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Adolphus E Mcclanahan

from Plano, TX
Age ~70
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Also known as:
Adolphus Edward Mcclanahan, Adolfus E Mcclanahan, Adolphus E Mclanahan, Adolphis E Mcclanahan, Adolphus E Mcclanaham, Barbara Mcclanahan, Adolphus Mc
Related to:
David R Kemp, 62Letisha Mcenery, 63Barbara Fowler, 74Debra Davis, 41Daniel L Mcgehee, 47
Connected to:
Amanda Mcclanahan, 44Arthur L Mcclanahan, 73Brenda J Mcclanahan, 81Brett R Mcclanahan, 34Chelsea Mcclanahan, 31Cindy L Mcclanathan, 68Colleen R Mcclanahan, 60Courtney J Mcclanahan, 30Dylan P Mcclanahan, 28Elizabeth W Mcclanan, 61

Adolphus Mcclanahan Phones & Addresses

  • Plano, TX
  • Dallas, TX
  • Garland, TX
  • 870 Saratoga Ave, San Jose, CA 95129
  • Bluefield, VA
  • 3802 Bellaire Dr, Garland, TX 75040 (210) 508-7938

Work

Position: Construction and Extraction Occupations

Education

Degree: Graduate or professional degree

Resumes

Resumes

Adolphus Mcclanahan Photo 1

Dallas And Fort Worth Area

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Location:
Dallas, TX
Industry:
Semiconductors
Work:
Texas Instruments
Thin Films Equipment Engineer
Texas Instruments Nov 2011 - Nov 2012
Probe Card Operations Manager
Texas Instruments Dec 2007 - Nov 2012
Applications Process Test Engineer Make Member Group Technical Staff
Texas Instruments Oct 2010 - Nov 2011
Probe Card Support Manager
Texas Instruments Mar 2007 - Oct 2010
Applications Engineer
Education:
Virginia Tech 1970 - 1974
Skills:
Electronics
Thin Films
Semiconductors
Semiconductor Industry
Cvd
Testing
Spc
Engineering Management
Analog
Adolphus Mcclanahan Photo 2

Applications Engineer

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Location:
Dallas, TX
Industry:
Semiconductors
Work:
Texas Instruments
Applications Engineer
Adolphus Mcclanahan Photo 3

Adolphus Mcclanahan

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Location:
Dallas, TX

Publications

Us Patents

Lighted Cassette Alignment Fixture

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US Patent:
6846095, Jan 25, 2005
Filed:
Jul 19, 2002
Appl. No.:
10/199262
Inventors:
Adolphus E. McClanahan - Garland TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
F21V 3300
US Classification:
362253, 362154
Abstract:
Disclosed is a lighted wafer cassette for use in semiconductor wafer processing. Also disclosed are systems and methods employing a wafer cassette lighted with one or more affixed light sources for facilitating cassette alignment with standard semiconductor processing apparatus.

System And Method For The Probing Of A Wafer

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US Patent:
7068056, Jun 27, 2006
Filed:
Jul 18, 2005
Appl. No.:
11/184216
Inventors:
Byron H. Gibbs - McKinney TX, US
Phillip H. Ball - Richardson TX, US
Adolphus E. McClanahan - Garland TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01R 31/02
US Classification:
324754
Abstract:
In one embodiment, a method for probing a wafer includes providing a plurality of pressure sensors on a surface of a probe card holding tray, positioning a probe card of a testhead relative to a prober supporting a wafer, engaging the probe card with the probe card holding tray, receiving a plurality of pressure signals from respective pressure sensors, and comparing the pressure signals to determine if the probe card is substantially parallel with the prober.

