Carl P Hayunga

48806846, Nov 14, 1989

Mar 11, 1988

7/167290

David W. Boss - Beacon NY
Timothy W. Carr - Hopewell Junction NY
Derry J. Dubetsky - Wappingers Falls NY
George M. Greenstein - Hopewell Junction NY
Warren D. Grobman - Carmel NY
Carl P. Hayunga - Poughkeepsie NY
Amanda H. Kumar - Hopewell Junction NY
Walter F. Lange - Longmont CO
Robert H. Massey - Wappingers Falls NY
Paul H. Palmateer - Wappingers Falls NY
John A. Romano - Hopewell Junction NY
Da-Yuan Shih - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

B32B 300
B32B 700
B44C 122
B29C 3700

428209

Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.

42383129, Dec 9, 1980

Jul 23, 1979

6/059718

Arkadi Galicki - San Jose CA
Carl P. Hayunga - Poughkeepsie NY
Homi G. Sarkary - Hopewell Junction NY

International Business Machines Corporation - Armonk NY

C23C 1500

204298

A sputtering system adapted for depositing quartz in uniform thicknesses upon multiple wafers processed in batches including an anode plate having a plurality of wafer locations spaced from the center of the anode, with each wafer location comprising a wafer receiving recess in the anode plate having an angular bottom slope which, in effect, tilts the wafer to an optimum deposition angle with respect to the cathode, depending upon wafer spacing from the center of the anode, to insure uniform deposition across the wafer.

56314981, May 20, 1997

May 19, 1995

8/444667

Morris Anschel - Wappingers Falls NY
Douglas W. Ormond - Wappingers Falls NY
Carl P. Hayunga - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

H01L 2348
H01L 2940

257690

A metallization layer is formed on a substrate with improved adhesion thereto by performing the deposition at an elevated temperature which favors the formation of chemical bonds of the metal to the substrate as well as clusters of metal embedded within the substrate and contiguous with the metallization layer. In polymer substrates the chemical bond is made to carbonyl functional groups such as ketones or aldehydes. The adhesion is enhanced by the removal of moisture from the surface of the substrate at the elevated temperatures employed. A high degree of adhesion is also obtained through the deposition of a mixture of metals including chromium and copper which initially has a high chromium to copper ratio which is decreased during the deposition process. Completion of the process is determined by the reaching of a final desired chromium to copper ratio as observed by optical emission spectroscopy. The process can be carried out on a continuous basis by the use of a multi-chamber vacuum sputtering system.