Inventors:
William D. Bjorndahl - Torrance CA
M. David Saferstein - Los Angeles CA
Alexander Krayner - Sherman Oaks CA
Cindy S. Fietze - Redondo Beach CA
Kenneth C. Selk - Hermosa Beach CA
Rene R. Martinez - Lakewood CA
William E. McMullen - Redondo Beach CA
Assignee:
TRW Inc. - Redondo Beach CA
International Classification:
H01R 1204
Abstract:
A multilayer wiring board comprises a substrate having a plurality of layers of reinforced resin material â, a patterned conductive layer â provided on at least one major surface of the substrate, a plurality of via holes provided at least partly through the substrate, and a plurality of signal carrying wires â. The signal carrying wires â are provided between at least two of the layers of reinforced resin material â. The signal carrying wires â can be embedded in a resin layer â, and the resin layer â sandwiched between a pair of the layers of reinforced resin material. The reinforced resin material is preferably a fiber reinforced resin material, such as a glass fiber reinforced epoxy or polyimide material. In some applications, a constrained core â, e. g. , a copper/ molybdenum/copper laminate, can be provided between a major surface of the substrate and the pair of reinforced resin layers sandwiching the signal carrying wires â.