Probe Card And Temperature Stabilizer For Testing Semiconductor Devices

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US Patent:
7495458, Feb 24, 2009
Filed:
May 17, 2006
Appl. No.:
11/383866
Inventors:
Adolphus E. McClanahan - Garland TX, US
John D. Wolfe - Celina TX, US
Michael P. Harris - Garland TX, US
Frank J. Mesa - Murphy TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01R 31/02
US Classification:
324754
Abstract:
One aspect of the invention provides an apparatus that includes a probe card having probe needles associated therewith. A temperature stabilizer element is couplable to the probe card. The temperature stabilizer is configured to either raise or lower a temperature of the probe needles to reduce movement of the probe needles.

System And Method For The Probing Of A Wafer

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US Patent:
20060071679, Apr 6, 2006
Filed:
Oct 4, 2004
Appl. No.:
10/958777
Inventors:
Byron Gibbs - McKinney TX, US
Adolphus McClanahan - Garland TX, US
Phillip Ball - Richardson TX, US
International Classification:
G01R 31/26
US Classification:
324765000
Abstract:
According to one embodiment of the invention, a method for probing a wafer includes positioning a testhead relative to a prober supporting a wafer in a testing position. The method also includes receiving at least one prober signal identifying the angular position of the prober and at least one testhead signal identifying the angular position of the testhead. The at least one prober signal and the at least one testhead signal are processed to determine if the testhead is substantially parallel with the prober, and output is provided to allow for adjustment of the position of the testhead in response to determining that the testhead is not substantially parallel with the prober.

Probe Card And Temperature Stabilizer For Testing Semiconductor Devices

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US Patent:
20090115441, May 7, 2009
Filed:
Jan 13, 2009
Appl. No.:
12/353082
Inventors:
Adolphus E. MCCLANAHAN - Garland TX, US
John D. WOLFE - Celina TX, US
Michael P. HARRIS - Garland TX, US
Frank J. MESA - Murphy TX, US
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01R 31/02
G01R 31/26
US Classification:
324760
Abstract:
One aspect of the invention provides an apparatus that includes a probe card [ having probe needles [ associated therewith. A temperature stabilizer element [ is couplable to the probe card [. The temperature stabilizer [ is configured to either raise or lower a temperature of the probe needles [ to reduce movement of the probe needles [

Clamp With Wafer Release For Semiconductor Wafer Processing Equipment

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US Patent:
55135943, May 7, 1996
Filed:
Oct 20, 1993
Appl. No.:
8/140351
Inventors:
Adolphus E. McClanahan - San Jose CA
Frederick T. Turner - Sunnyvale CA
Kenneth E. Anderson - San Jose CA
Phillip B. Nicholson - San Jose CA
Martin A. Hutchinson - Santa Clara CA
International Classification:
B05C 1300
US Classification:
118503
Abstract:
An apparatus for releasably clamping a substrate to a support platform, or other support system, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.

Clamp With Wafer Release For Semiconductor Wafer Processing Equipment

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US Patent:
56058667, Feb 25, 1997
Filed:
Nov 30, 1995
Appl. No.:
8/565355
Inventors:
Adolphus E. McClanahan - San Jose CA
Frederick T. Turner - Sunnyvale CA
Kenneth E. Anderson - San Jose CA
Phillip B. Nicholson - San Jose CA
Martin A. Hutchinson - Santa Clara CA
Assignee:
Varian Associates, Inc. - Palo Alto CA
International Classification:
H01L 21302
US Classification:
437225
Abstract:
An apparatus for releasably clamping a substrate to a support platform, or other support means, at a face of the substrate is described. In one embodiment, a retractable clamp holds a substrate near its edges on a support platform when the clamp is in its fully extended position. One or more leaf springs are mounted to the clamp and apply force to the substrate at respective points in the event the substrate adheres to the clamp, thereby releasing the substrate from the clamp. In a preferred embodiment of the present invention, one or more activators are positioned in cooperative relationship to the leaf springs to cause the leaf springs to retract into recesses in the clamp when the clamp is extended against the substrate. In their retracted position, the leaf springs do not contact the substrate so as to minimize the generation of particle contamination and the chance of the release leaf springs themselves adhering to the substrate.
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Adolphus E Mcclanahan from Plano, TX, age ~70 Get Report