US Patent:
20070124707, May 31, 2007
Inventors:
Edhi Sutjahjo - Cupertino CA, US
Byungwook Kim - Los Altos Hills CA, US
Goetz Leonhardt - San Jose CA, US
Beifang Qiu - Sunnyvale CA, US
Sergey Krasnovsky - Portland OR, US
Baribrata Biswas - San Jose CA, US
Alex Gyure - San Jose CA, US
Mahmoud Shahram - Cupertino CA, US
International Classification:
G06F 17/50
Abstract:
One embodiment of the present invention provides a system for determining an electrical property for an interconnect layer. During operation, the system receives interconnect technology data which includes nominal parameter values for a first interconnect layer, and parameter-variation values which represent variations in the nominal parameter values due to random process variations. Next, the system receives an interconnect template which describes the geometry of a portion of a second interconnect layer. The system then determines electrical property data for the interconnect template using the interconnect technology data. The electrical property data can include a nominal electrical property value, and sensitivity values which represent the sensitivities of the nominal electrical property value to variations in the nominal parameter values. Next, the system stores the electrical property data and the interconnect technology data in a storage.