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Quan M Tran

from San Jose, CA
Age ~47
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Also known as:
Quan B Tran, Quan N Tran, Quang N Tran, Roshaunda Tran, Minh Tran Quan, Toan Quan, Minh Tranquan
Phone and address:
2655 Carlo Scimeca Dr, San Jose, CA 95132
(408) 315-3279
Related to:
Danny Danh Tran, 64
Connected to:
Alexandria P Tran, 53Allie T Tran, 52Amber Y Tran, 67Andrew H Tran, 53Angelique H Tran, 53Anh Tran, 58Anton D Tran, 43Augustine N Tran, 34Bea L Tran, 48Beana B Tran, 62

Quan Tran Phones & Addresses

  • 2655 Carlo Scimeca Dr, San Jose, CA 95132 (408) 315-3279
  • Santa Clara, CA
  • Longmont, CO
  • Monroe, NC

Professional Records

Medicine Doctors

Quan Tran Photo 1

Quan D. Tran

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Specialties:
General Surgery
Work:
BayCare Medical Group
4211 Van Dyke Rd STE 200, Lutz, FL 33558
(813) 264-6490 (phone), (813) 443-8143 (fax)
Education:
Medical School
University of Alabama School of Medicine
Graduated: 2001
Procedures:
Bariatric Surgery
Colonoscopy
Endoscopic Retrograde Cholangiopancreatography (ERCP)
Esophageal Dilatation
Gallbladder Removal
Hemorrhoid Procedures
Hernia Repair
Laparoscopic Appendectomy
Laparoscopic Gallbladder Removal
Proctosigmoidoscopy
Small Bowel Resection
Spleen Surgey
Thoracoscopy
Upper Gastrointestinal Endoscopy
Appendectomy
Breast Biopsy
Breast Reduction
Mastectomy
Sigmoidoscopy
Conditions:
Abdominal Hernia
Cholelethiasis or Cholecystitis
Ventral Hernia
Appendicitis
Breast Disorders
Languages:
English
Spanish
Description:
Dr. Tran graduated from the University of Alabama School of Medicine in 2001. He works in Lutz, FL and specializes in General Surgery. Dr. Tran is affiliated with St Josephs Hospital and St Josephs Hospital - North.
Quan Tran Photo 2

Quan T. Tran

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Specialties:
Internal Medicine
Work:
Pinnacle Health Internal Medicine Residency
111 S Front St, Harrisburg, PA 17101
(717) 231-8508 (phone)
Languages:
English
Russian
Spanish
Description:
Dr. Tran works in Harrisburg, PA and specializes in Internal Medicine.
Quan Tran Photo 3

Quan H. Tran

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Specialties:
Chiropractor
Work:
California Pain Center
9475 Heil Ave STE D, Fountain Valley, CA 92708
(714) 775-7700 (phone), (714) 784-7551 (fax)
Languages:
English
Spanish
Vietnamese
Description:
Dr. Tran works in Fountain Valley, CA and specializes in Chiropractor. Dr. Tran is affiliated with Fountain Valley Regional Hospital & Medical Center and Huntington Beach Hospital.

License Records

Quan Lac Tran

License #:
1301090962
Category:
Barber License

Quan Hoang Tran

License #:
1201118179
Category:
Cosmetologist License

Lawyers & Attorneys

Quan Tran Photo 4

Quan Tran - Lawyer

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Specialties:
Criminal Prosecution
ISLN:
913985692
Admitted:
1991
University:
Baruch College of the City University of New York, B.B.A., 1991
Law School:
Pepperdine University, J.D., 1994

Resumes

Resumes

Quan Tran Photo 5

Quan Tran Elk Grove, CA

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Work:
Safeway Pharmacy - Northern California Division
Pleasanton, CA
Oct 2013 to Dec 2014
Regional Pharmacy Manager
Safeway Pharmacy
Concord, CA
Oct 2010 to Oct 2013
Pharmacy Manager
Safeway Pharmacy
Danville, CA
Jun 2009 to Oct 2010
Special-project intern pharmacist
Education:
Touro University - College of Pharmacy
Vallejo, CA
Jun 2010
Doctor of Pharmacy
University of California
Davis, CA
Jun 2006
Bachelor of Science in Microbiology
De Anza College
Cupertino, CA
Jun 2004
Associate in Arts
Quan Tran Photo 6

Quan Tran San Jose, CA

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Work:
Zazzle Inc

Sep 2014 to 2000
Technician
Bizcom Electronics Inc
Milpitas, CA
Sep 2013 to Apr 2014
Assistant Supervisor
Bizcom Electronics Inc
Milpitas, CA
Apr 2013 to Sep 2013
Technician
Ngoc Anh Computing Services

Jan 2009 to Sep 2011
Technician
Education:
San Jose City College-San Jose
San Jose, CA
Jan 2013 to 2000
Industrial & System Engineer
Architecture University of Ho Chi Minh city Viet Nam
Sep 2008 to Dec 2012
Civil Engineer
Troy University
Jan 2009 to Feb 2010
Computer Science

