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Allen Edward Hopkins

from Pollock Pines, CA
Age ~50
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Also known as:
Allen Teresa Hopkins, Allen E Hopkins, Allene Hopkins, Edward Hopkins Allen
Phone and address:
3264 Gold Ridge Trl, Pacific House, CA 95726
(530) 363-4713
Related to:
Shirley J Foster, 66
Connected to:
Aaliyah J Hopkins, 30Alejandro F Hopkins, 53Alice F Hopkinson, 90Alyce K Hopkins, 78Anastasia Hopkinson, 80Andrette R Hopkins, 61Ariann Hopkins, 34Arie Hopkins, 79Arwyn E Hopkins, 44Ashdon T Hopkins, 32

Allen Hopkins Phones & Addresses

  • 3264 Gold Ridge Trl, Pollock Pines, CA 95726 (530) 363-4713
  • Barton, NY
  • Roaring Branch, PA
  • Rancho Cucamonga, CA
  • Cameron Park, CA
  • Placerville, CA
  • Cortland, NY
  • El Dorado, CA
  • Diamond Springs, CA
  • Saint Marys, GA

Resumes

Resumes

Allen Hopkins Photo 1

Public Works Superintendent

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Location:
Pollock Pines, CA
Industry:
Construction
Work:
City of Placerville
Public Works Superintendent
Allen Hopkins Photo 2

Allen Hopkins

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Allen Hopkins Photo 3

Allen Hopkins

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Allen Hopkins Photo 4

Allen Hopkins

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Allen Hopkins Photo 5

Allen Hopkins

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Allen Hopkins
Managing
A & B Water and Wastewater Services, LLC

Publications

Us Patents

Apparatus For Preventing Drag-Out

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US Patent:
6372101, Apr 16, 2002
Filed:
Sep 8, 1999
Appl. No.:
09/391724
Inventors:
Ralph A. Barrese - Binghamton NY
Allen H. Hopkins - Barton NY
John J. Konrad - Endicott NY
Donald L. Putman - Johnson City NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C25B 900
US Classification:
204279, 204207, 118122, 15 881
Abstract:
An apparatus for preventing drag-out is provided. The apparatus is arranged at an exit where a workpiece leaves a plating chamber. Brush members are arranged to contact both sides of the workpiece as it leaves the plating chamber. The brush members are adjustably arranged in a housing such that the angle of the brush member relative to the workpiece can be varied. A locking mechanism is provided to hold the brush member at a selected angle. The entire apparatus is adjustably inward and outward with respect to the workpiece as well as with respect to the plating chamber.

Selective Shield/Material Flow Mechanism

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US Patent:
6746578, Jun 8, 2004
Filed:
May 31, 2001
Appl. No.:
09/871557
Inventors:
Ralph A. Barrese - Binghamton NY
Gary Gajdorus - Binghamton NY
Allen H. Hopkins - Barton NY
John J. Konrad - Endicott NY
Robert C. Schaffer - Newark Valley NY
Timothy L. Wells - Apalachin NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C25D 1700
US Classification:
204224R, 204DIG 7, 205 96, 205133, 205157, 427 98, 427304, 427437, 4274431
Abstract:
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Selective Shield/Material Flow Mechanism

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US Patent:
7288177, Oct 30, 2007
Filed:
Mar 30, 2004
Appl. No.:
10/813351
Inventors:
Ralph A. Barrese - Binghamton NY, US
Gary Gajdorus - Binghamton NY, US
Allen H. Hopkins - Barton NY, US
John J. Konrad - Endicott NY, US
Robert C. Schaffer - Newark Valley NY, US
Timothy L. Wells - Apalachin NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C25D 5/00
C25D 5/08
C25D 7/12
C25D 17/00
US Classification:
205 96, 205133, 205157, 204224 R, 427304, 427437, 4274431
Abstract:
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Selective Shield/Material Flow Mechanism

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US Patent:
7425256, Sep 16, 2008
Filed:
Sep 14, 2007
Appl. No.:
11/855507
Inventors:
Ralph A. Barrese - Binghamton NY, US
Gary Gajdorus - Binghamton NY, US
Allen H. Hopkins - Barton NY, US
John J. Konrad - Endicott NY, US
Robert C. Schaffer - Newark Valley NY, US
Timothy L. Wells - Apalachin NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C25D 5/08
US Classification:
205133, 205 96, 205157, 427304, 427437, 4274431
Abstract:
An apparatus and method for plating a workpiece. The apparatus comprises, generally, an anode, a cathode, and a selective anode shield/material flow assembly. In use, both the anode and the cathode are immersed in a solution, and the cathode is used to support the workpiece. During an electroplating process, the anode and the cathode generate an electric field emanating from the anode towards the cathode, to generate a corresponding current to deposit an electroplating material on the workpiece. The selective shield/material flow assembly is located between the anode and the cathode, and forms a multitude of adjustable openings. These opening have sizes that are adjustable during the electroplating process for selectively and controllably adjusting the amount of electric flux passing through the selective shield/material flow assembly and the distribution of the electroplating material on the workpiece. The selective shield/material flow assembly can also be used with an electroless plating system. At least one selective shield material flow mechanism is used in a selective shield material flow assembly.

Wikipedia References

Allen Hopkins Photo 6

Allen Hopkins (Pool Player)

Allen Hopkins Photo 7

Allen Hopkins (Soccer Commentator)

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Allen Edward Hopkins from Pollock Pines, CA, age ~50 Get Report