US Patent:
20100236951, Sep 23, 2010
Inventors:
James M. Huff - Beavercreek OH, US
Bert Nyberg - Dayton OH, US
Mark A. DeRyke - Miamisburg OH, US
International Classification:
B65D 25/08
B65B 3/04
Abstract:
A repair kit () includes a sealed package () having a plurality of isolated compartments () for holding substances () that, when mixed together, form an adhesive, and for holding a flexible substrate (). Pull tabs () are arranged on the package () to aid in opening fluid communication between the compartments to permit adhesive mixture and to permit adhesive flow onto the substrate () for subsequent repair purposes.
