Inventors:
Albert K. Bachman - Allentown PA
Assignee:
Western Electric Company - New York NY
International Classification:
C25D 502
C25D 712
Abstract:
Methods of forming conductive paths including beam leads on a surface of a semiconductor wafer includes the deposition of conductive films of materials such as titanium and platinum on the surface as a base for a subsequent deposition of a metal, such as gold. By selectively etching the titanium and platinum films, patterns of the desired conductors are generated. An intermediate masking step shields the surface of the wafer while the beam leads are plated prior to gold plating the remaining conductors of the pattern.