Business Records

Name / Title
Company / Classification
Phones & Addresses
Quan Tran
Owner
Today's Nails
Beauty Shop
260 E 29 St, Loveland, CO 80538
(970) 622-9730
Quan Tran
Manager
Super Quality Cleaners
Garment Press/Cleaner's Agent · Dry Cleaning
1049 E El Camino Real, Sunnyvale, CA 94087
(408) 720-9693
Quan Tran
Cnt Transportations LLC
Door to Door Airport Shuttle Services
966 Glenfinnan Way, San Jose, CA 95122
1840 Senter Rd, San Jose, CA 95112
Quan Tran
Q and L Transportation LLC
Door to Door Airport Shuttle Services
1826 Germaine Ct, San Jose, CA 95122
Quan Tran
Jon Transportation LLC
Airport Shuttle · Shuttle Service · Transportation Services
247 N Capitol Ave, San Jose, CA 95127
2268 Lucretia Ave, San Jose, CA 95122
490 E Hedding St, San Jose, CA 95112
273 Esmeralda Ct, San Jose, CA 95116
Quan B. Tran
VINE AUTO WASH, INC
Quan Tran
Principal
Consolidated Overnight Network
Courier Service · Delivery Service
1660 Delta Ct, Hayward, CA 94544
(510) 324-4201
Quan D. Tran
Pillaroid, LLC
Software and Hardware Consulting
2676 Camino Del Rey, San Jose, CA 95132

Publications

Us Patents

Integrated Circuit Guard Ring Structures

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US Patent:
6509622, Jan 21, 2003
Filed:
Aug 23, 2000
Appl. No.:
09/644639
Inventors:
Qing Ma - San Jose CA
Jin Lee - Palo Alto CA
Quan Tran - San Jose CA
Harry Fujimoto - Sunnyvale CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 27095
US Classification:
257483, 438132, 438215, 438601
Abstract:
An integrated circuit including a die having a circuit area and a plurality of guard rings. The circuit area includes active devices, passive devices, and interconnects connected to form an integrated circuit. The plurality of guard rings includes a plurality of stacked guard rings having substantially equal widths and encircling the circuit area. Alternatively, the plurality of guard rings includes metallization level guard rings interleaved with one or more via level guard rings. Each of the one or more via level guard rings includes one or more guard rings encircling the circuit area. Alternatively, the plurality of guard rings includes a plurality of concentric guard rings encircling the circuit area. Each of the plurality of guard rings is fabricated from a metal, such as aluminum, copper, or silver, or an alloy of aluminum, copper, or silver.

Structure For Reducing Die Corner And Edge Stresses In Microelectronic Packages

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US Patent:
6617682, Sep 9, 2003
Filed:
Sep 28, 2000
Appl. No.:
09/675112
Inventors:
Qing Ma - San Jose CA
Jim Maveety - San Jose CA
Quan Tran - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2334
US Classification:
257706, 257713, 174253
Abstract:
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.

Packaging Microelectromechanical Structures

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US Patent:
6673697, Jan 6, 2004
Filed:
Apr 3, 2002
Appl. No.:
10/114694
Inventors:
Qing Ma - San Jose CA
Valluri Rao - Saratoga CA
Li-Peng Wang - Santa Clara CA
John Heck - Mtn View CA
Quan Tran - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2130
US Classification:
438455, 438456
Abstract:
A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.

Microelectromechanical (Mems) Switching Apparatus

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US Patent:
6686820, Feb 3, 2004
Filed:
Jul 11, 2002
Appl. No.:
10/194096
Inventors:
Qing Ma - San Jose CA
Valluri Rao - Saratoga CA
John Heck - Mtn View CA
Li-Peng Wang - Santa Clara CA
Dong Shim - Framingham MA
Quan Tran - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01P 110
US Classification:
333262, 333258
Abstract:
This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

Structure And Process For Reducing Die Corner And Edge Stresses In Microelectronic Packages

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US Patent:
6794223, Sep 21, 2004
Filed:
Jun 23, 2003
Appl. No.:
10/602137
Inventors:
Qing Ma - San Jose CA
Jim Maveety - San Jose CA
Quan Tran - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2144
US Classification:
438122, 438108, 438126, 438127
Abstract:
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar to that of silicon, is attached to the back side of the die using a heat-conducting adhesive. An epoxy-based material is flowed into the gap between the die, the substrate, and the heat spreader via a through-hole in either the substrate or the heat spreader using a dispense process or a transfer molding process. By positioning the heat spreader to abut the die corners and/or edges, the stresses on the die are substantially reduced or eliminated.

Edge Plated Transmission Line And Switch Integrally Formed Therewith

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US Patent:
6809617, Oct 26, 2004
Filed:
Dec 17, 2002
Appl. No.:
10/322157
Inventors:
Qing Ma - San Jose CA
Joseph Hayden, III - Sunnyvale CA
Quan Tran - Fremont CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01P 308
US Classification:
333238, 333105
Abstract:
Coplanar waveguides have a center signal line and a pair of ground lines on either side formed of a sputtered material such as gold (Au). Such waveguides are subject to what is known as the edge effect at high frequency operation causing currents to concentrate and flow along adjacent edges of the lines. Providing a thicker plated layer only on adjacent edges of the lines provide substantial performance improvements over sputtered lines alone while saving significant amount of Au, thus reducing costs.

Microelectromechanical (Mems) Switching Apparatus

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US Patent:
6812814, Nov 2, 2004
Filed:
Oct 7, 2003
Appl. No.:
10/681550
Inventors:
Qing Ma - San Jose CA
Valluri Rao - Saratoga CA
John Heck - Mtn View CA
Li-Peng Wang - Santa Clara CA
Dong Shim - Framingham MA
Quan Tran - San Jose CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01P 110
US Classification:
333262, 333105, 200181
Abstract:
This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

Packaging Microelectromechanical Structures

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US Patent:
6903452, Jun 7, 2005
Filed:
Aug 19, 2003
Appl. No.:
10/643427
Inventors:
Qing Ma - San Jose CA, US
Valluri Rao - Saratoga CA, US
Li-Peng Wang - Santa Clara CA, US
John Heck - Mtn View CA, US
Quan Tran - San Jose CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L023/02
H01L023/34
H01L023/48
US Classification:
257680, 257724, 257778
Abstract:
A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.
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Quan M Tran from San Jose, CA, age ~47 Get Report