Richard W Perry

7276921, Oct 2, 2007

Jun 30, 2003

10/612712

Richard S Perry - Portland OR, US

Intel Corporation - Santa Clara CA

G01R 31/26

324754, 324761

A test device includes an element having a surface for contacting a first plane, and a probe having a free end positioned in a second plane. The element of the test having the surface to contact the first plane includes features for contacting a ground plane. The length of the probe in the test device is greater than the length of the element having a surface for contacting the first plane. An electronic package includes a printed circuit board having a primary side, and a secondary side. A component, having a main body, is attached to the primary side of the printed circuit board. A pad is attached to the main body of the component. The printed circuit board has an opening therein positioned near the pad. The probe passes through the opening in the printed circuit board to contact the pad from the secondary side of the printed circuit board. A method for testing a device under test includes contacting a first pad on the device under test located in a first plane, and contacting a second pad on the device under test in a second plane substantially simultaneously as contacting the first pad.

7656151, Feb 2, 2010

Sep 18, 2007

11/857320

Richard S Perry - Portland OR, US

Intel Corporation - Santa Clara CA

G01R 31/28

3241581

An electronic package includes a printed circuit board having a primary side, and a secondary side. A component, having a main body, is attached to the primary side of the printed circuit board. A pad is attached to the main body of the component. The printed circuit board has an opening therein positioned near the pad.

7724542, May 25, 2010

Dec 30, 2006

11/618817

Ron W. Gallahan - Portland OR, US
Richard S. Perry - Portland OR, US
Michael Stewart - Hillsboro OR, US
Pedro A. Gutierrez - San Diego CA, US
Donald M. Hammon - Fox Island WA, US

Intel Corporation - Santa Clara CA

H05K 9/00

361816, 361818

Certain embodiments relate to electronic devices and methods for forming electronic devices having a component shielded by a reworkable RF shield. The RF shield may be positioned to surround one or more components on a substrate. The RF shield may include a plurality of sidewalls and a top wall, the plurality of sidewalls including bumps extending outward therefrom. A portion of the top wall may be removed from the RF shield. The one or more components positioned under the top wall of the RF shield may be repaired or replaced if necessary. A lid may then be positioned over the removed portion of the top wall and placed so that the bumps engage apertures in the lid and result in the lid being rigidly coupled to the sidewalls. In one aspect of certain embodiments, a groove may be formed on one or more surfaces of the top wall. Other embodiments are described and claimed.

20220408561, Dec 22, 2022

Aug 23, 2022

17/894032

- Santa Clara CA, US
Richard S. PERRY - Portland OR, US
Oren HUBER - Nes Ammim, IL
Venkataramani GOPALAKRISHNAN - Folsom CA, US

H05K 1/11
H01L 23/498
H05K 3/34
H01L 21/48

A novel method and interface are provided to generalize power delivery (PD) solutions and allow OEMs and suppliers to easily replace PD solutions using the same design and layout without having to re-spin the motherboard. This is achieved by defining a new interface and ball-out which support dual port PD solution that meet the system requirements. The embodiments employ an interposer to unify different PD solutions. The interposer is part of a unique Land Grid Array (LGA) soldered down solution with pre-defined interface employing a generic pinout to support PD solutions for dual type-C ports from different vendors. The interposer includes an LGA having a pattern of pads that is coupled to a LGA on a platform PCB with a matching pattern.

20200203834, Jun 25, 2020

Sep 30, 2017

16/643722

- Santa Clara CA, US
Sidharth Dalmia - Portland OR, US
Trang Thai - Hillsboro OR, US
Josef Hagn - Munich, DE
Richard S. Perry - Portland OR, US
Jonathan C. Jensen - Portland OR, US
Raanan Sover - Haifa, IL

INTEL CORPORATION - Santa Clara CA

H01Q 9/04
H01Q 1/24
H01Q 13/06

Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

20200185806, Jun 11, 2020

Dec 7, 2018

16/213181

- Santa Clara CA, US
Daniel Cox - Hillsboro OR, US
Bhagyashree S. Ganore - Hillsboro OR, US
Jesse Melhorn - Keizer OR, US
Richard Perry - Portland OR, US

H01Q 1/02
H01Q 1/32

Techniques are disclosed to remedy thermal issues associated with antenna systems. These techniques include implementing heat pipes coupled between an external mast having antenna circuitry mounted thereon and an internal heatsink inside an environmentally-controlled location. This configuration thermally regulates heat associated with active antennas mounted to the mast, which is externally mounted onto the roof of a vehicle. The heat pipes carry heat from the mast down through the roof to the internal heatsink. The aspects described herein allow for car manufacturers to integrate mmWave technology into their vehicles while avoiding large and unsightly cooling mechanisms that would otherwise adversely impact aerodynamics and fuel efficiency.

20190260110, Aug 22, 2019

Mar 28, 2018

15/939139

- Santa Clara CA, US
Raanan Sover - Haifa, IL
Noam Kogan - Tel-Aviv, IL
Jonathan Jensen - Portland OR, US
Richard Perry - Portland OR, US
William James Lambert - Chandler AZ, US
Omer Asaf - Oranit M, IL
Ralph Winzenburg - Bruckmuehl, DE
Daniel R. Cox - Hillsboro OR, US
Josef Hagn - Taufkirchen, Bavaria, DE
Sidharth Dalmia - Portland OR, US

Intel Corporation - Santa Clara CA

H01Q 1/22
H01Q 9/04
H01Q 21/06

Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.