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Brian Thomas Vaccaro

from Mertztown, PA
Age ~51
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Also known as:
Brian T Vaccaro, Brian Thomas Vacarro, Brian T Vacarro
Phone and address:
32 Carls Hill Rd, Mertztown, PA 19539
(610) 641-9343
Related to:
Carston J Koopman, 62Constance L Fritch, 79Lena L VaccaroJennifer L Freeby, 53Thomas C Vaccaro, 76Sara B Vaccaro, 49Jason E Pulley, 51Patricia A Vaccaro, 77Craig A Roper, 68Lena Vaccaro
Connected to:
Antonella Vaccaro, 44Antonina Vaccaro, 84Bernadette M Vaccaro, 75Beverly S Vaccaro, 80Charles Vaccaro, 67Chase L Vaccaro, 63Curtis W Vaccaro, 64Elena Vaccaro, 60Eugenio Vaccaro, 66Francesco C Vaccaro, 52

Brian Vaccaro Phones & Addresses

  • 32 Carls Hill Rd, Mertztown, PA 19539 (610) 641-9343 (610) 266-0854
  • Blacksburg, VA
  • 511 Greenview Dr, Northampton, PA 18067 (610) 266-0854
  • 1920 Riverbend Rd, Allentown, PA 18103 (610) 776-7482
  • Breinigsville, PA
  • Summit Hill, PA

Work

Company: Air products and chemicals May 2008 Position: Senior mechanical engineer

Education

Degree: Master's degree School / High School: Lehigh University 1995 to 1998 Specialities: Mechanical Engineering

Industries

Chemicals

Resumes

Resumes

Brian Vaccaro Photo 1

Senior Mechanical Engineer At Air Products And Chemicals

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Position:
Senior Mechanical Engineer at Air Products and Chemicals
Location:
Mertztown, Pennsylvania
Industry:
Chemicals
Work:
Air Products and Chemicals since May 2008
Senior Mechanical Engineer
Education:
Lehigh University 1995 - 1998
Master's degree, Mechanical Engineering Virginia Tech 1991 - 1995
Bachelor of Science (BS), Mechanical Engineering

Publications

Amazon

Decisions Matter Using a Decision-Making Framework with Contemporary Student Affairs Case Studies by Annemarie Vaccaro, Brian McCoy, Delight Champagne, Michael S (2013) Hardcover

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Binding

Hardcover

Publisher

National Association of Student Personnel Administ

ISBN #

9

Decisions Matter Using a Decision-Making Framework with Contemporary Student Affairs Case Studies

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Decisions Matter is an innovative guide designed to help novice student affairs professionals develop effective decision-making skills. Written by seasoned student affairs educators and practitioners, this book contains a systematic method for solving a wide range of complex problems. In this except...
Author

Annemarie Vaccaro, Brian McCoy, Delight Champagne, Michael Siegel

Binding

Hardcover

Pages

312

Publisher

National Association of Student Personnel Administrators

ISBN #

0931654858

EAN Code

9780931654855

ISBN #

1

Us Patents

Electronic Packages

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US Patent:
7671436, Mar 2, 2010
Filed:
May 2, 2008
Appl. No.:
12/151108
Inventors:
Ahmed Nur Amin - Fairfax VA, US
Mark Adam Bachman - Sinking Spring PA, US
David Lee Crouthamel - Bethlehem PA, US
John William Osenbach - Kutztown PA, US
Brian Thomas Vaccaro - Mertztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 31/00
US Classification:
257459, 257779, 257E2302
Abstract:
Assemblies involving integrated circuit dies (e. g. packaged integrated circuits) and packaged dies electrically connected to circuit boards at times mechanically fail at conducting pads used for electrical interconnection. Such failure is mitigated by underlying appropriate pads with a compliant region having specific characteristics.

Manufacture Of Devices Including Solder Bumps

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US Patent:
7727781, Jun 1, 2010
Filed:
Jul 22, 2008
Appl. No.:
12/220182
Inventors:
Joze Eura Antol - Hamburg PA, US
Kishor V. Desai - Fremont CA, US
John William Osenbach - Kutztown PA, US
Brian Thomas Vaccaro - Mertztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
G01L 31/26
H01L 21/66
US Classification:
438 14, 438 15, 438106, 438612
Abstract:
Typical testing of solder joints, (e. g. joints at printed circuit board pads) has not proven totally predictive of the ultimate performance of such joints. It has been found that this lack of reliability is, at least in part, due to the tendency during testing for these pads to lose adhesion to, or delaminate from, the underlying substrate. In contrast, such occurrence is not typical of phenomena induced during typical device usage. To remove this source of unreliability, a test structure is made together with the manufacturing device lot. The same pad processing is used and the pad size is substantially enlarged in the test structure. The test structure is employed to predict performance of devices in the lot and then the lot is processed accordingly.

Integrated Circuit Chip Assembly Having Array Of Thermally Conductive Features Arranged In Aperture Of Circuit Substrate

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US Patent:
7982307, Jul 19, 2011
Filed:
Nov 22, 2006
Appl. No.:
11/562537
Inventors:
Ahmed Amin - Allentown PA, US
David L. Crouthamel - Bethlehem PA, US
John W. Osenbach - Kutztown PA, US
Thomas H. Shilling - Macungie PA, US
Brian T. Vaccaro - Mertztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 23/34
US Classification:
257712, 257E23105, 257E23101, 257E23092, 257734, 257737, 257778, 257783, 257774, 257773, 257680, 257713, 257717, 257720, 257675
Abstract:
An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.

