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Andrew D Proescholdt

from Rancho Cordova, CA
Age ~48
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Also known as:
Andrew David Proescholdt, David A Proescholdt, Andy D Proescholdt
Phone and address:
11205 Platte River Ct, Rancho Cordova, CA 95670
(916) 859-0320
Related to:
Sue S Proescholdt, 76Susan ProescholdtJames Proescholdt, 45Terry A Proescholdt, 76Mary Proescholdt, 76
Connected to:
John R Proeschel, 87Nylia M Proescher, 68Robert P Proescholdt, 102Markie A Proesel, 39Linda S Proett, 64Michael O Proett, 81Steven Proetz, 69Sina S Proeung, 56Judy L Proeven, 67Carrissa M Profant, 53

Andrew Proescholdt Phones & Addresses

  • 11205 Platte River Ct, Rncho Cordova, CA 95670 (916) 859-0320
  • 10932 Pelara Ct, Rancho Cordova, CA 95670
  • 815 Murray Dr, Ames, IA 50010 (515) 233-5919
  • 1523 Creekside Dr, Folsom, CA 95630
  • Fair Oaks, CA
  • Sacramento, CA

Publications

Us Patents

Voltage Level Shifter

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US Patent:
6947328, Sep 20, 2005
Filed:
Dec 29, 2003
Appl. No.:
10/747802
Inventors:
Alec W. Smidt - Folsom CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
Boubekeur Benhamida - El Dorado Hills CA, US
Ravi Annavajjhala - Folsom CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G11C016/06
US Classification:
36518523, 36518524, 36518511
Abstract:
A high-speed voltage level shifter. A transistor () may be connected to high voltage (VPP) and may act as a source of a limited current to a first node (), and a driver () connected to the first node may provide a level-shifted output signal (VOUT) to a memory control input line of a memory cell (). A plurality of series-connected transistors (A–N) may be connected between a second node (A) and a circuit ground, each transistor may have an input connected to a corresponding control signal (VIN-A to VIN-N) from a control circuit (). A transistor () may be connected between the first node and the second node in a source-follower configuration and may have an input connected to a bias voltage (VBIAS) which may limit the voltage at node A, so transistors A–N may be low-voltage, high speed transistors.

Semiconductor Devices With Duplicated Die Bond Pads And Associated Device Packages And Methods Of Manufacture

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US Patent:
20210351164, Nov 11, 2021
Filed:
Jul 26, 2021
Appl. No.:
17/385681
Inventors:
- Boise ID, US
Trismardawi Tanadi - Sacramento CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
International Classification:
H01L 25/065
H01L 25/00
Abstract:
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

Error Correction Code Event Detection

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US Patent:
20200073754, Mar 5, 2020
Filed:
Oct 30, 2019
Appl. No.:
16/669343
Inventors:
- Boise ID, US
Paolo E. Mangalindan - Rancho Cordova CA, US
Jianfei Lei - Folsom CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
Gerard A. Kreifels - El Dorado Hills CA, US
International Classification:
G06F 11/10
G11C 29/52
G11C 29/50
Abstract:
Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

Semiconductor Devices With Duplicated Die Bond Pads And Associated Device Packages And Methods Of Manufacture

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US Patent:
20190319013, Oct 17, 2019
Filed:
Jun 27, 2019
Appl. No.:
16/455590
Inventors:
- Boise ID, US
Trismardawi Tanadi - Sacramento CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
International Classification:
H01L 25/065
H01L 25/00
Abstract:
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

Error Correction Code Event Detection

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US Patent:
20180314593, Nov 1, 2018
Filed:
Jul 9, 2018
Appl. No.:
16/030599
Inventors:
- Boise ID, US
Paolo E. Mangalindan - Rancho Cordova CA, US
Jianfei Lei - Folsom CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
Gerard A. Kreifels - El Dorado Hills CA, US
International Classification:
G06F 11/10
G11C 29/50
G11C 29/52
G11C 29/04
Abstract:
Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

Semiconductor Devices With Duplicated Die Bond Pads And Associated Device Packages And Methods Of Manufacture

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US Patent:
20180082983, Mar 22, 2018
Filed:
Dec 1, 2017
Appl. No.:
15/829428
Inventors:
- Boise ID, US
Trismardawi Tanadi - Sacramento CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
International Classification:
H01L 25/065
H01L 25/00
Abstract:
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

Error Correction Code Event Detection

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US Patent:
20180004596, Jan 4, 2018
Filed:
Jun 29, 2016
Appl. No.:
15/197446
Inventors:
- Boise ID, US
Paolo E. Mangalindan - Rancho Cordova CA, US
Jianfei Lei - Folsom CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
Gerard A. Kreifels - El Dorado Hills CA, US
International Classification:
G06F 11/10
G11C 29/50
G11C 29/52
Abstract:
Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

Semiconductor Devices With Duplicated Die Bond Pads And Associated Device Packages And Methods Of Manufacture

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US Patent:
20170207195, Jul 20, 2017
Filed:
Jan 14, 2016
Appl. No.:
14/995925
Inventors:
- Boise ID, US
Trismardawi Tanadi - Sacramento CA, US
Andrew D. Proescholdt - Rancho Cordova CA, US
International Classification:
H01L 25/065
H01L 25/00
Abstract:
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.
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Andrew D Proescholdt from Rancho Cordova, CA, age ~48 Get Report