Alvin Kong

6480076, Nov 12, 2002

Dec 21, 2000

09/745820

David S. Yip - La Mirada CA
Alvin M. Kong - Manhattan Beach CA
Rahil U. Bhorania - Redondo Beach CA

TRW Inc. - Redondo Beach CA

H03H 964

333193, 333195, 310313 B

The invention relates to a new family of surface acoustic wave single-phase unidirectional transducers (SPUDTs) by using M uniform width, uniformly spaced, single-level interdigitated electrodes lying on a uniform grid of a piezoelectric substrate where unidirectionality is achieved by selectively etching reflective structures into the substrate either in the spaces located between adjacent electrodes or under selected electrodes of the transducer. A SAW filter, resonator or delay line can also be formed by fabricating two such transducers on a single substrate, each having surface acoustic waves radiating towards the other.

6836197, Dec 28, 2004

Feb 28, 2003

10/377379

Davis S. Yip - La Mirada CA
Edward M. Garber - Los Angeles CA
Alvin M. Kong - Manhattan Beach CA

Northrop Grumman Corporation - Los Angeles CA

H03H 964

333195, 333196, 310313 D

A dual track SAW reflector filter ( ) including a first track ( ) and a second track ( ). The first track and the second track ( ) include an input transducer ( ), an output transducer ( ), first reflectors ( ) and second reflectors ( ). The reflectivity function of the first reflectors ( ) and the second reflectors ( ) are equal in magnitude and opposite in phase. The input transducers ( ) have the same polarity and the output transducers ( ) have opposite polarities. Surface acoustic waves produced by the input transducers ( ) and received directly by the output transducers ( ) are in phase and cancel at the output transducers ( ). Surface acoustic waves reflected by the reflectors ( and ) are in phase and add at the output transducers ( ).

6847272, Jan 25, 2005

Feb 28, 2003

10/376802

Davis S. Yip - La Mirada CA, US
Edward M. Garber - Los Angeles CA, US
Alvin M. Kong - Manhattan Beach CA, US

Northrop Grumman Corporation - Los Angeles CA

H03H 925
H03H 964

333195, 310313 D

A reflective grating () having spaced grid lines () patterned on a piezoelectric substrate () for controlling the magnitude and phase of surface acoustic waves () in a reflective filter () or resonator. The magnitude and phase of the surface acoustic wave () are controlled by a sampling period () of the reflective grating () and the density and sequence of distributed acoustic reflective dots (). The reflective dots () are randomly distributed within gaps () between adjacent grid lines () or on top of the grid lines () of the reflective grating (). The pattern of the reflective dots distributed within the gaps () or on the grid lines () is determined by the dot density, where the dot density varies from a lowest density of 0 to a maximum density of 1.

6873223, Mar 29, 2005

Dec 16, 2002

10/320926

Robert B. Stokes - Rancho Palos Verdes CA, US
Alvin M. Kong - Manhattan Beach CA, US

Northrop Grumman Corporation - Los Angeles CA

H01P001/10

333105, 333262

An RF switch useable up to millimeter wave frequencies and higher frequencies of 30 GHz and above. Four embodiments of the invention are configured as ground switches. Two of the ground switch embodiments are configured with a planar air bridge. Both of these embodiments are configured so that the bridge length is shortened between the transmission line and ground by introducing grounded stops. The other two ground switch embodiments include an elevated metal seesaw. In these embodiments, a shortened path to ground is provided with relatively low inductance by proper sizing and positioning of the seesaw structure. Lastly, broadband power switch embodiment is configured to utilize only a small portion of the air bridge to carry the signal. The relatively short path length results in a relatively low inductance and resistance lowers the RF power loss of the switch, thereby increasing the RF power handling capability of the switch.

7067397, Jun 27, 2006

Jun 23, 2005

11/159473

Patty P. Chang-Chien - Redondo Beach CA, US
Kelly J. Tomquist - Torrance CA, US
Craig B. Geiger - Downey CA, US
Alvin M. Kong - Manhattan Beach CA, US

Northrop Gruman Corp. - Los Angeles CA

H01L 21/30

438459, 438106, 438121

Monolithic microwave integrated circuit (MMIC) components and micro electromechanical systems (MEMS) components are integrated onto a single substrate at a wafer scale, by first performing MMIC and MEMS fabrication on a front face of a thick substrate wafer, bonding the substrate wafer to a cover wafer, thinning the back face of the substrate wafer and, finally, completing MMIC and MEMS fabrication on the back face of the thinned substrate wafer. The fabrication process is facilitated by use of a guard ring between the wafers to provide additional mechanical support to the substrate wafer and to protect the devices while the MMIC/MEMS fabrication is completed, and by a low temperature bonding process to join the substrate wafer and the cover wafer at multiple device cavity seal rings.

7656253, Feb 2, 2010

Apr 18, 2007

11/788081

Robert Bruce Stokes - Rancho Palos Verdes CA, US
Alvin Ming-Wei Kong - Manhattan Beach CA, US

Northrop Grumman Space & Mission Systems Corporation - Los Angeles CA

H03H 9/00
H03H 9/145

333193, 333188

An apparatus in one example comprises a piezoelectric layer, an input transducer, an output transducer, and at least one electrode set. The input transducer is configured to convert an input signal from an input source to a surface acoustic wave and send the surface acoustic wave from an input portion of the piezoelectric layer to an output portion of the piezoelectric layer. The input transducer comprises a set of input passbands. The output transducer is configured to receive the surface acoustic wave from the output portion of the piezoelectric layer. The output transducer comprises a set of output passbands. The at least one electrode set is configured to apply at least one voltage bias to at least one portion of the piezoelectric layer to create an electric field that controls an acoustic velocity of the surface acoustic wave through the at least one portion of the piezoelectric layer. The at least one electrode set is configured to control one or more of the set of input passbands and the set of output passbands by adjustment of the at least one voltage bias.

7687971, Mar 30, 2010

Aug 15, 2006

11/504372

Robert Bruce Stokes - Rancho Palos Verdes CA, US
Alvin Ming-Wei Kong - Manhattan Beach CA, US

Northrop Grumman Corporation - Los Angeles CA

H01L 41/047

310313B, 310313 R

An apparatus in one example comprises a piezoelectric layer, a first electrode along a first side of the piezoelectric layer, and a second electrode along a second side of the piezoelectric layer. The first and second electrodes are adapted to receive a voltage bias to create an electric field in the piezoelectric layer that controls an acoustic velocity of a surface acoustic wave.

7755455, Jul 13, 2010

Sep 18, 2007

11/901568

Alvin Ming-Wei Kong - Manhattan Beach CA, US

Northrop Grumman Systems Corporation - Los Angeles CA

H03H 9/00
H01L 41/047

333193, 333133

An apparatus in one example comprises an insulating piezoelectric layer, a base electrode along a first side of the insulating piezoelectric layer, and at least one gradient electrode along a second side of the insulating piezoelectric layer. The at least one gradient electrode is configured to provide a voltage gradient across an aperture of a surface acoustic wave (SAW) filter. The base electrode and the at least one gradient electrode are configured to provide a voltage bias across the insulating piezoelectric layer. The voltage bias comprises a gradient based on the voltage gradient across the aperture of the SAW filter. The base electrode and the at least one gradient electrode are configured to control at least one frequency characteristic of the SAW filter based on the voltage bias across the insulating piezoelectric layer.