Methods And Apparatus To Reduce Growth Formations On Plated Conductive Leads

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US Patent:
7368326, May 6, 2008
Filed:
May 27, 2004
Appl. No.:
10/855148
Inventors:
John William Osenbach - Kutztown PA, US
Brian Dale Potteiger - Reading PA, US
Richard Lawrence Shook - Fogelsville PA, US
Brian Thomas Vaccaro - Mertztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 21/50
H01L 21/48
H01L 21/44
H01L 23/495
H01L 23/52
H01L 23/48
H01L 23/40
US Classification:
438123, 438106, 438124, 257666, 257677, 257734, 257735, 257736, 257766, 257692, 257E23053, 257E23054, 257E23031, 257E23035
Abstract:
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer comprises a material. The predetermined temperature is greater than or equal to approximately a melting point of one of the materials. The annealing can reduce growth formations, such as whiskers, on the one or more conductive leads. Lead frames and other devices having plated conductive leads may be subjected to the process, and the resultant plated conductive leads will have fewer growth formations than plated conductive leads not subjected to the process. The plated conductive leads may be trimmed and formed prior to or after the anneal.

Whisker-Free Lead Frames

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US Patent:
8013428, Sep 6, 2011
Filed:
Jul 28, 2009
Appl. No.:
12/462069
Inventors:
Kultaransingh N. Hooghan - Murphy TX, US
John W. Osenbach - Kutztown PA, US
Brian Dale Potteiger - Reading PA, US
Poopa Ruengsinsub - Bangkok, TH
Richard L. Shook - Fogelsville PA, US
Prakash Suratkar - Bangalore, IN
Brian T. Vaccaro - Mertztown PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
B32B 15/20
H01L 23/495
H01L 23/28
C22F 1/08
US Classification:
257666, 257687, 257787, 428647, 428648, 428929, 428941, 148536, 148537, 29827, 4273837, 174521, 174565
Abstract:
A method of fabricating an interconnection between a region of copper material and a conducting region is disclosed. The method includes a step of forming a region of tin material and a step of forming a region of nickel material. The method also includes a step of melting the tin material to induce formation of a nickel/tin/copper intermetallic composition at an interface between the region of copper material and the conducting region. The region of tin material and the region of nickel material define the interface between the region of copper material and the conducting region.

Soldering Method And Related Device For Improved Resistance To Brittle Fracture With An Intermetallic Compound Region Coupling A Solder Mass To An Ni Layer Which Has A Low Concentration Of P, Wherein The Amount Of P In The Underlying Ni Layer Is Controlled As A Function Of The Expected Volume Of The Solder Mass

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US Patent:
8242378, Aug 14, 2012
Filed:
Sep 21, 2007
Appl. No.:
12/160553
Inventors:
Ahmed Amin - Allentown PA, US
Frank Baiocchi - Allentown PA, US
John Delucca - Montgomery PA, US
John Osenbach - Kutztown PA, US
Brian T. Vaccaro - Mertztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H05K 1/09
B23K 31/02
B23K 1/20
US Classification:
174257, 174259, 174261, 361751, 361771, 361803
Abstract:
A lead-free solder joint is formed between a tin-silver-copper solder alloy (SAC), SACX, or other commonly used Pb-free solder alloys, and a metallization layer of a substrate. Interaction of the SAC with the metallization layer forms an intermetallic compound (IMC) that binds the solder mass to the metallization layer. The IMC region is substantially free of any phosphorous-containing layers or regions.

Ball Grid Array (Bga) Package Having Corner Or Edge Tab Supports

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US Patent:
20050077080, Apr 14, 2005
Filed:
Oct 14, 2003
Appl. No.:
10/682969
Inventors:
Adesoji Dairo - Macungie PA, US
Jeffery Gilbert - Schwenksville PA, US
Christopher Horvath - Allentown PA, US
Richard Shook - Fogelsville PA, US
Ebyson Thomas - Allentown PA, US
Brian Vaccaro - Mertztown PA, US
International Classification:
H05K007/06
US Classification:
174255000, 361804000, 174260000, 257778000
Abstract:
The present invention includes tab supports on the solder ball side of a BGA package substrate. The tab supports are preferably sized in a height direction to avoid or prevent a warped corner or edge of a BGA substrate from excessively pressing down on the solder balls when warping occurs, most often during the high temperature solder-reflow process. Exemplary tab supports comprise small standoff tabs placed in all four corners of the lower substrate of a BGA package, and/or on all four edges of the lower substrate. The invention has particular application to a plastic BGA (PBGA) package.

Whisker-Free Lead Frames

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US Patent:
20060068218, Mar 30, 2006
Filed:
Sep 28, 2004
Appl. No.:
10/951430
Inventors:
Kultaransingh Hooghan - Murphy TX, US
John Osenbach - Kutztown PA, US
Brian Potteiger - Reading PA, US
Poopa Ruengsinsub - Bangkok, TH
Richard Shook - Fogelsville PA, US
Prakash Suratkar - Bangalor, IN
Brian Vaccaro - Mertztown PA, US
International Classification:
B32B 15/00
B32B 15/01
US Classification:
428615000, 428646000, 428647000, 148527000
Abstract:
The electrical and mechanical properties of structures such as lead frames and other electrical/electronic devices containing, during processing, copper/tin interfaces are improved by introduction of nickel to such interface. Typically, a weight percentage of nickel to tin in the range 1 to 12 weight percent yields upon melting of the tin, an intermetallic compound with essentially no occluded, unbound tin. Thus undesirable anomalous structures such as tin needles and substantially non-planar interface compositions are avoided. Advantageously a nickel/tin/copper intermetallic interface that is substantially planar is formed in the substantial absence of needle-like tin structures.
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Brian Thomas Vaccaro from Mertztown, PA, age ~51 Get Report