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Charles A Mosolf

from Juno Beach, FL
Age ~82

Charles Mosolf Phones & Addresses

  • 241 Mercury Cir, North Palm Beach, FL 33408 (561) 622-6417
  • 241 Mercury Cir APT 3, N Palm Beach, FL 33408 (561) 267-1833
  • Juno Beach, FL
  • New Richmond, OH
  • Palm Beach, FL
  • 241 Mercury Cir APT 3, Juno Beach, FL 33408

Emails

Business Records

Name / Title
Company / Classification
Phones & Addresses
Charles Mosolf
Treasurer
The Sands Condominium Association, Inc
Membership Organization
241 Mercury Cir, West Palm Beach, FL 33408

Publications

Us Patents

Printed Wiring Boards And Methods For Making Them

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US Patent:
6710259, Mar 23, 2004
Filed:
Sep 17, 2001
Appl. No.:
09/954486
Inventors:
Charles Edwin Thorn - Kenton Hill KY
Frank Polakovic - Manahawkin NJ
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals, Inc. - Maple Plains NJ
International Classification:
H05K 109
US Classification:
174257, 174262, 174266, 427122
Abstract:
A method of applying a conductive carbon coating to a non-conductive surface and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon coatings are disclosed. A conditioning agent is applied to the non-conductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns, combined with an organic binding agent, is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface and dried. The resulting coating has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion, yet is easily removable from copper surfaces of the substrate by microetching.

Printed Wiring Boards And Methods For Making Them

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US Patent:
7186923, Mar 6, 2007
Filed:
Dec 5, 2003
Appl. No.:
10/728423
Inventors:
Charles Edwin Thorn - Newport KY, US
Frank Polakovic - Manahawkin NJ, US
Charles A. Mosolf - Juno Beach FL, US
Assignee:
Electrochemicals, Inc. - Maple Plain MN
International Classification:
H05K 1/09
US Classification:
174257, 174262
Abstract:
A printed wiring board comprising conductive layers separated by nonconductive material and having through holes or other nonconductive surfaces on which an electrically conductive carbon coating is formed. The conductive carbon coating includes electrically conductive carbon having a mean particle size not greater than about 1 micron and a water-dispersible organic binding agent. The conductive carbon coating formed on the nonconductive surfaces has a low electrical resistance and is tenacious enough to be plated and exposed to molten solder without creating voids or losing adhesion.

Direct Metallization Process

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US Patent:
56908059, Nov 25, 1997
Filed:
Jun 7, 1995
Appl. No.:
8/471871
Inventors:
Charles Edwin Thorn - Newport KY
Frank Polakovic - Ringwood NJ
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C25D 502
C25D 554
C25D 556
B05D 512
US Classification:
205118
Abstract:
A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.

Direct Metallization Process

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US Patent:
61714682, Jan 9, 2001
Filed:
Nov 21, 1997
Appl. No.:
8/975613
Inventors:
Charles Edwin Thorn - Newport KY
Frank Polakovic - Plymouth MN
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C25D 502
C25D 554
B05D 512
B05D 118
US Classification:
205118
Abstract:
A method of applying a conductive carbon coating to a non-conductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the non-conductive surface to form an electrically conductive carbon coating. The conductive carbon coating is then fixed on the (formerly) nonconductive surface. Fixing may be accomplished in a variety of different ways. For example, the fixing step can be carried out by applying a fixing liquid to the carbon-coated surface. One example of a suitable fixing liquid is a dilute aqueous acid. Fixing may also be carried out by removing the excess carbon dispersion with an air knife or other source of compressed air.

