Carl C Polansky

46142924, Sep 30, 1986

Sep 30, 1985

6/781987

Carl Polansky - Landisville PA
Frank Z. Hawrylo - Trenton NJ

RCA Corporation - Princeton NJ

B23K 106

228 11

A die bonder for bonding a semiconductor die to a substrate is disclosed. The die bonder comprises a support assembly within a frame, which assembly supports an arm. Attached to said arm is a means for holding a die, e. g. a vacuum collet. A variable electrical scrubbing means comprises a plunger which oscillates reciprocally within an electromagnetic coil and contacts the arm, or a tab integral with said arm. This provides a corresponding uniform scrubbing action, perpendicular to said arm in the plane of the interface between the die and the substrate, between a die held by the holding means and a solder material interposed between the die and substrate.

46590064, Apr 21, 1987

Sep 26, 1985

6/780299

Carl Polansky - Landisville PA

RCA Corporation - Princeton NJ

B23K 120
B23K 3100

228123

A typical method for bonding a die to a substrate includes the steps of placing a solder preform onto the substrate, contacting the die to the preform and applying heat sufficient for the solder to flow and wet the substrate and die forming a bond therebetween. The present invention comprises heating the substrate and preform to a temperature below the melting point of the solder preform and thereafter maintaining this temperature while applying pressure to the preform sufficient to substantially reduce the thickness of the preform and to cause the preform to adhere to the substrate prior to contacting the die thereto.

45895864, May 20, 1986

Aug 29, 1985

6/770568

Carl Polansky - Landisville PA

RCA Corporation - Princeton NJ

B23K 3102

228179

A collet is described for use in die bonding of semiconductor dies which is comprised of a shank portion and a die holder portion which has triangular side walls and is open ended.