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Andrew Joseph Adamczyk

from Auburn, AL
Age ~44

Andrew Adamczyk Phones & Addresses

  • Auburn, AL
  • Scottsdale, AZ
  • Emmaus, PA
  • Macungie, PA
  • 43 Dalrymple St, Jamaica Plain, MA 02130 (857) 203-9006
  • Santa Monica, CA
  • Evanston, IL
  • Chicago, IL

Work

Company: Versum materials 2016 to 2017 Position: Computational chemist and engineer

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Northwestern University 2005 to 2010 Specialities: Chemical Engineering

Skills

Molecular Modeling • Catalysis • Chemistry • Chemical Engineering • Simulations • Materials Science • Nanoparticles • Spectroscopy • Molecular Dynamics • Nanotechnology • R&D • Kinetics • Protein Chemistry • Reaction Engineering • Inorganic Chemistry • Surface Chemistry • Computational Chemistry • Characterization • High Throughput Screening • Research and Development • Research

Industries

Higher Education

Resumes

Resumes

Andrew Adamczyk Photo 1

Assistant Professor Of Chemical Engineering

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Location:
Auburn, AL
Industry:
Higher Education
Work:
Versum Materials 2016 - 2017
Computational Chemist and Engineer

Auburn University 2016 - 2017
Assistant Professor of Chemical Engineering

Air Products 2012 - 2016
Computational Chemist and Engineer

Massachusetts Institute of Technology (Mit) 2011 - 2012
Research Associate

University of Southern California 2010 - 2011
Research Associate
Education:
Northwestern University 2005 - 2010
Doctorates, Doctor of Philosophy, Chemical Engineering
Illinois Institute of Technology 1998 - 2002
Bachelors, Bachelor of Science, Chemical Engineering
Brother Rice High School 1994 - 1998
Skills:
Molecular Modeling
Catalysis
Chemistry
Chemical Engineering
Simulations
Materials Science
Nanoparticles
Spectroscopy
Molecular Dynamics
Nanotechnology
R&D
Kinetics
Protein Chemistry
Reaction Engineering
Inorganic Chemistry
Surface Chemistry
Computational Chemistry
Characterization
High Throughput Screening
Research and Development
Research

Publications

Us Patents

Etching Solution For Simultaneously Removing Silicon And Silicon-Germanium Alloy From A Silicon-Germanium/Silicon Stack During Manufacture Of A Semiconductor Device

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US Patent:
20190103282, Apr 4, 2019
Filed:
Sep 26, 2018
Appl. No.:
16/142291
Inventors:
- Tempe AZ, US
Yi-Chia Lee - Danshu, TW
Wen Dar Liu - Chupei City, TW
Chi-Hsien Kuo - Chupei City, TW
Andrew J. Adamczyk - Auburn AL, US
Assignee:
Versum Materials US, LLC - Tempe AZ
International Classification:
H01L 21/306
H01L 21/3105
H01L 21/02
H01L 29/06
H01L 29/423
H01L 29/10
Abstract:
Described herein is an etching solution suitable for the simultaneous removal of silicon and silicon-germanium from a microelectronic device, which comprises: water; an oxidizer; a buffer composition comprising an amine compound (or ammonium compound) and a polyfunctional organic acid; a water-miscible solvent; and a fluoride ion source.

Etching Solution For Selectively Removing Silicon Over Silicon-Germanium Alloy From A Silicon-Germanium/ Silicon Stack During Manufacture Of A Semiconductor Device

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US Patent:
20190085240, Mar 21, 2019
Filed:
Aug 22, 2018
Appl. No.:
16/109172
Inventors:
- Tempe AZ, US
Yi-Chia Lee - Chupei City, TW
Andrew J. Adamczyk - Auburn AL, US
Assignee:
Versum Materials US, LLC - Tempe AZ
International Classification:
C09K 13/02
H01L 21/8234
H01L 21/306
H01L 21/311
Abstract:
Etching compositions suitable for the selective removal of silicon over silicon-germanium from a microelectronic device comprising: water; at least one of a quaternary ammonium hydroxide compound and an amine compound; water-miscible solvent; optionally surfactant and optionally corrosion inhibitor; and the method of using the etching composition for the selective removal.

Etching Solution For Selectively Removing Silicon-Germanium Alloy From A Silicon-Germanium/Silicon Stack During Manufacture Of A Semiconductor Device

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US Patent:
20190088492, Mar 21, 2019
Filed:
Aug 22, 2018
Appl. No.:
16/108499
Inventors:
- Tempe AZ, US
Yi-Chia Lee - Chupei City, TW
Andrew J. Adamczyk - Auburn AL, US
Assignee:
Versum Materials US, LLC - Tempe AZ
International Classification:
H01L 21/306
H01L 21/02
C09K 13/06
C09K 13/08
Abstract:
Described herein is an etching solution comprising water; oxidizer; water-miscible organic solvent; fluoride ion source; and optionally, surfactant. Such compositions are useful for the selective removal of silicon-germanium over poly silicon from a microelectronic device having such material(s) thereon during its manufacture.

Use Of Silyl Bridged Alkyl Compounds For Dense Osg Films

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US Patent:
20180122632, May 3, 2018
Filed:
Oct 20, 2017
Appl. No.:
15/789790
Inventors:
- Tempe AZ, US
Robert Gordon Ridgeway - Chandler AZ, US
Jennifer Lynn Anne Achtyl - Chandler AZ, US
William Robert Entley - Center Valley PA, US
Dino Sinatore - Whitehall PA, US
Kathleen Esther Theodorou - Bethlehem PA, US
Andrew J. Adamczyk - Scottsdale AZ, US
International Classification:
H01L 21/02
C23C 16/50
C23C 16/48
C23C 16/46
Abstract:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.
Andrew Joseph Adamczyk from Auburn, AL, age ~44 Get Report