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Alvin Dangca Phones & Addresses

  • 473 Donahe Pl, Milpitas, CA 95035 (408) 513-5177
  • 557 Parvin Dr, Milpitas, CA 95035

Work

Company: Formfactor llc Feb 2012 Position: Manufacturing technician

Education

School / High School: Adamson University- Manila Specialities: Bachelor of Science in Mechanical Engineering

Emails

Industries

Semiconductors

Resumes

Resumes

Alvin Dangca Photo 1

Manufacturing Technician

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Location:
Milpitas, CA
Industry:
Semiconductors
Work:
Formfactor Inc.
Manufacturing Technician
Alvin Dangca Photo 2

Alvin Dangca Milpitas, CA

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Work:
FORMFACTOR LLC

Feb 2012 to 2000
Manufacturing Technician

STION thru Balance Staffing

Jan 2011 to Oct 2011
Production Operator

ADVANCED MICRO DEVICES / SPANSION LLC
Sunnyvale, CA
Oct 1998 to Feb 2009
Master Process Technician

ADVANCED MICRO DEVICES / SPANSION LLC
Sunnyvale, CA
Aug 1987 to Feb 2009
MASTER TECHNICIAN

ADVANCED MICRO DEVICES / SPANSION LLC
Sunnyvale, CA
1994 to 2009
Member of ERT

Advanced Micro Devices
Sunnyvale, CA
Oct 1994 to Sep 1998
Associate Engineer

ADVANCED MICRO DEVICES
Sunnyvale, CA
Jun 1994 to Sep 1994
Senior Process Technician

ADVANCED MICRO DEVICES
Sunnyvale, CA
Jan 1991 to Sep 1994
Wafer FAB Technician

Advanced Micro Devices
Sunnyvale, CA
Aug 1987 to Sep 1990
Wafer FAB Specialist

Education:
Adamson University
Manila
Bachelor of Science in Mechanical Engineering

Publications

Us Patents

Chemical-Mechanical Polishing Of Photoresist Layer

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US Patent:
6422918, Jul 23, 2002
Filed:
Jan 4, 2000
Appl. No.:
09/478118
Inventors:
Steven Avanzino - Cupertino CA
Bhanwar Singh - Morgan Hill CA
Bharath Rangarajan - Santa Clara CA
Alvin M. Dangca - Milpitas CA
Assignee:
Advanced Micro Devices, Inc. - Sunnyvale CA
International Classification:
B24B 4900
US Classification:
451 8, 451 6, 451 41, 451283
Abstract:
The present invention relates to a system for controllably removing photoresist. A CMP system is employed for polishing the photoresist. A non-abrasive polishing liquid adapted to react with the photoresist to sufficiently modify bonding in the photoresist is employed to facilitate surface layer removal of the photoresist by applied mechanical stress from the CMP system.
Alvin B Dangca from Milpitas, CA Get Report