Ashley Marie Rebelo

7675168, Mar 9, 2010

Feb 25, 2005

11/065838

Gavin Appel - Allentown PA, US
Ashley Rebelo - Emmaus PA, US
Christopher J. Wittensoldner - Alburtis PA, US

Agere Systems Inc. - Allentown PA

H01L 23/495

257728, 257734, 257676, 257784, 257698, 257691

An integrated circuit comprises an integrated circuit package and one or more circuit elements disposed within the integrated circuit package. The integrated circuit also comprises at least two differential wire bond pairs providing connections for at least one of the one or more circuit elements. Proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.

8084857, Dec 27, 2011

Jan 22, 2010

12/692209

Gavin Appel - Allentown PA, US
Ashley Rebelo - Emmaus PA, US
Christopher J. Wittensoldner - Alburtis PA, US

Agere Systems - Allentown PA

H01L 23/495

257728, 257784, 257786, 257659, 257678

A method and article of manufacture for performing wire-bonding operations in an integrated circuit. In one aspect, the operations include the steps of bonding a wire to a first bond site in the integrated circuit and terminating the wire at a second bond site. The bonding and terminating steps are repeated for at least two differential wire bond pairs, and proximate differential wire bond pairs of the at least two differential wire bond pairs have substantially different wire bond profiles.

20080227284, Sep 18, 2008

Mar 12, 2007

11/717227

Ashley Rebelo - Allentown PA, US
Todd Snider - Gilbert AZ, US

Agere Systems, Inc. - Allentown PA

H01L 21/44

438617, 257728, 257E2308, 257E21476

A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges.

20130285769, Oct 31, 2013

Apr 30, 2012

13/460243

Daniel L. Gerlach - Bethlehem PA, US
Ashley Rebelo - Allentown PA, US

LSI CORPORATION - Milpitas CA

H01P 3/08
H05K 3/10

333238, 29846

Multi-layer in integrated transmission line circuits are provided having improved signal loss characteristics. A multi-layer integrated transmission line circuit, such as a stripline circuit or a microstrip circuit, comprises at least one reference layer; at least one conducting layer having one or more conducting strips, wherein the at least one conducting layer is separated from the at least one reference layer by a substrate; and at least one additional layer positioned between the at least one conducting layer and the at least one reference layer. The multi-layer integrated transmission line circuit may also comprise a dielectric insulating material, such as an organic material or a ceramic material. The additional layers increase a dielectric thickness of the multi-layer integrated transmission line circuit to reduce dielectric losses.