Van Huy Pham

8501645, Aug 6, 2013

Jun 30, 2005

11/171900

Van Hai Pham - Irvine CA, US

D02G 3/22

442339, 4283044, 428376, 428397

Filamentous bodies which are longitudinally extended and other film-like constructions are made by combining liquid silicone-containing precursors with air and extruding them. Distinct types or grades of fibers, strands, and other film-like constructions are produced which have a multiplicity of useful applications and indications for use owing to their inherent memory, compactability, tensile strength and density. Processes for making the novel enhanced filamentous bodies and products by the same can be optimized for uses ranging from safe and effective (“leak-free”) prosthetics to cushions, inserts, membranes, in a plurality of fields from consumer electronics to medical devices, and athletic or orthopedic shoe inserts.

61001015, Aug 8, 2000

Oct 27, 1998

9/179172

Amit P. Marathe - Santa Clara CA
Nguyen D. Bui - San Jose CA
Van Pham - Milpitas CA

Advanced Micro Devices Inc. - Sunnyvale CA

G01R 3126

438 14

A categorization of a particular semiconductor wafer based on void size is obtained from sigma data and T0. 1% failure data that has been obtained from wafers subjected to isothermal testing. The sigma data and the T0. 1% failure data for the particular wafer is compared to stored data corresponding to ranges for sigma and T0. 1% data for each of a plurality of void categories, and the particular wafer is categorized based on the stored data. The T0. 1% failure data is computed based on a T50% failure data and the sigma value, so that small sample sizes can be utilized to obtain the stored data.

63298317, Dec 11, 2001

Aug 8, 1997

8/908794

Nguyen Duc Bui - San Jose CA
Michael Anthony Niederhofer - Milpitas CA
Van Hung Pham - Milpitas CA

Advanced Micro Devices, Inc. - Sunnyvale CA

G01R 3126
G01R 3102

324765

A method and apparatus for monitoring and controlling integrated circuit devices-under-test (DUTS). A preferred embodiment includes a computer based controller, a temperature control module, a power supply controller, a chamber interface module, a driver card and a DUT board. The computer-based controller responding to preprogrammed instructions (software) operates and coordinates the temperature control module, the chamber interface module, the power supply controller, and the driver card. The driver card, receiving commands and data from the computer-based controller, sends and receives a number of signals to and from the DUTs on the DUT board. These signals include voltage sources for operating the DUTs, a load voltage, DC current sources for setting duty and frequency cycles, switch signals, voltage measurement signals, and resistance measurement signals. The DUT board is a printed circuit board for holding a number of DUTs. Each of the DUTs is an integrated circuit containing one or more sets of circuitry for testing specifically designed test structures.

60752939, Jun 13, 2000

Mar 5, 1999

9/263412

Xiao-Yu Li - San Jose CA
Sunil D. Mehta - San Jose CA
Van H. Pham - Milpitas CA
Amit P. Marathe - Santa Clara CA

Advanced Micro Devices, Inc. - Sunnyvale CA

H01L 2348

257763

A multi-level metal interconnect structure in a semiconductor device includes a plurality of overlying metal layers separated by ILD layers and electrically connected by filled vias in the ILD layers. Each metal layer includes a relatively thick antireflective layer for improved electromigration resistance. Each metal layer also includes a metal lining layer and a metal interconnect layer overlying the metal lining layer. Enhanced electromigration resistance is obtained by forming the antireflective layer to a thickness of no less than the thickness of the metal lining layer. In a preferred embodiment of the invention, the antireflective layer has a thickness of about 1000 angstroms.

50302329, Jul 9, 1991

Oct 22, 1990

7/600265

Van H. Pham - Irvine CA

A61F 218

623 10

The nasal implant of this invention is characterized by a composition of hard-grade silicone fashioned into a special shape. One variation in the composition material is to use soft silicone only for the tip in order to overcome the fear of some surgeons to use hard silicone in this particular area. A special and improved shape of the implant, in the form of a modified hourglass, provides a well rounded and larger tip portion thanb that of the prior art. The supra-tip of this improved implant shows a depression dorsally, is less wide than the rest of the implant and has a pronounced slope laterally. These features, particularly at the supra-tip region avoid the unnatural effects of the prior art devices. Moreover this implant has a variable thickness form upper end to tip -that is it starts thin, increases in thickness and then goes thinner again- whereas the prior art starts thin and continually increases throughout.

20140199915, Jul 17, 2014

Oct 18, 2011

13/880138

Van Hai Pham - Santa Ana CA, US
Donna Jackson - Ft. Worth TX, US

Leidez, LLC - Ft. Worth TX

A41C 3/14
A61F 2/52

450 57, 623 7, 524588

Filamentous bodies which are longitudinally extended and other film-like constructions are made by combining liquid siliceous precursors with air and extruding them. Distinct types or grades of fibers, strands, and other film-like constructions are produced which have a multiplicity of useful applications and indications for use owing to their inherent memory, compactability, tensile strength and density. A prosthetic device for a mastectomy bra is constructed with filamentous bodies. It can be sewn permanently into the bra cup. The device can be refilled to counteract volume loss.