Inventors:
Andrew John Lischefski - Oshkosh WI, US
Assignee:
Curwood, Inc. - Oshkosh WI
International Classification:
B32B 27/06
B32B 27/08
B32B 27/28
B32B 27/34
B32B 27/00
US Classification:
4284744, 528480, 528483, 5284758, 5284755, 5284752
Abstract:
Multilayer coextruded thermoformable structures for packaging film applications. The multilayer structures having at least a first layer comprising polyethylene terephthalate, a second layer of a first adhesive comprising a blend of at least an acrylate-based resin and either a modified polyolefin or a modified acrylate-based resin; a third layer of a thermoplastic oxygen barrier. The thermoplastic oxygen barrier may comprise ethylene/vinyl alcohol copolymer (EVOH), polyvinylidene chloride, or polyamide, preferably, a polyamide blend containing between 1–29% amorphous polyamide. The present invention may further comprise at least 5–7 thermoplastic layers.