
Appl. No.:
09/653300
Inventors:
Brad D. Rumsey - Meridian ID
Patrick W. Tandy - Boise ID
William J. Reeder - Boise ID
Stephen F. Moxham - Boise ID
Steven G. Thummel - Boise ID
Dana A. Stoddard - Boise ID
Joseph C. Young - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2314
US Classification:
257738, 257691, 257698, 257696, 257692, 257693, 257673, 257737, 257784, 257786, 257668, 257211, 257208, 257207, 2281801, 174250, 174261, 361777, 361760
Abstract:
A method and apparatus for improving the laminate performance of the solder balls in a BGA package. Specifically, the ball pads on the substrate are configured to increase the shear force necessary to cause delamination of the solder balls. Conductive traces extending planarly from the pads and arranged in specified configurations will increase the shear strength of the pad.
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Dana J Stoddard from Venice, FL, age ~42 Get Report