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Cora Lynn Mau

from Sunnyvale, CA
Age ~59
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Also known as:
Cora L Mau
Phone and address:
473 Costa Mesa Ter, Sunnyvale, CA 94085
(408) 245-8763
Related to:
Michiko Mau, 88Janice Claire Dias, 97Cheryl E Chun, 63Cheryl Chun, 81Celena Deponte, 58Robyn Chun, 62
Connected to:
Brandon B Mau, 45Brianna A Mau, 34Carrie A Mau, 36Clara D Mau, 107Cong H Mau, 62Garton S Mau, 84Gordon E Mau, 105Jeffrey J Mau, 46Jeremy M Mau, 43Johanna Mau, 93

Cora Mau Phones & Addresses

  • 473 Costa Mesa Ter, Sunnyvale, CA 94085 (408) 245-8763
  • 473 Costa Mesa Ter APT E, Sunnyvale, CA 94085
  • Milpitas, CA
  • San Jose, CA
  • Mountain View, CA

Work

Position: Professional/Technical

Education

Degree: Associate degree or higher

Publications

Us Patents

Distributed Multi-Die Protocol Application Interface

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US Patent:
20200183877, Jun 11, 2020
Filed:
Feb 17, 2020
Appl. No.:
16/792507
Inventors:
- San Jose CA, US
Keith Duwel - San Jose CA, US
Cora Lynn Mau - Sunnyvale CA, US
International Classification:
G06F 13/42
G06F 5/06
H04L 29/06
Abstract:
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

Distributed Multi-Die Protocol Application Interface

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US Patent:
20190179792, Jun 13, 2019
Filed:
Dec 3, 2018
Appl. No.:
16/208238
Inventors:
- San Jose CA, US
Keith Duwel - San Jose CA, US
Cora Lynn Mau - Sunnyvale CA, US
International Classification:
G06F 13/42
G06F 5/06
H04L 29/06
Abstract:
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.

Distributed Multi-Die Protocol Application Interface

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US Patent:
20170068638, Mar 9, 2017
Filed:
Sep 3, 2015
Appl. No.:
14/844920
Inventors:
- San Jose CA, US
Keith Duwel - San Jose CA, US
Cora Lynn Mau - Sunnyvale CA, US
International Classification:
G06F 13/42
G06F 5/06
Abstract:
Systems and methods are provided for supporting wide-protocol interface across a multi-die interconnect interface. Data signals of a wide-protocol interface are split into a plurality of data streams. A handshake signal is established between a first circuit and a second circuit, whereby the first circuit and second circuit are dies of a multi-die device. The first circuit transmits the plurality of data streams to the second circuit via a plurality of multi-die interconnect channels. Each data stream of the plurality of data streams are compressed based on the handshake signal in order to provide wide-protocol interface with reduced number of required pins.
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Cora Lynn Mau from Sunnyvale, CA, age ~59 Get Report