Composition And Process For Preparing A Non-Conductive Substrate For Electroplating

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US Patent:
53892704, Feb 14, 1995
Filed:
May 17, 1993
Appl. No.:
8/062943
Inventors:
Charles E. Thorn - Newport KY
Frank Polakovic - Ringwood NJ
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals, Inc. - Youngstown OH
International Classification:
C10M12502
US Classification:
252 22
Abstract:
The present invention is directed to an improved composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0. 1 to 20% by weight graphite having a mean particle size within the range of 0. 05 to 50 microns; 0. 01 to 10% by weight of a water soluble or dispersible binding agent for binding to the graphite particles; an effective amount of an anionic dispersing agent for dispersing the bound graphite particles; a pH within the range of 4-14; and an aqueous dispersing medium. Optionally, the composition may contain an amount of a surfactant that is effective for wetting the through hole. The resulting graphite dispersion is capable of uniformly coating the through holes in either a double-sided or multi-layer circuit board prior to electroplating. Through holes that were treated with the disclosed graphite dispersion prior to electroplating were free of visible voids after electroplating.

Processes For Preparing A Non-Conductive Substrate For Electroplating

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US Patent:
54765803, Dec 19, 1995
Filed:
May 3, 1994
Appl. No.:
8/232574
Inventors:
Charles E. Thorn - Newport KY
Frank Polakovic - Ringwood NJ
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
C25D 502
US Classification:
205122
Abstract:
A composition and process for preparing a non-conductive substrate for electroplating. The composition comprises 0. 1 to 20% by weight carbon (e. g. graphite or carbon black) having a mean particle size within the range of 0. 05 to 50 microns; optionally, 0. 01 to 10% by weight of a water soluble or dispersible binding agent for binding to the carbon particles; optionally, an effective amount of an anionic dispersing agent for dispersing the bound carbon particles; optionally, an amount of a surfactant that is effective for wetting the through hole; a pH within the range of 4-14; and an aqueous dispersing medium. Improved methods of applying the composition to a through hole, a printed wiring board having a through hole treated with the composition, and a method of fixing a carbon coating deposited on a through hole using an acid solution are also disclosed.

Direct Metallization Process Employing A Cationic Conditioner And A Binder

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US Patent:
63031817, Oct 16, 2001
Filed:
Mar 17, 2000
Appl. No.:
9/527706
Inventors:
Charles Edwin Thorn - Newport KY
Frank Polakovic - Plymouth MN
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
B05D 512
B05D 300
C25D 554
C25D 556
C25D 502
US Classification:
427122
Abstract:
A method of applying a conductive carbon coating to a nonconductive surface, conductive carbon compositions for that purpose, and a printed wiring board having through holes or other nonconductive surfaces treated with such carbon compositions are disclosed. A conditioning agent, made (for example) by condensing a polyamide and epichlorohydrin, is applied to the nonconductive surface to form a conditioned surface. A liquid dispersion of electrically conductive carbon (for example, graphite) having a mean particle size no greater than about 50 microns is coated on the conditioned surface to form an electrically conductive carbon coating. The conductive carbon coating is then optionally fixed on the (formerly) nonconductive surface. Fixing may be accomplished, for example, by applying a fixing liquid such as a dilute aqueous acid to the carbon-coated surface. The coating is then dried.

Carbon Containing Composition For Electroplating

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US Patent:
57258074, Mar 10, 1998
Filed:
Jun 7, 1995
Appl. No.:
8/486331
Inventors:
Charles Edwin Thorn - Newport KY
Frank Polakovic - Ringwood NJ
Charles A. Mosolf - Juno Beach FL
Assignee:
Electrochemicals Inc. - Maple Plain MN
International Classification:
H01B 124
C25D 1310
US Classification:
252510
Abstract:
A method of applying a conductive carbon coating to a non-conductive layer, conductive carbon compositions, and a printed wiring board having through holes or other surfaces treated with such carbon compositions are disclosed. A board or other substrate including at least first and second electrically conductive metal layers separated by a non-conductive layer is provided. The board has a recess extending through at least one of the metal layers into the non-conductive layer. The recess has a non-conductive surface which is desired to be made electrically conductive. The carbon in the dispersion has a mean particle size no greater than about 50 microns. The method is carried out by applying the carbon dispersion to a non-conductive surface of the recess to form a substantially continuous, electrically conductive carbon coating. Optionally, the coating is then fixed, leaving the carbon deposit as a substantially continuous, electrically conductive layer. Chemical and physical fixing steps are disclosed.
Charles A Mosolf from Juno Beach, FL, age ~82 Get Report